摘要:
A method of manufacturing a piezoelectric vibrator according to the invention is a method of manufacturing a piezoelectric vibrator in which a piezoelectric vibrating reed is sealed in a cavity formed between a base substrate and a lid substrate bonded to each other, the method including the steps of: inserting a core portion of a conductive rivet member, which includes a planar head portion and the core portion extending in a direction vertically to the surface of the head portion, into a penetration hole of the base substrate and bringing the head portion of the rivet member into contact with a first surface of the base substrate; attaching a laminate material having elastic properties to the first surface of the base substrate so as to cover the head portion; applying a paste-like glass frit on a second surface of the base substrate and filling the glass frit in the penetration hole; and baking and curing the glass frit.
摘要:
An anodic bonding apparatus includes a first intermediate member that is disposed between an upper surface (an outer surface) of a lead substrate wafer and a first heater, has heat conductivity, and can be flexible; and a second intermediate member that is disposed between a lower surface (an outer surface) of a base substrate wafer and a second heater, has conductivity and heat conductivity, and can be flexible, wherein the first intermediate member is formed so that a central portion thereof bulges toward the base substrate wafer further than a periphery portion thereof, and the second intermediate member is formed so that a central portion thereof bulges toward the lead substrate wafer further than a periphery portion thereof, and, the first intermediate member and the second intermediate member are evenly deformed.
摘要:
A method of manufacturing a piezoelectric vibrator according to the invention is a method of manufacturing a piezoelectric vibrator in which a piezoelectric vibrating reed is sealed in a cavity formed between a base substrate and a lid substrate bonded to each other, the method including the steps of: inserting a core portion of a conductive rivet member, which includes a planar head portion and the core portion extending in a direction vertically to the surface of the head portion, into a penetration hole of the base substrate and bringing the head portion of the rivet member into contact with a first surface of the base substrate; attaching a laminate material having elastic properties to the first surface of the base substrate so as to cover the head portion; applying a paste-like glass frit on a second surface of the base substrate and filling the glass frit in the penetration hole; and baking and curing the glass frit.
摘要:
The piezoelectric vibrator of the invention comprises a base substrate, a lid substrate in which cavity recesses are formed and which is bonded to the base substrate in such a state that the recesses face the base substrate, a piezoelectric vibration member bonded to the upper face of the base substrate in such a state that it is housed in the cavity formed of the recess between the base substrate and the lid substrate, an external electrode formed on the lower face of the base substrate, a through-electrode formed in and through the base substrate and electrically connected with the external electrode with keeping the airtightness inside the cavity, and a routing electrode formed on the upper face of the base substrate to electrically connect the through-electrode to the bonded piezoelectric vibration member; wherein the through-electrode is formed through hardening of a paste containing a plurality of metal fine particles and a plurality of glass beads.
摘要:
The piezoelectric vibrator of the invention comprises a base substrate, a lid substrate in which cavity recesses are formed and which is bonded to the base substrate in such a state that the recesses face the base substrate, a piezoelectric vibration member bonded to the upper face of the base substrate in such a state that it is housed in the cavity formed of the recess between the base substrate and the lid substrate, an external electrode formed on the lower face of the base substrate, a through-electrode formed in and through the base substrate and electrically connected with the external electrode with keeping the airtightness inside the cavity, and a routing electrode formed on the upper face of the base substrate to electrically connect the through-electrode to the bonded piezoelectric vibration member; wherein the through-electrode is formed through hardening of a paste containing a plurality of metal fine particles and a plurality of glass beads.
摘要:
The piezoelectric vibrator comprises a base substrate; a lid substrate in which cavity recesses are formed and which is bonded to the base substrate in such a state that the recesses face the base substrate; a piezoelectric vibration member bonded to the upper face of the base substrate in such a state that it is housed in the cavity formed of the recess between the base substrate and the lid substrate; an external electrode formed on the lower face of the base substrate; a through-electrode formed in and through the base substrate and electrically connected with the external electrode with keeping the airtightness inside the cavity; and a routing electrode formed on the upper face of the base substrate to electrically connect the through-electrode to the bonded piezoelectric vibration member; wherein the through-electrode is formed of a cylindrical body, which is formed of a glass material to have two flat ends and a thickness substantially equal to that of the base substrate, and is implanted in the through-hole running through the base substrate; and an electroconductive core member which is formed to have two flat ends and a thickness substantially equal to that of the base substrate and is inserted into the center hole of the cylindrical body; and the through-hole, the cylindrical body and the core member are integrally fixed to each other by firing.
摘要:
A piezoelectric vibrator according to the invention includes a base substrate and a lid substrate which are connected to each other and have a cavity formed therebetween; a piezoelectric vibrating reed that is mounted on the base substrate in the cavity; an external electrode that is formed on a lower surface of the base substrate; and a through electrode which is formed so as to pass through the base substrate, maintain the airtightness in the cavity, and electrically connect the piezoelectric vibrating reed with the external electrode. The through electrode is formed by a press molding by a forming mold having a pin, and includes a through hole of a taper-shaped section, in which a taper angle is in the range of 15° or more and 20° or less, and a conductive paste that is hardened after being filled in the through hole.
摘要:
Provided is a method for manufacturing a high-quality piezoelectric vibrator in which reliable air-tightness of the inside of the cavity is maintained, and stable conduction between the piezoelectric vibrating reed and the outer electrodes is secured. The manufacturing method includes a penetration hole forming step of forming a plurality of penetration holes 30 on a base substrate wafer 40; a core portion insertion step of inserting core portions 7 of a rivet member 9 into the penetration holes from one side of the wafer; a melting step of bringing the rear surface of the base portion 8 of the rivet member into contact with the wafer to close the opening end on the one side of the penetration holes, heating the wafer while pressing the other side of the wafer so as to melt a surface portion on the other side of the wafer to produce a liquid base substrate material 41, and causing the material to flow into gaps between the inner circumferential walls of the penetration holes and the rivet member from the other side of the penetration holes so as to close the gaps; a curing step of cooling and curing the material poured into the gaps; and a polishing step of removing the base portion and polishing the wafer and the rivet member so that the base substrate wafer and the core portion are planarized.
摘要:
A package manufacturing method capable of preventing recess portions from being formed in penetration electrodes. The package manufacturing method includes an electrode member forming step of inserting core portions made of a metallic material into cylindrical members made of a first glass material and heating the cylindrical members so as to weld the cylindrical members to the core portions, thus forming electrode members; a hole forming step of forming holes, in which the electrode members 8 are disposed, on a penetration electrode forming board wafer made of a second glass material; an electrode member disposing step of disposing the electrode members in the holes formed on the wafer; a welding step of heating the wafer and the electrode members so as to be welded to each other; and a cooling step of cooling the wafer and the electrode members. In the welding step, a pressurizing mold is placed on the surface of the wafer, the wafer is pressed by the pressurizing mold, and the wafer and the electrode members are heated to a temperature higher than the softening point of the first glass material and the softening point of the second glass material, whereby the wafer and the electrode members are welded to each other.
摘要:
A method of manufacturing a piezoelectric vibrator according to the invention includes the steps of: inserting a core portion of a conductive rivet member, which includes a planar base portion and the core portion extending in a direction vertical to the surface of a base portion, into a penetration hole of the base substrate and bringing the base portion of the rivet member into contact with a first surface of the base substrate; applying a paste-like glass frit on a second surface of the base substrate and moving a first squeegee which comes into contact with the second surface with an attack angle in one direction to thereby fill the glass frit in the penetration hole; and moving a second squeegee which comes into contact with the second surface with an attack angle in a direction opposite to the one direction to thereby fill the glass frit applied redundantly on the second surface in the penetration hole.