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    Heating device, method for evaluating heating device and pattern forming method
    1.
    发明授权
    Heating device, method for evaluating heating device and pattern forming method 失效
    加热装置，加热装置的评价方法和图案形成方法

    公开(公告)号：US06441351B2

    公开(公告)日：2002-08-27

    申请号：US09734924

    申请日：2000-12-13

    申请人： Kei Hayasaki ,  Shinichi Ito ,  Kenji Kawano

    发明人： Kei Hayasaki ,  Shinichi Ito ,  Kenji Kawano

    IPC分类号： H05B102

    CPC分类号： H01L21/67115 ,  G03F7/168 ,  G03F7/38

    摘要： A heating apparatus for performing heat treatment on a wafer applied with a resist before or after exposure includes a heating plate for heating a wafer which is placed on the heating plate, a light intensity detecting apparatus for irradiating light on the wafer to detect intensity of reflected light from the resist on the wafer, and a control section for controlling heating performed by the heating plate on the basis of the detected intensity of reflected light so that heating amount applied to a plurality of wafers becomes constant. Accordingly, the heating amount of the wafer can be controlled to be constant and variations in dimension of resist patterns can be reduced.

    摘要翻译： 用于在曝光前后施加抗蚀剂的晶片上进行热处理的加热装置包括用于加热放置在加热板上的晶片的加热板，用于在晶片上照射光以检测反射的强度的光强度检测装置 来自晶片上的抗蚀剂的光，以及控制部分，用于根据检测到的反射光强度控制由加热板进行的加热，使得施加到多个晶片的加热量变得恒定。 因此，可以将晶片的加热量控制为恒定，并且可以减小抗蚀剂图案的尺寸变化。

    Apparatus for processing substrate and method of processing the same
    2.
    发明授权
    Apparatus for processing substrate and method of processing the same 失效
    基板处理装置及其处理方法

    公开(公告)号：US07662546B2

    公开(公告)日：2010-02-16

    申请号：US11304549

    申请日：2005-12-16

    申请人： Kenji Kawano ,  Shinichi Ito ,  Eishi Shiobara ,  Daisuke Kawamura ,  Kei Hayasaki

    发明人： Kenji Kawano ,  Shinichi Ito ,  Eishi Shiobara ,  Daisuke Kawamura ,  Kei Hayasaki

    IPC分类号： H05B3/68

    CPC分类号： H01L21/6715 ,  B05C5/0254 ,  B05C11/08 ,  G03F7/168 ,  G03F7/3021 ,  G03F7/38 ,  G03F7/70358 ,  G03F7/70558 ,  H01L21/67109 ,  H01L21/67115

    摘要： A heating apparatus for a substrate to be processed with a coating film has a chamber with an inner space, a heating plate heating the substrate to be processed in the inner space, and a partition member. The heating plate has a support surface which supports the substrate to be processed within the chamber. The partition member is arranged in the chamber so as to face the support surface. The partition member partitions the inner space into first and second spaces, and has a plurality of pores which allow the first and second spaces to communicate with each other. The support surface of the heating plate is set in the first space. An air stream formation mechanism forming an air stream is arranged in the second space. This mechanism discharges a substance evaporated from the photoresist film.

    摘要翻译： 用涂膜处理的基板的加热装置具有内部空间的室，在内部空间中加热被处理基板的加热板和分隔构件。 加热板具有支撑表面，该支撑表面支撑在腔室内待处理的基底。 分隔构件布置在腔室中以面向支撑表面。 分隔构件将内部空间分隔成第一和第二空间，并且具有允许第一和第二空间彼此连通的多个孔。 加热板的支撑表面设置在第一空间中。 形成空气流的气流形成机构设置在第二空间中。 该机理将从光致抗蚀剂膜蒸发的物质排出。

    Heating device, method for evaluating heating device and pattern forming method
    3.
    发明授权
    Heating device, method for evaluating heating device and pattern forming method 失效
    加热装置，加热装置的评价方法和图案形成方法

    公开(公告)号：US06191397B1

    公开(公告)日：2001-02-20

    申请号：US09345749

    申请日：1999-07-01

    申请人： Kei Hayasaki ,  Shinichi Ito ,  Kenji Kawano

    发明人： Kei Hayasaki ,  Shinichi Ito ,  Kenji Kawano

    IPC分类号： H01L21205

    CPC分类号： H01L21/67115 ,  G03F7/168 ,  G03F7/38

    摘要： A heating apparatus for performing heat treatment on a wafer applied with a resist before or after exposure includes a heating plate for heating a wafer which is placed on the heating plate, a light intensity detecting apparatus for irradiating light on the wafer to detect intensity of reflected light from the resist on the wafer, and a control section for controlling heating performed by the heating plate on the basis of the detected intensity of reflected light so that heating amount applied to a plurality of wafers becomes constant. Accordingly, the heating amount of the wafer can be controlled to be constant and variations in dimension of resist patterns can be reduced.

    摘要翻译： 用于在曝光前后施加抗蚀剂的晶片上进行热处理的加热装置包括用于加热放置在加热板上的晶片的加热板，用于在晶片上照射光以检测反射的强度的光强度检测装置 来自晶片上的抗蚀剂的光，以及控制部分，用于根据检测到的反射光强度控制由加热板进行的加热，使得施加到多个晶片的加热量变得恒定。 因此，可以将晶片的加热量控制为恒定，并且可以减小抗蚀剂图案的尺寸变化。

    Heating device, method for evaluating heating device and pattern forming method
    6.
    发明授权
    Heating device, method for evaluating heating device and pattern forming method 失效

    公开(公告)号：US06603101B2

    公开(公告)日：2003-08-05

    申请号：US10189480

    申请日：2002-07-08

    申请人： Kei Hayasaki ,  Shinichi Ito ,  Kenji Kawano

    发明人： Kei Hayasaki ,  Shinichi Ito ,  Kenji Kawano

    IPC分类号： H05B102

    CPC分类号： H01L21/67115 ,  G03F7/168 ,  G03F7/38

    摘要： A heating apparatus for performing heat treatment on a wafer applied with a resist before or after exposure includes a heating plate for heating a wafer which is placed on the heating plate, a light intensity detecting apparatus for irradiating light on the wafer to detect intensity of reflected light from the resist on the wafer, and a control section for controlling heating performed by the heating plate on the basis of the detected intensity of reflected light so that heating amount applied to a plurality of wafers becomes constant. Accordingly, the heating amount of the wafer can be controlled to be constant and variations in dimension of resist patterns can be reduced.

    Pattern size evaluation apparatus
    8.
    发明授权
    Pattern size evaluation apparatus 失效
    图案尺寸评估装置

    公开(公告)号：US06423977B1

    公开(公告)日：2002-07-23

    申请号：US09030510

    申请日：1998-02-25

    申请人： Kei Hayasaki ,  Shinichi Ito ,  Kenji Kawano ,  Soichi Inoue ,  Katsuya Okumura

    发明人： Kei Hayasaki ,  Shinichi Ito ,  Kenji Kawano ,  Soichi Inoue ,  Katsuya Okumura

    IPC分类号： G01N2186

    CPC分类号： G01N21/956

    摘要： A pattern size evaluation apparatus comprising an illumination optical system for projecting parallel light rays of a predetermined wavelength on a monitoring area formed on an object, the monitoring area being formed at a position different from a device pattern formed on the object, a light intensity detection optical system for detecting diffracted light from the monitoring area, and a device pattern size evaluation section for evaluating a size of the device pattern based on an intensity of diffracted light from the monitoring area.

    摘要翻译： 一种图案尺寸评估装置，包括用于在形成在物体上的监视区域上投射预定波长的平行光线的照明光学系统，所述监视区域形成在与形成在物体上的装置图案不同的位置，光强度检测 用于检测来自监视区域的衍射光的光学系统，以及用于基于来自监视区域的衍射光的强度来评估装置图案的尺寸的装置图案尺寸评估部。