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12 条记录 (耗时 0.016 秒)

    Oil-in-water emulsion and use thereof as metal processing oil or the like
    1.
    发明授权
    Oil-in-water emulsion and use thereof as metal processing oil or the like 失效
    水包油乳液及其作为金属加工油等的用途

    公开(公告)号：US4749504A

    公开(公告)日：1988-06-07

    申请号：US907010

    申请日：1986-09-15

    申请人： Kazuo Aihara ,  Atsushi Deguchi ,  Tatsuo Kinoshita

    发明人： Kazuo Aihara ,  Atsushi Deguchi ,  Tatsuo Kinoshita

    IPC分类号： C08J3/03 ,  C10M173/02 ,  C10M173/00 ,  C10M145/02

    CPC分类号： C08J3/03 ,  C10M173/02 ,  C08J2323/16 ,  C08J2351/00 ,  C10M2205/00 ,  C10M2205/022 ,  C10M2205/024 ,  C10M2205/026 ,  C10M2205/028 ,  C10M2209/08 ,  C10M2209/082 ,  C10M2209/084 ,  C10M2209/086 ,  C10N2220/02 ,  C10N2240/40 ,  C10N2240/401 ,  C10N2250/02

    摘要： An oil-in-water emulsion of at least one polymer selected from the group consisting of(A) an ethylene/alpha-olefin random copolymer having(1) an ethylene content of 30 to 70 moles %,(2) a number average molecular weight (Mn) of 500 to 10,000, and(3) a weight average molecular weight (Mw) to number average molecular weight (Mn) ratio (Q=Mw/Mn), of 3 at most, and(4) being liquid at ordinary temperatures, and(B) a graft-modified ethylene/alpha-olefin copolymer(1') comprising said ethylene/alpha-olefin copolymer having the characteristics (1) to (4) as a trunk polymer, and(2') at least one grafted unit selected from a unit derived from an unsaturated carboxylic acid or its acid anhydride and a unit resulting from neutralization of at least a part of said unit with an alkali, and(3') being liquid or semisolid at ordinary temperatures.

    摘要翻译： 一种选自（A）乙烯/α-烯烃无规共聚物中的至少一种聚合物的水包油乳液，其具有（1）乙烯含量为30-70摩尔％，（2）数均分子量 重量（Mn）为500〜10,000，（3）重均分子量（Mw）至数均分子量（Mn）比（Q = Mw / Mn）为3以下，（4） 常规温度，和（B）包含具有特征（1）至（4）作为主体聚合物的所述乙烯/α-烯烃共聚物的接枝改性的乙烯/α-烯烃共聚物（1'）和（2'） 至少一个选自不饱和羧酸或其酸酐的单元的接枝单元和由碱中和至少一部分所述单元而得到的单元，和（3'）在常温下为液体或半固体。

    Manufacturing method for printed wiring board
    4.
    发明授权
    Manufacturing method for printed wiring board 有权
    印刷电路板的制造方法

    公开(公告)号：US09113562B2

    公开(公告)日：2015-08-18

    申请号：US13427330

    申请日：2012-03-22

    申请人： Hideo Mizutani ,  Toshiyuki Matsui ,  Atsushi Deguchi

    发明人： Hideo Mizutani ,  Toshiyuki Matsui ,  Atsushi Deguchi

    IPC分类号： H05K3/02 ,  H05K3/10 ,  H05K3/06 ,  H05K3/46

    CPC分类号： H05K3/108 ,  H05K3/067 ,  H05K3/4661 ,  H05K2203/0369 ,  H05K2203/0597 ,  H05K2203/122 ,  H05K2203/124 ,  H05K2203/1476 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49156 ,  Y10T29/49165

    摘要： A manufacturing method for a printed wiring board includes forming an electroless plated film on an interlayer resin insulation layer, forming on the electroless plated film a plating resist with an opening to expose a portion of the electroless plated film, forming an electrolytic plated film on the portion of the electroless plated film exposed through the opening, removing the plating resist using a resist-removing solution containing an amine, reducing a thickness of a portion of the electroless plated film existing between adjacent portions of the electrolytic plated film by using the resist-removing solution, and forming a conductive pattern by removing the portion of the electroless plated film existing between the adjacent portions of the electrolytic plated film by using an etchant.

    摘要翻译： 一种印刷电路板的制造方法，包括在层间树脂绝缘层上形成无电解电镀膜，在所述无电解电镀膜上形成具有开口的电镀抗蚀剂，露出所述无电镀膜的一部分，在所述电镀膜上形成电解电镀膜 通过开口露出的无电解电镀膜的一部分，使用含有胺的抗蚀剂去除溶液除去电镀抗蚀剂，通过使用抗蚀剂层，减少存在于电解电镀膜的相邻部分之间的部分无电解电镀膜的厚度， 通过使用蚀刻剂除去存在于电解电镀膜的相邻部分之间的无电解电镀膜的部分，形成导电图案。

    Manufacturing method for printed wiring board
    7.
    发明授权
    Manufacturing method for printed wiring board 有权
    印刷电路板的制造方法

    公开(公告)号：US08161637B2

    公开(公告)日：2012-04-24

    申请号：US12771602

    申请日：2010-04-30

    申请人： Hideo Mizutani ,  Toshiyuki Matsui ,  Atsushi Deguchi

    发明人： Hideo Mizutani ,  Toshiyuki Matsui ,  Atsushi Deguchi

    IPC分类号： H01K3/10

    CPC分类号： H05K3/108 ,  H05K3/067 ,  H05K3/4661 ,  H05K2203/0369 ,  H05K2203/0597 ,  H05K2203/122 ,  H05K2203/124 ,  H05K2203/1476 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49156 ,  Y10T29/49165

    摘要： A manufacturing method for a printed wiring board includes forming an electroless plated film on an interlayer resin insulation layer, forming on the electroless plated film a plating resist with an opening to expose a portion of the electroless plated film, forming an electrolytic plated film on the portion of the electroless plated film exposed through the opening, removing the plating resist using a resist-removing solution containing an amine, reducing a thickness of a portion of the electroless plated film existing between adjacent portions of the electrolytic plated film by using the resist-removing solution, and forming a conductive pattern by removing the portion of the electroless plated film existing between the adjacent portions of the electrolytic plated film by using an etchant.

    摘要翻译： 一种印刷电路板的制造方法，包括在层间树脂绝缘层上形成无电解电镀膜，在所述无电解电镀膜上形成具有开口的电镀抗蚀剂，露出所述无电镀膜的一部分，在所述电镀膜上形成电解电镀膜 通过开口露出的无电解电镀膜的一部分，使用含有胺的抗蚀剂去除溶液除去电镀抗蚀剂，通过使用抗蚀剂层，减小存在于电解电镀膜的相邻部分之间的部分无电解电镀膜的厚度， 通过使用蚀刻剂除去存在于电解电镀膜的相邻部分之间的无电解电镀膜的部分，形成导电图案。