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    Scribing method for brittle materials, a cutter wheel used therefor and an apparatus provided therewith
    3.
    发明授权
    Scribing method for brittle materials, a cutter wheel used therefor and an apparatus provided therewith 失效
    用于脆性材料的划线方法，用于其的切割轮以及与其一起提供的装置

    公开(公告)号：US06796212B2

    公开(公告)日：2004-09-28

    申请号：US09924465

    申请日：2001-08-09

    申请人： Kazuya Maekawa ,  Haruo Wakayama

    发明人： Kazuya Maekawa ,  Haruo Wakayama

    IPC分类号： B26D308

    CPC分类号： C03B33/107 ,  Y10T83/0385 ,  Y10T83/9403

    摘要： A cutter wheel for brittle materials includes a disk with two side planes and an outer peripheral portion between the planes. The outer peripheral portion includes two bevel portions and a ridge portion between the bevel portions. The ridge portion has a plurality of peaks aligned along a circumferential line. For example, the ridge portion includes a straight line connecting two adjacent peaks in the plurality of peaks. Alternatively, the ridge portion is a depression between two adjacent peaks in the plurality of peaks, and the depth of the depression is deeper than the straight line connecting the two adjacent peaks. Preferably, the peaks are spaced apart at an equal distance.

    摘要翻译： 用于脆性材料的切割轮包括具有两个侧面的盘和在该平面之间的外周部分。 外周部包括两个斜面部和斜边部之间的脊部。 脊部具有沿圆周线排列的多个峰。 例如，脊部包括连接多个峰中的两个相邻峰的直线。 或者，脊部是多个峰中的两个相邻峰之间的凹陷，并且凹陷的深度比连接两个相邻峰的直线更深。 优选地，峰以相等的距离间隔开。

    Scribing wheel for brittle material and manufacturing method for same, as well as scribing method, scribing apparatus and scribing tool using the same
    5.
    发明申请
    Scribing wheel for brittle material and manufacturing method for same, as well as scribing method, scribing apparatus and scribing tool using the same 有权
    用于脆性材料的划线轮及其制造方法，以及划线方法，划线装置和使用其的划线工具

    公开(公告)号：US20090078105A1

    公开(公告)日：2009-03-26

    申请号：US11988193

    申请日：2006-07-06

    申请人： Kazuya Maekawa ,  Haruo Wakayama

    发明人： Kazuya Maekawa ,  Haruo Wakayama

    IPC分类号： B26D3/08 ,  B26D1/12 ,  B23P17/04

    CPC分类号： B28D1/225 ,  C03B33/033 ,  C03B33/07 ,  C03B33/107 ,  Y10T29/49 ,  Y10T83/0385 ,  Y10T83/9403 ,  Y10T225/12 ,  Y10T225/321

    摘要： A scribing wheel for a brittle material, comprising: an outer peripheral portion around which a circumference ridgeline is formed, where two truncated cones have connected bottoms so as to share the same rotational axis; and a number of alternating notches and protrusions which are formed in the direction of the circumference along the above described circumference ridgeline, wherein the above described protrusions are formed of portions of the above described circumference ridgeline which remain after the above described circumference ridge line is notched and have a length in the direction of the circumference so that a scribe line is drawn on the above described brittle material substrate and a vertical crack extending from the scribe line in the direction of the thickness of a brittle material substrate is formed when the scribing wheel is rotated in such a state as to be pressed against the above described brittle material substrate, wherein the length of the notches in the direction of the circumference is shorter than the length of the above described protrusions in the direction of the circumference, so that the bite (catch) on the surface of glass is improved, while lowering the high penetrability.

    摘要翻译： 1.一种脆性材料用划线轮，其特征在于，包括：外周部，形成有圆周棱线，其中两个截锥体具有连接的底部以共享相同的旋转轴线; 以及沿着上述圆周棱线沿圆周方向形成的多个交替的凹口和凸起，其中上述突起由上述圆周脊线的部分形成，上述圆周脊线在上述圆周脊线被切口之后残留 并且在圆周方向上具有长度，使得在上述脆性材料基板上划出划线，并且当划线轮形成从脆性材料基板的厚度方向上从划线延伸的垂直裂纹 在上述脆性材料基板上被按压的状态旋转，其中，在圆周方向上的切口长度比上述突起的周长方向的长度短， 在玻璃表面的咬（抓）改善，同时降低高透明度 亲爱的

    Cutter Wheel, Manufacturing Method for Same, Manual Scribing Tool and Scribing Device
    8.
    发明申请
    Cutter Wheel, Manufacturing Method for Same, Manual Scribing Tool and Scribing Device 有权
    切割轮，相同的制造方法，手动划线工具和划线装置

    公开(公告)号：US20080022834A1

    公开(公告)日：2008-01-31

    申请号：US11572154

    申请日：2005-07-15

    申请人： Haruo Wakayama ,  Tetsuji Shiozawa ,  Takashi Sekijima ,  Noriyuki Ogasawara ,  Hiroshi Soyama

    发明人： Haruo Wakayama ,  Tetsuji Shiozawa ,  Takashi Sekijima ,  Noriyuki Ogasawara ,  Hiroshi Soyama

    IPC分类号： B26D3/06 ,  C03B33/10

    CPC分类号： C03B33/107 ,  B28D1/225 ,  B28D1/24 ,  C03B33/033 ,  Y02P40/57 ,  Y10T83/0333 ,  Y10T83/0341 ,  Y10T83/0385

    摘要： A cutter wheel for scribing a brittle material substrate having excellent biting in the surface of the brittle material substrate when the brittle material substrate used for a liquid crystal display panel or the like is cut and a method for manufacturing the cutter wheel with high productivity are provided. The cutter wheel made of a hard metal or sintered diamond is formed in such a manner that a V-shaped ridge line part is formed as an edge along the circumferential part of a disk-like wheel, and at least one notch is engraved in the above described ridge line part and notches as that described above are formed in the entirety of the periphery of the above described ridge line part at a pitch of more than 200 μm.

    摘要翻译： 当切割用于液晶显示面板等的脆性材料基板时，在脆性材料基板的表面上具有优异的咬合性的脆性材料基板的切割轮和用于制造高效率的切割轮的方法 。 由硬金属或烧结金刚石制成的切割轮以这样的方式形成：V形脊线部分沿着圆盘状轮的圆周部分形成为边缘，并且至少一个切口刻在 上述脊线部分和上述凹口以上述脊线部分的整个周边以大于200μm的间距形成。

    Scribe line forming device and scribe line forming method
    9.
    发明授权
    Scribe line forming device and scribe line forming method 失效
    划线生成装置和划线形成方法

    公开(公告)号：US08348115B2

    公开(公告)日：2013-01-08

    申请号：US10533650

    申请日：2003-11-04

    申请人： Haruo Wakayama

    发明人： Haruo Wakayama

    IPC分类号： B26F3/00

    CPC分类号： C03B33/093 ,  B23K26/40 ,  B23K2103/50 ,  C03B33/027 ,  C03B33/091 ,  Y10T83/0341 ,  Y10T225/12 ,  Y10T225/321

    摘要： A vertical crack is generated at a desired position on a brittle material substrate S by making a wheel tip 5a of a glass cutter 5 move while being in contact with the substrate surface by a load which does not allow the wheel tip 5a to damage the surface, using an armature 6 applying an abrupt impact force for generating the vertical crack having a predetermined depth, to the glass cutter 5 moving on the substrate. A scribe line is formed as the vertical crack is urged to extend along a planned scribe line, due to a stress gradient exerted onto the vertical crack and occurring between a compressive stress in an irradiation area on the substrate at which a laser beam is irradiated from a laser beam oscillator 8 and a tensile stress in a cooling area made by a cooling medium released from a cooling nozzle 7.

    摘要翻译： 在脆性材料基板S上的期望位置产生垂直裂纹，通过使玻璃切割器5的轮胎末端5a与基板表面接触而移动，该载荷不允许轮胎末端5a损伤表面 使用施加突然冲击力的电枢6将具有预定深度的垂直裂纹施加到在基板上移动的玻璃切割器5。 由于施加在垂直裂纹上的应力梯度，在沿着激光束照射的基板上的照射区域中的压缩应力之间发生垂直裂纹，因此垂直裂纹被推动沿着计划划线延伸，形成划痕线 激光束振荡器8和由从冷却喷嘴7释放的冷却介质制成的冷却区域中的拉伸应力。

    Scribe line forming device and scribe line forming method
    10.
    发明申请
    Scribe line forming device and scribe line forming method 失效
    划线生成装置和划线形成方法

    公开(公告)号：US20060137505A1

    公开(公告)日：2006-06-29

    申请号：US10533650

    申请日：2003-11-04

    申请人： Haruo Wakayama

    发明人： Haruo Wakayama

    IPC分类号： B26D3/08

    CPC分类号： C03B33/093 ,  B23K26/40 ,  B23K2103/50 ,  C03B33/027 ,  C03B33/091 ,  Y10T83/0341 ,  Y10T225/12 ,  Y10T225/321

    摘要： A vertical crack is generated at a desired position on a brittle material substrate S by making a wheel tip 5a of a glass cutter 5 move while being in contact with the substrate surface by a load which does not allow the wheel tip 5a to damage the surface, using an armature 6 applying an abrupt impact force for generating the vertical crack having a predetermined depth, to the glass cutter 5 moving on the substrate. A scribe line is formed as the vertical crack is urged to extend along a planned scribe line, due to a stress gradient exerted onto the vertical crack and occurring between a compressive stress in an irradiation area on the substrate at which a laser beam is irradiated from a laser beam oscillator 8 and a tensile stress in a cooling area made by a cooling medium released from a cooling nozzle 7.

    摘要翻译： 在脆性材料基板S上的期望位置产生垂直裂纹，通过使玻璃切割器5的轮胎端部5a与基板表面接触而移动，该负载不允许轮胎尖端5a损坏 使用电枢6施加用于产生具有预定深度的垂直裂纹的突然冲击力的玻璃切割器5移动到基板上。 由于施加在垂直裂纹上的应力梯度，在沿着激光束照射的基板上的照射区域中的压缩应力之间发生垂直裂纹，因此垂直裂纹被推动沿着计划划线延伸，形成划痕线 激光束振荡器8和由从冷却喷嘴7释放的冷却介质制成的冷却区域中的拉伸应力。