Method for down-scaling a digital image and a digital camera for processing images of different resolutions
    1.
    发明授权
    Method for down-scaling a digital image and a digital camera for processing images of different resolutions 有权
    用于缩小数字图像的方法和用于处理不同分辨率的图像的数字照相机

    公开(公告)号:US07436441B2

    公开(公告)日:2008-10-14

    申请号:US10360516

    申请日:2003-02-07

    IPC分类号: H04N5/262

    摘要: A digital camera for capturing and processing images of different resolutions and a corresponding method for down-scaling a digital image are provided. The method includes forming an image of a real scene on an image sensor that is made up of a plurality of pixels arranged in a matrix. The method further includes addressing and reading pixels in the matrix to obtain analog quantities related to the pixels luminance values, converting the analog quantities from the pixels matrix into digital values, and processing the digital values to obtain a data file representing the image of the real scene. To reduce computation time and power consumption, the addressing and reading of the pixels includes selecting a group of pixels from the matrix, and storing the analog quantities related to the pixels of the selected group of pixels into an analog storing circuit. The stored analog quantities are averaged to obtain an analog quantity corresponding to an average pixel luminance value.

    摘要翻译: 提供了用于捕获和处理不同分辨率的图像的数字照相机和用于缩小数字图像的相应方法。 该方法包括在由矩阵排列的多个像素构成的图像传感器上形成真实场景的图像。 该方法还包括寻址和读取矩阵中的像素以获得与像素亮度值相关的模拟量,将来自像素矩阵的模拟量转换为数字值,并处理数字值以获得表示真实图像的数据文件 现场。 为了减少计算时间和功耗,像素的寻址和读取包括从矩阵中选择一组像素,并将与所选择的像素组的像素相关的模拟量存储到模拟存储电路中。 对存储的模拟量进行平均以获得对应于平均像素亮度值的模拟量。

    Multi-Wideband Communications over Power Lines
    2.
    发明申请
    Multi-Wideband Communications over Power Lines 有权
    电力线上的多宽带通信

    公开(公告)号:US20070075843A1

    公开(公告)日:2007-04-05

    申请号:US11467141

    申请日:2006-08-24

    IPC分类号: G05B11/01

    摘要: Systems and methods for communicating over a power line are configured to substantially simultaneously communicate over a plurality of wideband frequency ranges. Signals may be communicated two or from a communication node at two different frequencies simultaneously. These signals may be exchanged with different nodes and/or include independent data. In some embodiments, some of the wideband frequency ranges are above 30 MHz.

    摘要翻译: 用于通过电力线通信的系统和方法被配置为基本上同时在多个宽带频率范围上进行通信。 信号可以以两个不同频率同时传送到通信节点或通信节点。 这些信号可以与不同的节点交换和/或包括独立的数据。 在一些实施例中,一些宽带频率范围在30MHz以上。

    Imaging assembly
    3.
    发明申请
    Imaging assembly 有权
    成像组件

    公开(公告)号:US20060033833A1

    公开(公告)日:2006-02-16

    申请号:US11201555

    申请日:2005-08-11

    IPC分类号: H04N5/225

    摘要: An imaging assembly for an image sensor may include a lens, a transparent substrate and two aspherical optical coatings on each side of the substrate. The imaging assembly can also incorporate an opaque coating with an opening in-line with the lens to form an aperture, an anti-reflection coating, and an infrared filter coating.

    摘要翻译: 用于图像传感器的成像组件可以包括透镜,透明基板和在基板的每一侧上的两个非球面光学涂层。 成像组件还可以包括具有与透镜成直角的开口的不透明涂层以形成孔,防反射涂层和红外滤光器涂层。

    Optical device for optical semiconductor package and fabrication method
    4.
    发明授权
    Optical device for optical semiconductor package and fabrication method 有权
    光学半导体封装的光学器件及其制造方法

    公开(公告)号:US07245834B2

    公开(公告)日:2007-07-17

    申请号:US10968457

    申请日:2004-10-19

    IPC分类号: H04B10/00

    摘要: An optical device includes a stack having a transparent block with a rear face fixed on a front face of an integrated chip support. A front face of the transparent block that is parallel to its rear face is affixed to a rear face of a converging lens. The lens has a convex frontal surface. A diaphragm is interposed and fixed between the block and the lens. A housing for the optical device is made of an opaque material. A peripheral wall of the housing encloses the stack. An annular front part of the peripheral wall bears on a periphery of the convex frontal surface of the lens so as to define a frontal opening located in front of a central part of the lens.

    摘要翻译: 光学装置包括具有固定在集成芯片支架的正面上的后表面的透明块的堆叠。 透明块的与其后表面平行的前表面固定在会聚透镜的后表面上。 透镜具有凸面的正面。 隔膜插入并固定在块和透镜之间。 用于光学装置的外壳由不透明材料制成。 外壳的周围围绕堆叠。 周壁的环状前部部分承载在透镜的凸面正面的周边上,以便限定位于透镜的中心部分前方的正面开口。

    Multi-Wideband Communications over Power Lines
    5.
    发明申请
    Multi-Wideband Communications over Power Lines 审中-公开
    电力线上的多宽带通信

    公开(公告)号:US20070076666A1

    公开(公告)日:2007-04-05

    申请号:US11536539

    申请日:2006-09-28

    IPC分类号: H04B7/216

    摘要: Systems and methods for communicating over a power line are configured to substantially simultaneously communicate over a plurality of wide band frequency ranges. Signals may be communicated two or from a communication node at two different frequencies simultaneously. These signals may be exchanged with different nodes and/or include independent data. In some embodiments, some of the wide band frequency ranges are above 30 MHz.

    摘要翻译: 用于通过电力线通信的系统和方法被配置为基本上同时在多个宽带频率范围上进行通信。 信号可以以两个不同频率同时传送到通信节点或通信节点。 这些信号可以与不同的节点交换和/或包括独立的数据。 在一些实施例中,一些宽带频率范围在30MHz以上。

    Optical device for optical semiconductor package and fabrication method
    6.
    发明申请
    Optical device for optical semiconductor package and fabrication method 有权
    光学半导体封装的光学器件及其制造方法

    公开(公告)号:US20050141107A1

    公开(公告)日:2005-06-30

    申请号:US10968457

    申请日:2004-10-19

    摘要: An optical device includes a stack having a transparent block with a rear face fixed on a front face of an integrated chip support. A front face of the transparent block that is parallel to its rear face is affixed to a rear face of a converging lens. The lens has a convex frontal surface. A diaphragm is interposed and fixed between the block and the lens. A housing for the optical device is made of an opaque material. A peripheral wall of the housing encloses the stack. An annular front part of the peripheral wall bears on a periphery of the convex frontal surface of the lens so as to define a frontal opening located in front of a central part of the lens.

    摘要翻译: 光学装置包括具有固定在集成芯片支架的正面上的后表面的透明块的堆叠。 透明块的与其后表面平行的前表面固定在会聚透镜的后表面上。 透镜具有凸面的正面。 隔膜插入并固定在块和透镜之间。 用于光学装置的外壳由不透明材料制成。 外壳的周围围绕堆叠。 周壁的环状前部部分承载在透镜的凸面正面的周边上,以便限定位于透镜的中心部分前方的正面开口。

    Multi-Wideband Communications over Multiple Mediums within a Network
    7.
    发明申请
    Multi-Wideband Communications over Multiple Mediums within a Network 有权
    网络中多媒体的多宽带通信

    公开(公告)号:US20070229231A1

    公开(公告)日:2007-10-04

    申请号:US11752865

    申请日:2007-05-23

    IPC分类号: G05B11/01

    摘要: A powerline communications device comprises a powerline communications interface and at least one other communications interface configured to communicate over a computing network. The powerline communications interface is further configured to receive electrical power. The computing network may comprise mediums including powerlines, telephone lines, and/or coaxial cables. In some embodiments, the powerline communications interface may communicate with a network apparatus, such as a personal computer, via an Ethernet interface. The powerline interface, the telephone line interface, and/or the coaxial cable interface may all be associated with the same media access control (MAC) address. The powerline communications device may receive a message via a first medium and repeat the message via a second medium based on a quality of service (QoS) metric. In some embodiments, the powerline communications device may communicate using multiple frequency bands.

    摘要翻译: 电力线通信设备包括电力线通信接口和配置成通过计算网络通信的至少一个其他通信接口。 电力线通信接口还被配置为接收电力。 计算网络可以包括包括电力线,电话线和/或同轴电缆的介质。 在一些实施例中,电力线通信接口可以经由以太网接口与诸如个人计算机的网络设备进行通信。 电力线接口,电话线接口和/或同轴电缆接口可以全部与相同的媒体接入控制(MAC)地址相关联。 电力线通信设备可以经由第一介质接收消息,并且基于服务质量(QoS)度量经由第二介质重复该消息。 在一些实施例中,电力线通信设备可以使用多个频带进行通信。

    Semiconductor component, wafer and package having an optical sensor
    8.
    发明申请
    Semiconductor component, wafer and package having an optical sensor 审中-公开
    具有光学传感器的半导体元件,晶片和封装

    公开(公告)号:US20050103987A1

    公开(公告)日:2005-05-19

    申请号:US10958673

    申请日:2004-10-05

    摘要: A semiconductor component, semiconductor wafer and semiconductor package include an integrated-circuit chip having, on a front face, an optical sensor and electrical connection pads between the edge of this face and this optical sensor. A protective patch made of a transparent material is placed in front of the optical sensor but does not cover the said optical connection pads. The said protective patch is fixed to the front face of the said chip by a bead of an adhesive extending annularly between, and at a certain distance from, the edge of the said optical sensor and of the electrical connection pads. At least one of the faces of the patch is covered with a protective layer of a material that filters out infrared light rays.

    摘要翻译: 半导体部件,半导体晶片和半导体封装包括集成电路芯片,其在正面上具有光学传感器和在该面的边缘与该光学传感器之间的电连接焊盘。 由透明材料制成的保护贴片放置在光学传感器的前面,但不覆盖所述光学连接垫。 所述保护贴片通过在所述光学传感器和所述电连接垫的边缘之间并且距离所述光学传感器的边缘和一定距离之间环形延伸的粘合剂珠固定到所述芯片的前表面。 补片的至少一个面被被过滤掉红外光的材料的保护层覆盖。