Electrolytic processing apparatus and method
    3.
    发明申请
    Electrolytic processing apparatus and method 审中-公开
    电解处理装置及方法

    公开(公告)号:US20070034526A1

    公开(公告)日:2007-02-15

    申请号:US11202684

    申请日:2005-08-12

    IPC分类号: B23H3/00

    CPC分类号: B23H5/08 C25F3/02 C25F7/00

    摘要: An electrolytic processing apparatus can planarize uniformly over an entire surface of a substrate under a low pressure without any damages to the substrate. The electrolytic processing apparatus has a substrate holder configured to hold and rotate a substrate having a metal film formed on a surface of the substrate and an electrolytic processing unit configured to perform an electrolytic process on the substrate held by the substrate holder. The electrolytic processing unit has a rotatable processing electrode, a polishing pad attached to the rotatable processing electrode, and a pressing mechanism configured to press the polishing pad against the substrate. The electrolytic processing unit also has a liquid supply mechanism configured to supply an electrolytic processing liquid between the substrate and the rotatable processing electrode, a relative movement mechanism operable to move the substrate and the rotatable processing electrode relative to each other, and a power supply configured to applying a voltage between the rotatable processing electrode and the metal film of the substrate so that the rotatable processing electrode serves as a cathode and the metal film of the substrate serves as an anode.

    摘要翻译: 电解处理装置可以在低压下在基板的整个表面上均匀地平坦化,而不会对基板造成任何损坏。 所述电解处理装置具有基板保持件,所述基板保持器被构造成保持和旋转形成在所述基板的表面上的金属膜的基板和被配置为在由所述基板保持器保持的所述基板上进行电解处理的电解处理单元。 电解处理单元具有可旋转的处理电极,附接到可旋转处理电极的抛光垫,以及被配置为将抛光垫压靠在基板上的按压机构。 电解处理单元还具有:液体供给机构,被构造成在基板和可旋转处理电极之间提供电解处理液体;相对移动机构,其可操作以相对于彼此移动基板和可旋转处理电极;电源配置 在可旋转处理电极和基板的金属膜之间施加电压,使得可旋转处理电极用作阴极,并且基板的金属膜用作阳极。