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    Scribe line forming device and scribe line forming method
    4.
    发明授权
    Scribe line forming device and scribe line forming method 失效
    划线生成装置和划线形成方法

    公开(公告)号：US08348115B2

    公开(公告)日：2013-01-08

    申请号：US10533650

    申请日：2003-11-04

    申请人： Haruo Wakayama

    发明人： Haruo Wakayama

    IPC分类号： B26F3/00

    CPC分类号： C03B33/093 ,  B23K26/40 ,  B23K2103/50 ,  C03B33/027 ,  C03B33/091 ,  Y10T83/0341 ,  Y10T225/12 ,  Y10T225/321

    摘要： A vertical crack is generated at a desired position on a brittle material substrate S by making a wheel tip 5a of a glass cutter 5 move while being in contact with the substrate surface by a load which does not allow the wheel tip 5a to damage the surface, using an armature 6 applying an abrupt impact force for generating the vertical crack having a predetermined depth, to the glass cutter 5 moving on the substrate. A scribe line is formed as the vertical crack is urged to extend along a planned scribe line, due to a stress gradient exerted onto the vertical crack and occurring between a compressive stress in an irradiation area on the substrate at which a laser beam is irradiated from a laser beam oscillator 8 and a tensile stress in a cooling area made by a cooling medium released from a cooling nozzle 7.

    摘要翻译： 在脆性材料基板S上的期望位置产生垂直裂纹，通过使玻璃切割器5的轮胎末端5a与基板表面接触而移动，该载荷不允许轮胎末端5a损伤表面 使用施加突然冲击力的电枢6将具有预定深度的垂直裂纹施加到在基板上移动的玻璃切割器5。 由于施加在垂直裂纹上的应力梯度，在沿着激光束照射的基板上的照射区域中的压缩应力之间发生垂直裂纹，因此垂直裂纹被推动沿着计划划线延伸，形成划痕线 激光束振荡器8和由从冷却喷嘴7释放的冷却介质制成的冷却区域中的拉伸应力。

    Scribe line forming device and scribe line forming method
    6.
    发明申请
    Scribe line forming device and scribe line forming method 失效
    划线生成装置和划线形成方法

    公开(公告)号：US20060137505A1

    公开(公告)日：2006-06-29

    申请号：US10533650

    申请日：2003-11-04

    申请人： Haruo Wakayama

    发明人： Haruo Wakayama

    IPC分类号： B26D3/08

    CPC分类号： C03B33/093 ,  B23K26/40 ,  B23K2103/50 ,  C03B33/027 ,  C03B33/091 ,  Y10T83/0341 ,  Y10T225/12 ,  Y10T225/321

    摘要： A vertical crack is generated at a desired position on a brittle material substrate S by making a wheel tip 5a of a glass cutter 5 move while being in contact with the substrate surface by a load which does not allow the wheel tip 5a to damage the surface, using an armature 6 applying an abrupt impact force for generating the vertical crack having a predetermined depth, to the glass cutter 5 moving on the substrate. A scribe line is formed as the vertical crack is urged to extend along a planned scribe line, due to a stress gradient exerted onto the vertical crack and occurring between a compressive stress in an irradiation area on the substrate at which a laser beam is irradiated from a laser beam oscillator 8 and a tensile stress in a cooling area made by a cooling medium released from a cooling nozzle 7.

    摘要翻译： 在脆性材料基板S上的期望位置产生垂直裂纹，通过使玻璃切割器5的轮胎端部5a与基板表面接触而移动，该负载不允许轮胎尖端5a损坏 使用电枢6施加用于产生具有预定深度的垂直裂纹的突然冲击力的玻璃切割器5移动到基板上。 由于施加在垂直裂纹上的应力梯度，在沿着激光束照射的基板上的照射区域中的压缩应力之间发生垂直裂纹，因此垂直裂纹被推动沿着计划划线延伸，形成划痕线 激光束振荡器8和由从冷却喷嘴7释放的冷却介质制成的冷却区域中的拉伸应力。

    Method for forming a scribe line on a semiconductor device and an apparatus for forming the scribe line
    7.
    发明授权
    Method for forming a scribe line on a semiconductor device and an apparatus for forming the scribe line 失效
    在半导体器件上形成划线的方法和用于形成划线的装置

    公开(公告)号：US07015118B2

    公开(公告)日：2006-03-21

    申请号：US10483353

    申请日：2002-10-28

    申请人： Haruo Wakayama

    发明人： Haruo Wakayama

    IPC分类号： H01L21/78

    CPC分类号： H01L23/544 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/50 ,  B28D1/221 ,  B28D5/00 ,  B28D5/0064 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2223/54453 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A silicon wafer 50 including a plurality of semiconductor devices patterned on a top surface thereof as a result of a wafer production process is prepared. A transparent film is applied on the top surface of the semiconductor wafer 50 so as to cover all the plurality of semiconductor devices. The semiconductor wafer with the transparent film is placed on a rotatable table 26 such that a rear surface of the semiconductor wafer not covered with the transparent film is facing up away from the rotatable table 26. The rear surface of the semiconductor wafer 50 is heated with a laser beam to form a laser spot, along a scribe line formation line for dividing the semiconductor wafer into a plurality of semiconductor chips, to a temperature lower than a softening point of the semiconductor wafer, while an area close to the laser spot is continuously cooled along the scribe line formation line.

    摘要翻译： 准备了包括由晶片制造工艺的结果在其顶表面上构图的多个半导体器件的硅晶片50。 在半导体晶片50的上表面上涂敷透明膜，以覆盖所有多个半导体器件。 具有透明膜的半导体晶片被放置在可旋转台26上，使得未被透明膜覆盖的半导体晶片的后表面朝向远离可旋转台26的上方。半导体晶片50的后表面被加热 沿着用于将半导体晶片分割为多个半导体芯片的划线生成线形成激光束至激光点附近的区域的激光束至低于半导体晶片的软化点的温度 沿划线形成线冷却。

    Cutter Wheel, Manufacturing Method for Same, Manual Scribing Tool and Scribing Device
    9.
    发明申请
    Cutter Wheel, Manufacturing Method for Same, Manual Scribing Tool and Scribing Device 有权
    切割轮，相同的制造方法，手动划线工具和划线装置

    公开(公告)号：US20080022834A1

    公开(公告)日：2008-01-31

    申请号：US11572154

    申请日：2005-07-15

    申请人： Haruo Wakayama ,  Tetsuji Shiozawa ,  Takashi Sekijima ,  Noriyuki Ogasawara ,  Hiroshi Soyama

    发明人： Haruo Wakayama ,  Tetsuji Shiozawa ,  Takashi Sekijima ,  Noriyuki Ogasawara ,  Hiroshi Soyama

    IPC分类号： B26D3/06 ,  C03B33/10

    CPC分类号： C03B33/107 ,  B28D1/225 ,  B28D1/24 ,  C03B33/033 ,  Y02P40/57 ,  Y10T83/0333 ,  Y10T83/0341 ,  Y10T83/0385

    摘要： A cutter wheel for scribing a brittle material substrate having excellent biting in the surface of the brittle material substrate when the brittle material substrate used for a liquid crystal display panel or the like is cut and a method for manufacturing the cutter wheel with high productivity are provided. The cutter wheel made of a hard metal or sintered diamond is formed in such a manner that a V-shaped ridge line part is formed as an edge along the circumferential part of a disk-like wheel, and at least one notch is engraved in the above described ridge line part and notches as that described above are formed in the entirety of the periphery of the above described ridge line part at a pitch of more than 200 μm.

    摘要翻译： 当切割用于液晶显示面板等的脆性材料基板时，在脆性材料基板的表面上具有优异的咬合性的脆性材料基板的切割轮和用于制造高效率的切割轮的方法 。 由硬金属或烧结金刚石制成的切割轮以这样的方式形成：V形脊线部分沿着圆盘状轮的圆周部分形成为边缘，并且至少一个切口刻在 上述脊线部分和上述凹口以上述脊线部分的整个周边以大于200μm的间距形成。

    Scribing method for brittle materials, a cutter wheel used therefor and an apparatus provided therewith
    10.
    发明授权
    Scribing method for brittle materials, a cutter wheel used therefor and an apparatus provided therewith 失效
    用于脆性材料的划线方法，用于其的切割轮以及与其一起提供的装置

    公开(公告)号：US06796212B2

    公开(公告)日：2004-09-28

    申请号：US09924465

    申请日：2001-08-09

    申请人： Kazuya Maekawa ,  Haruo Wakayama

    发明人： Kazuya Maekawa ,  Haruo Wakayama

    IPC分类号： B26D308

    CPC分类号： C03B33/107 ,  Y10T83/0385 ,  Y10T83/9403

    摘要： A cutter wheel for brittle materials includes a disk with two side planes and an outer peripheral portion between the planes. The outer peripheral portion includes two bevel portions and a ridge portion between the bevel portions. The ridge portion has a plurality of peaks aligned along a circumferential line. For example, the ridge portion includes a straight line connecting two adjacent peaks in the plurality of peaks. Alternatively, the ridge portion is a depression between two adjacent peaks in the plurality of peaks, and the depth of the depression is deeper than the straight line connecting the two adjacent peaks. Preferably, the peaks are spaced apart at an equal distance.

    摘要翻译： 用于脆性材料的切割轮包括具有两个侧面的盘和在该平面之间的外周部分。 外周部包括两个斜面部和斜边部之间的脊部。 脊部具有沿圆周线排列的多个峰。 例如，脊部包括连接多个峰中的两个相邻峰的直线。 或者，脊部是多个峰中的两个相邻峰之间的凹陷，并且凹陷的深度比连接两个相邻峰的直线更深。 优选地，峰以相等的距离间隔开。