公开(公告)号：US08207654B2

公开(公告)日：2012-06-26

申请号：US12690382

申请日：2010-01-20

申请人： Kazuyoshi Sugama ,  Masashi Numata ,  Shuji Yamane

发明人： Kazuyoshi Sugama ,  Masashi Numata ,  Shuji Yamane

IPC分类号： H01L41/053

CPC分类号： H03H9/1021 ,  Y10T29/42

摘要： A piezoelectric oscillator is provided, which has a through electrode providing reliable conduction between a piezoelectric vibrating piece and an external electrode with rare occurrence of a large stress caused by temperature variation in processing or deformation of a mounted base substrate, while the hermeticity of a cavity is maintained. A piezoelectric oscillator having a piezoelectric vibrating piece sealed in a cavity defined between a base substrate and a lid substrate includes a through electrode disposed in a through hole penetrating through the base substrate, and the through electrode has a glass frit filled in the through hole and fired and a core formed of a material containing only iron and nickel and disposed in the through hole together with the glass frit. The values of the thermal expansion coefficients of the base substrate, the glass frit, and the core are set as: base substrate glass≧frit>core.

摘要翻译： 提供一种压电振荡器，其具有通过电极提供压电振动片和外部电极之间的可靠的导通，并且极少发生由于安装的基底基板的加工或变形的温度变化引起的大的应力，而空腔的气密性 被维护。 一种压电振动器，其具有密封在基底基板和盖基板之间的空腔中的压电振动片，其特征在于，具备贯通所述基底基板的通孔，所述贯通电极具有填充在所述通孔内的玻璃料， 并且由仅含有铁和镍的材料形成的芯和玻璃料一起设置在通孔中。 基底，玻璃料和芯的热膨胀系数的值被设定为：基底玻璃玻璃料芯。

公开(公告)号：US20100181872A1

公开(公告)日：2010-07-22

申请号：US12690382

申请日：2010-01-20

申请人： Kazuyoshi Sugama ,  Masashi Numata ,  Shuji Yamane

发明人： Kazuyoshi Sugama ,  Masashi Numata ,  Shuji Yamane

IPC分类号： H01L41/053 ,  H01L41/22

CPC分类号： H03H9/1021 ,  Y10T29/42

摘要： A piezoelectric oscillator is provided, which has a through electrode providing reliable conduction between a piezoelectric vibrating piece and an external electrode with rare occurrence of a large stress caused by temperature variation in processing or deformation of a mounted base substrate, while the hermeticity of a cavity is maintained. A piezoelectric oscillator having a piezoelectric vibrating piece sealed in a cavity defined between a base substrate and a lid substrate includes a through electrode disposed in a through hole penetrating through the base substrate, and the through electrode has a glass frit filled in the through hole and fired and a core formed of a material containing only iron and nickel and disposed in the through hole together with the glass frit. The values of the thermal expansion coefficients of the base substrate, the glass frit, and the core are set as: base substrate glass≧frit>core.

摘要翻译： 提供一种压电振荡器，其具有通过电极提供压电振动片和外部电极之间的可靠的导通，并且极少发生由于安装的基底基板的加工或变形的温度变化引起的大的应力，而空腔的气密性 被维护。 一种压电振动器，其具有密封在基底基板和盖基板之间的空腔中的压电振动片，其特征在于，具备贯通所述基底基板的通孔，所述贯通电极具有填充在所述通孔内的玻璃料， 并且由仅含有铁和镍的材料形成的芯和玻璃料一起设置在通孔中。 基底，玻璃料和芯的热膨胀系数的值被设定为：基底玻璃玻璃料芯。

公开(公告)号：US08601656B2

公开(公告)日：2013-12-10

申请号：US13175189

申请日：2011-07-01

申请人： Yoichi Funabiki ,  Masashi Numata ,  Kazuyoshi Sugama

发明人： Yoichi Funabiki ,  Masashi Numata ,  Kazuyoshi Sugama

IPC分类号： H03H9/21 ,  H03H9/10

CPC分类号： H03H9/21 ,  H01L2924/0002 ,  H03H9/1021 ,  Y10T29/42 ,  Y10T29/49126 ,  Y10T29/49165 ,  H01L2924/00

摘要： A method of manufacturing a piezoelectric vibrator according to the invention is a method of manufacturing a piezoelectric vibrator in which a piezoelectric vibrating reed is sealed in a cavity formed between a base substrate and a lid substrate bonded to each other, the method including the steps of: inserting a core portion of a conductive rivet member, which includes a planar head portion and the core portion extending in a direction vertically to the surface of the head portion, into a penetration hole of the base substrate and bringing the head portion of the rivet member into contact with a first surface of the base substrate; attaching a laminate material having elastic properties to the first surface of the base substrate so as to cover the head portion; applying a paste-like glass frit on a second surface of the base substrate and filling the glass frit in the penetration hole; and baking and curing the glass frit.

摘要翻译： 根据本发明的制造压电振动器的方法是一种压电振动器的制造方法，其中压电振动片被密封在形成在彼此接合的基底基板和盖基板之间的空腔中，该方法包括以下步骤： 插入导电铆钉构件的芯部，其包括平面头部部分和沿着与头部部分表面垂直的方向延伸的芯部部分到基底基板的穿透孔中并使铆钉的头部部分 构件与所述基底基板的第一表面接触; 将具有弹性的层压材料附着到所述基底基板的第一表面以覆盖所述头部; 在基底基板的第二表面上涂敷糊状玻璃料并将玻璃料填充到穿透孔中; 并烘烤和固化玻璃料。

公开(公告)号：US20120206998A1

公开(公告)日：2012-08-16

申请号：US13361115

申请日：2012-01-30

申请人： Masashi Numata ,  Kazuyoshi Sugama

发明人： Masashi Numata ,  Kazuyoshi Sugama

IPC分类号： H01L41/053 ,  C09J5/00 ,  B29C65/18 ,  H03B5/36 ,  G04C11/02

CPC分类号： G04R20/10 ,  H01L2924/16152 ,  H03H9/0519 ,  H03H9/1021 ,  H03H2003/026 ,  H03H2003/0478

摘要： An anodic bonding apparatus includes a first intermediate member that is disposed between an upper surface (an outer surface) of a lead substrate wafer and a first heater, has heat conductivity, and can be flexible; and a second intermediate member that is disposed between a lower surface (an outer surface) of a base substrate wafer and a second heater, has conductivity and heat conductivity, and can be flexible, wherein the first intermediate member is formed so that a central portion thereof bulges toward the base substrate wafer further than a periphery portion thereof, and the second intermediate member is formed so that a central portion thereof bulges toward the lead substrate wafer further than a periphery portion thereof, and, the first intermediate member and the second intermediate member are evenly deformed.

摘要翻译： 阳极接合装置包括设置在引线基板晶片的上表面（外表面）和第一加热器之间的第一中间部件，具有导热性，并且可以是柔性的; 以及设置在基底晶片的下表面（外表面）和第二加热器之间的第二中间部件，具有导电性和导热性，并且可以是柔性的，其中第一中间部件形成为使得中心部分 所述第二中间部件比其周边部分朝向所述基板基板晶圆更大地凸出，并且所述第二中间部件形成为使得其中央部分比其周边部分朝向所述引线基板晶圆凸出，并且所述第一中间部件和所述第二中间部件 构件均匀变形。

公开(公告)号：US20110261658A1

公开(公告)日：2011-10-27

申请号：US13175189

申请日：2011-07-01

申请人： Yoichi Funabiki ,  Masashi Numata ,  Kazuyoshi Sugama

发明人： Yoichi Funabiki ,  Masashi Numata ,  Kazuyoshi Sugama

IPC分类号： H03B5/36 ,  H01L41/22 ,  G04C11/02

CPC分类号： H03H9/21 ,  H01L2924/0002 ,  H03H9/1021 ,  Y10T29/42 ,  Y10T29/49126 ,  Y10T29/49165 ,  H01L2924/00

摘要： A method of manufacturing a piezoelectric vibrator according to the invention is a method of manufacturing a piezoelectric vibrator in which a piezoelectric vibrating reed is sealed in a cavity formed between a base substrate and a lid substrate bonded to each other, the method including the steps of: inserting a core portion of a conductive rivet member, which includes a planar head portion and the core portion extending in a direction vertically to the surface of the head portion, into a penetration hole of the base substrate and bringing the head portion of the rivet member into contact with a first surface of the base substrate; attaching a laminate material having elastic properties to the first surface of the base substrate so as to cover the head portion; applying a paste-like glass frit on a second surface of the base substrate and filling the glass frit in the penetration hole; and baking and curing the glass frit.

摘要翻译： 根据本发明的制造压电振动器的方法是一种压电振动器的制造方法，其中压电振动片被密封在形成在彼此接合的基底基板和盖基板之间的空腔中，该方法包括以下步骤： 插入导电铆钉构件的芯部，其包括平面头部部分和沿着与头部部分表面垂直的方向延伸的芯部部分到基底基板的穿透孔中并使铆钉的头部部分 构件与所述基底基板的第一表面接触; 将具有弹性的层压材料附着到所述基底基板的第一表面以覆盖所述头部; 在基底基板的第二表面上涂敷糊状玻璃料并将玻璃料填充到穿透孔中; 并烘烤和固化玻璃料。

公开(公告)号：US07936114B2

公开(公告)日：2011-05-03

申请号：US12853659

申请日：2010-08-10

申请人： Masashi Numata ,  Kiyoshi Aratake ,  Kazuyoshi Sugama ,  Sumihiko Kurita

发明人： Masashi Numata ,  Kiyoshi Aratake ,  Kazuyoshi Sugama ,  Sumihiko Kurita

IPC分类号： H01L41/047 ,  H01L41/053

CPC分类号： H01L23/055 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/3011 ,  H03H3/02 ,  H03H9/1021 ,  H03H9/21 ,  H03H2003/026 ,  Y10T29/42 ,  H01L2924/00

摘要： The piezoelectric vibrator of the invention comprises a base substrate, a lid substrate in which cavity recesses are formed and which is bonded to the base substrate in such a state that the recesses face the base substrate, a piezoelectric vibration member bonded to the upper face of the base substrate in such a state that it is housed in the cavity formed of the recess between the base substrate and the lid substrate, an external electrode formed on the lower face of the base substrate, a through-electrode formed in and through the base substrate and electrically connected with the external electrode with keeping the airtightness inside the cavity, and a routing electrode formed on the upper face of the base substrate to electrically connect the through-electrode to the bonded piezoelectric vibration member; wherein the through-electrode is formed through hardening of a paste containing a plurality of metal fine particles and a plurality of glass beads.

摘要翻译： 本发明的压电振动器包括：底座基板，形成有凹部的盖基板，并且在与基板相对的凹部的状态下与基板接合;压电振动部件， 基底基板，其被容纳在由基底基板和盖基板之间的凹部形成的空腔中，形成在基底基板的下表面上的外部电极，形成在基底和底部基板的底部的贯通电极 基板，并与外部电极电气连接，同时保持空腔内的气密性;以及布线电极，形成在基底基板的上表面上，以将通孔电连接到接合的压电振动件; 其特征在于，所述贯通电极是通过硬化含有多个金属微粒和多个玻璃珠的糊料形成的。

公开(公告)号：US08032997B2

公开(公告)日：2011-10-11

申请号：US12857234

申请日：2010-08-16

申请人： Masashi Numata ,  Kiyoshi Aratake ,  Osamu Onitsuka ,  Junya Fukuda ,  Kazuyoshi Sugama

发明人： Masashi Numata ,  Kiyoshi Aratake ,  Osamu Onitsuka ,  Junya Fukuda ,  Kazuyoshi Sugama

IPC分类号： H04R17/10 ,  H01L41/043

CPC分类号： H03H3/02 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H03H9/1021 ,  H03H9/21 ,  H03H2003/026 ,  Y10T29/42 ,  Y10T29/49165 ,  H01L2224/0401

摘要： A process of manufacturing a piezoelectric vibrator comprises a base substrate; a lid substrate in which cavity recesses are formed and which is bonded to the base substrate in such a state that the recesses face the base substrate; a piezoelectric vibration member bonded to the upper face of the base substrate in such a state that it is housed in the cavity formed of the recess between the base substrate and the lid substrate; an external electrode formed on the lower face of the base substrate; a through- electrode formed in and through the base substrate and electrically connected with the external electrode with keeping the airtightness inside the cavity; and a routing electrode formed on the upper face of the base substrate to electrically connect the through-electrode to the bonded piezoelectric vibration member; wherein the through-electrode is formed in the base substrate by utilizing an electroconductive tack member having a tabular basis part and a core part extending from the basis part toward a direction perpendicular from a surface of the tabular basis part, where the core part is inserted into a through-hole formed in the base substrate and the basis part is removed by polishing the base substrate.

摘要翻译： 制造压电振动器的工艺包括：基底; 盖基板，其中形成有空腔凹部，并且在凹部面向基底基板的状态下结合到基底基板; 压电振动构件，其被接合到基底基板的上表面，其状态是将其容纳在由基底基板和盖基板之间的凹部形成的空腔中; 形成在所述基底基板的下表面上的外部电极; 形成在所述基底基板内并穿过所述基底基板的贯通电极，并与所述外部电极电连接，并保持所述空腔内的气密性; 以及布线电极，形成在所述基底基板的上表面上，以将所述通孔电连接到所述接合的压电振动部件; 其特征在于，所述贯通电极通过利用具有片状基部的导电性定位构件和从所述基部朝向与所述片状基部的表面垂直的方向延伸的芯部形成在所述基底基板中，所述芯部插入 进入形成在基底基板中的通孔中，并且通过抛光基底来去除基础部分。

公开(公告)号：US08421546B2

公开(公告)日：2013-04-16

申请号：US13035490

申请日：2011-02-25

申请人： Kazuyoshi Sugama ,  Kyoshi Aratake ,  Masashi Numata

发明人： Kazuyoshi Sugama ,  Kyoshi Aratake ,  Masashi Numata

IPC分类号： H03B5/32 ,  H01L41/00 ,  H03H9/24

CPC分类号： H03H9/1021 ,  H03H9/21 ,  Y10T29/42

摘要： A piezoelectric vibrator according to the invention includes a base substrate and a lid substrate which are connected to each other and have a cavity formed therebetween; a piezoelectric vibrating reed that is mounted on the base substrate in the cavity; an external electrode that is formed on a lower surface of the base substrate; and a through electrode which is formed so as to pass through the base substrate, maintain the airtightness in the cavity, and electrically connect the piezoelectric vibrating reed with the external electrode. The through electrode is formed by a press molding by a forming mold having a pin, and includes a through hole of a taper-shaped section, in which a taper angle is in the range of 15° or more and 20° or less, and a conductive paste that is hardened after being filled in the through hole.

摘要翻译： 根据本发明的压电振动器包括彼此连接并且在其间形成的空腔的基底基板和盖基板; 安装在空腔中的基底基板上的压电振动片; 外部电极，形成在所述基底基板的下表面上; 以及形成为穿过基底基板的贯通电极，保持空腔中的气密性，并将压电振动片与外部电极电连接。 贯通电极通过具有销的成型模具的压制成形而形成，并且包括锥形截面的通孔，其中锥角在15°以上且20°以下的范围内，以及 在填充在通孔中之后被硬化的导电膏。

公开(公告)号：US08407870B2

公开(公告)日：2013-04-02

申请号：US12978028

申请日：2010-12-23

申请人： Masashi Numata ,  Kazuyoshi Sugama ,  Hiroshi Higuchi

发明人： Masashi Numata ,  Kazuyoshi Sugama ,  Hiroshi Higuchi

IPC分类号： H01L41/04

CPC分类号： H03H9/21 ,  H03H3/02 ,  H03H9/0542 ,  H03H9/1021 ,  Y10T29/42

摘要： Provided is a method for manufacturing a high-quality piezoelectric vibrator in which reliable air-tightness of the inside of the cavity is maintained, and stable conduction between the piezoelectric vibrating reed and the outer electrodes is secured. The manufacturing method includes a penetration hole forming step of forming a plurality of penetration holes 30 on a base substrate wafer 40; a core portion insertion step of inserting core portions 7 of a rivet member 9 into the penetration holes from one side of the wafer; a melting step of bringing the rear surface of the base portion 8 of the rivet member into contact with the wafer to close the opening end on the one side of the penetration holes, heating the wafer while pressing the other side of the wafer so as to melt a surface portion on the other side of the wafer to produce a liquid base substrate material 41, and causing the material to flow into gaps between the inner circumferential walls of the penetration holes and the rivet member from the other side of the penetration holes so as to close the gaps; a curing step of cooling and curing the material poured into the gaps; and a polishing step of removing the base portion and polishing the wafer and the rivet member so that the base substrate wafer and the core portion are planarized.

摘要翻译： 本发明提供一种制造高品质的压电振动器的方法，其中保持了空腔内部的可靠的气密性，并确保了压电振动片和外部电极之间的稳定的传导。 该制造方法包括在基底基板晶片40上形成多个贯通孔30的贯通孔形成工序; 将铆钉构件9的芯部7从晶片的一侧插入贯通孔的芯部插入工序; 熔融步骤，使铆钉部件的​​基部8的后表面与晶片接触，以封闭穿透孔的一侧上的开口端，同时按压晶片的另一侧加热晶片，以便 熔化晶片另一侧的表面部分以产生液体基底材料41，并使材料从穿透孔的另一侧流入穿透孔的内周壁和铆钉构件之间的间隙中 缩小差距; 固化步骤，冷却和固化注入到间隙中的材料; 以及抛光步骤，去除基底部分并抛光晶片和铆钉构件，使得基底基板晶片和芯部分平坦化。

公开(公告)号：US08362846B2

公开(公告)日：2013-01-29

申请号：US13011401

申请日：2011-01-21

申请人： Kazuyoshi Sugama ,  Masashi Numata

发明人： Kazuyoshi Sugama ,  Masashi Numata

IPC分类号： H03B5/32

CPC分类号： H03H9/1021 ,  H01L2224/16225 ,  H03H9/21 ,  Y10T29/42

摘要： A package manufacturing method capable of preventing recess portions from being formed in penetration electrodes. The package manufacturing method includes an electrode member forming step of inserting core portions made of a metallic material into cylindrical members made of a first glass material and heating the cylindrical members so as to weld the cylindrical members to the core portions, thus forming electrode members; a hole forming step of forming holes, in which the electrode members 8 are disposed, on a penetration electrode forming board wafer made of a second glass material; an electrode member disposing step of disposing the electrode members in the holes formed on the wafer; a welding step of heating the wafer and the electrode members so as to be welded to each other; and a cooling step of cooling the wafer and the electrode members. In the welding step, a pressurizing mold is placed on the surface of the wafer, the wafer is pressed by the pressurizing mold, and the wafer and the electrode members are heated to a temperature higher than the softening point of the first glass material and the softening point of the second glass material, whereby the wafer and the electrode members are welded to each other.

摘要翻译： 一种能够防止在穿透电极中形成凹部的封装制造方法。 封装制造方法包括：将由金属材料制成的芯部插入由第一玻璃材料制成的圆柱形构件中并加热圆柱形构件以将圆柱形构件焊接到芯部的电极构件形成步骤，从而形成电极构件; 在由第二玻璃材料制成的穿透电极形成板晶片上形成电极构件8的孔的孔形成步骤; 电极构件设置步骤，其将电极构件设置在形成在晶片上的孔中; 焊接步骤，其将所述晶片和所述电极部件加热以彼此焊接; 以及冷却所述晶片和所述电极部件的冷却工序。 在焊接工序中，将加压模放置在晶片的表面上，通过加压模压制晶片，将晶片和电极部件加热到高于第一玻璃材料的软化点的温度， 第二玻璃材料的软化点，由此使晶片和电极构件彼此焊接。