公开(公告)号：US20060243054A1

公开(公告)日：2006-11-02

申请号：US11354959

申请日：2006-02-16

申请人： Kazunori Saito ,  Yuji Ichimura ,  Kei Yamaguchi ,  Katsumichi Ueyanagl ,  Shigeru Shinoda

发明人： Kazunori Saito ,  Yuji Ichimura ,  Kei Yamaguchi ,  Katsumichi Ueyanagl ,  Shigeru Shinoda

IPC分类号： G01L9/00

CPC分类号： G01L19/143 ,  G01L19/0084 ,  G01L19/146 ,  G01L19/147

摘要： A pressure detecting apparatus has a pressure detecting device that converts a strain caused by a stress exerted thereto to an electrical signal, and outputs the converted electrical signal. The apparatus has a housing base including a housing recess that houses the pressure detecting device therein, and a connecting material interposed between the pressure detecting device and the housing recess. The connecting material connects the pressure detecting device and the housing recess with a tensile elongation percentage of about 400% or higher. The pressure detecting apparatus facilitates preventing thermal stress from adversely affecting the detection performance thereof, and produces excellent thermal response.

摘要翻译： 压力检测装置具有压力检测装置，其将施加于其上的应力引起的应变转换为电信号，并输出转换后的电信号。 该装置具有壳体基部，该壳体基部包括容纳凹部，该壳体凹部容纳其中的压力检测装置，以及插入在压力检测装置和壳体凹部之间的连接材料。 连接材料以约400％以上的拉伸伸长率连接压力检测装置和容纳凹部。 压力检测装置有助于防止热应力对其检测性能产生不利影响，并且产生优异的热响应。

公开(公告)号：US07234358B2

公开(公告)日：2007-06-26

申请号：US11354959

申请日：2006-02-16

申请人： Kazunori Saito ,  Yuji Ichimura ,  Kei Yamaguchi ,  Katsumichi Ueyanagi ,  Shigeru Shinoda

发明人： Kazunori Saito ,  Yuji Ichimura ,  Kei Yamaguchi ,  Katsumichi Ueyanagi ,  Shigeru Shinoda

IPC分类号： G01L9/00

CPC分类号： G01L19/143 ,  G01L19/0084 ,  G01L19/146 ,  G01L19/147

摘要： A pressure detecting apparatus has a pressure detecting device that converts a strain caused by a stress exerted thereto to an electrical signal, and outputs the converted electrical signal. The apparatus has a housing base including a housing recess that houses the pressure detecting device therein, and a connecting material interposed between the pressure detecting device and the housing recess. The connecting material connects the pressure detecting device and the housing recess with a tensile elongation percentage of about 400% or higher. The pressure detecting apparatus facilitates preventing thermal stress from adversely affecting the detection performance thereof, and produces excellent thermal response.

摘要翻译： 压力检测装置具有压力检测装置，其将施加于其上的应力引起的应变转换为电信号，并输出转换后的电信号。 该装置具有壳体基部，该壳体基部包括容纳凹部，该壳体凹部容纳其中的压力检测装置，以及插入在压力检测装置和壳体凹部之间的连接材料。 连接材料以约400％以上的拉伸伸长率连接压力检测装置和容纳凹部。 压力检测装置有助于防止热应力对其检测性能产生不利影响，并且产生优异的热响应。

公开(公告)号：US5837336A

公开(公告)日：1998-11-17

申请号：US753419

申请日：1996-11-25

申请人： Yuji Ichimura ,  Tatsuo Fujii

发明人： Yuji Ichimura ,  Tatsuo Fujii

IPC分类号： B65D75/62 ,  B65D65/26 ,  B65D65/32 ,  B65D75/00 ,  B65D75/58 ,  B65D75/60 ,  B65D85/575 ,  B65D65/10

CPC分类号： B65D75/002 ,  B65D75/5855 ,  Y10S206/813 ,  Y10S428/913 ,  Y10T428/1328 ,  Y10T428/1331 ,  Y10T428/24802 ,  Y10T428/24826 ,  Y10T428/24843 ,  Y10T428/24942

摘要： A film-wrapped article consisting of a rectangular product wrapped with a heat-shrinkable plastic film in intimate contact therewith, the upper and under edge portions of the film being overlapped and sealed together along the body of the wrap to form a seal. A part of the seal on one side of the article is formed as a weakly joined zone whose adhesion strength increases by continuous or stepwise gradations from an opening zone where the adhesion strength is the lowest toward the both ends of the article. The weakly joined zone is made up of joined and unjoined regions extending along the interface between the upper and under edge portions, in a repetitive pattern of the regions varying in adhesion strength with changes in the area ratio of the joined and unjoined regions. The wrap has a cut for unwrapping use made in the opening or neighboring zone of the upper edge portion.

摘要翻译： 一种薄膜包装的物品，由长方形的产品组成，其中包裹着与其紧密接触的热收缩塑料薄膜，薄膜的上边缘和下边缘部分沿着包裹体重叠并密封在一起形成密封。 制品的一侧上的密封件的一部分形成为弱接合区域，其粘合强度通过从粘合强度最低的制品的两端的开口区域的连续或逐步渐变而增加。 弱接合区域由沿着上边缘部分和下边缘部分之间的界面延伸的接合区域和未连接区域以与接合区域和未连接区域的面积比变化相关联的粘合强度变化的区域的重复图案组成。 包裹物具有用于在上边缘部分的开口或相邻区域中形成的展开用的切口。

公开(公告)号：US5606200A

公开(公告)日：1997-02-25

申请号：US180481

申请日：1994-01-12

申请人： Kouichi Haraguchi ,  Yuji Ichimura

发明人： Kouichi Haraguchi ,  Yuji Ichimura

IPC分类号： H01L23/28 ,  H01L23/04 ,  H01L23/06 ,  H01L23/24 ,  H01L23/22 ,  H01L23/053 ,  H01L23/48

CPC分类号： H01L23/06 ,  H01L23/04 ,  H01L23/24 ,  H01L2924/0002

摘要： A resin sealed semiconductor device includes a metallic base plate and a covering case adhered to a peripheral section of the metallic base plate. Semiconductor elements are loaded on the metallic base plate, and lead-out terminals extend from an upper surface of a terminal-supporting plate made to adhere to lead-out terminals. The terminal-supporting plate forms an upper surface of the covering case 5 which is filled with a sealing resin. Uneven stripes are molded and extend circumferentially over the entire outer peripheral surface of terminal-supporting plate to roughen the peripheral surface, and the adhesion strength is reinforced by increasing the adhesive area between the terminal-supporting plate and the sealing resin.

摘要翻译： 树脂密封半导体器件包括金属基板和粘附到金属基板的周边部分的覆盖壳体。 半导体元件装载在金属基板上，引出端子从制造的端子支撑板的上表面延伸到引出端子。 端子支撑板形成填充有密封树脂的覆盖壳体5的上表面。 不均匀的条纹被模制并且在端子支撑板的整个外周表面周向延伸以使外周表面粗糙化，并且通过增加端子支撑板和密封树脂之间的粘合剂面积来增强粘附强度。