公开(公告)号：US5051494A

公开(公告)日：1991-09-24

申请号：US511235

申请日：1990-04-19

申请人： Keizaburo Yamaguchi ,  Yoshimitsu Tanabe ,  Tatshuiro Urakami ,  Akihiro Yamaguchi ,  Norimasa Yamaya ,  Masahiro Ohta

发明人： Keizaburo Yamaguchi ,  Yoshimitsu Tanabe ,  Tatshuiro Urakami ,  Akihiro Yamaguchi ,  Norimasa Yamaya ,  Masahiro Ohta

IPC分类号： C07C211/50 ,  C08G73/12

CPC分类号： C08G73/121 ,  C07C211/50

摘要： The invention relates to an aromatic amine resin comprising a mixture of aromatic amine compounds represented by the following general formula (a): ##STR1## wherein A represents a phenylene, alkyl-substituted phenylene, diphenylene, diphenyl ether or naphthylenyl group, R.sup.1 represents a halogen atom or a hydroxyl C.sub.1-4 alkoxy or C.sub.1-5 alkyl group, l is 1 or 2, m is 0, 1, 2 or 3, n is an integer from 0 to 300 and when m is 2 or 3, the R.sup.1 group may be the same or different and may join to form a 5- or 6-membered alicyclic moiety which may optionally contain one or more side chains, and also relates to processes for producing the same and a thermosetting composition containing the same.

公开(公告)号：US5484948A

公开(公告)日：1996-01-16

申请号：US284103

申请日：1994-08-02

申请人： Keizaburo Yamaguchi ,  Tatsuhiro Urakami ,  Yoshimitsu Tanabe ,  Midori Yamazaki ,  Shoji Tamai ,  Norimasa Yamaya ,  Masahiro Ohta ,  Akihiro Yamaguchi

发明人： Keizaburo Yamaguchi ,  Tatsuhiro Urakami ,  Yoshimitsu Tanabe ,  Midori Yamazaki ,  Shoji Tamai ,  Norimasa Yamaya ,  Masahiro Ohta ,  Akihiro Yamaguchi

IPC分类号： C07C201/12 ,  C07C205/38 ,  C07C213/02 ,  C07C217/90 ,  C07D207/44 ,  C07D207/452 ,  C08G73/12 ,  C07D207/444

CPC分类号： C07D207/452 ,  C07C205/38 ,  C07C217/90 ,  C08G73/124

摘要： Disclosed is an aromatic diamine compound represented by the formula (I) ##STR1## wherein R is H or CH.sub.3. Also disclosed is a bismaleimide compound represented by the formula (IV) ##STR2## wherein R is H or CH.sub.3, A resin forming composition comprising these compounds is also disclosed. The compounds are useful as raw materials for resins, and the resin forming composition and the resin can provide excellent heat resistance and impact resistance and low hygroscopicity.

摘要翻译： 公开了由式（I）表示的芳族二胺化合物，其中R是H或CH 3。 还公开了由式（IV）表示的双马来酰亚胺化合物。其中R是H或CH 3，包含这些化合物的树脂形成组合物也被公开。 这些化合物可用作树脂的原料，树脂形成组合物和树脂可以提供优异的耐热性和耐冲击性和低吸湿性。

公开(公告)号：US5206438A

公开(公告)日：1993-04-27

申请号：US601424

申请日：1990-10-23

申请人： Keizaburo Yamaguchi ,  Tatsuhiro Urakami ,  Yoshimitsu Tanabe ,  Midori Yamazaki ,  Shoji Tamai ,  Norimasa Yamaya ,  Masahiro Ohta ,  Akihiro Yamaguchi

发明人： Keizaburo Yamaguchi ,  Tatsuhiro Urakami ,  Yoshimitsu Tanabe ,  Midori Yamazaki ,  Shoji Tamai ,  Norimasa Yamaya ,  Masahiro Ohta ,  Akihiro Yamaguchi

IPC分类号： C07C201/12 ,  C07C205/38 ,  C07C213/02 ,  C07C217/90 ,  C07D207/44 ,  C07D207/452 ,  C08G73/12

CPC分类号： C07D207/452 ,  C07C205/38 ,  C07C217/90 ,  C08G73/124

摘要： Disclosed is an aromatic diamine compound represented by the formula (I) ##STR1## wherein R is H or CH.sub.3. Also disclosed is a bismaleimide compound represented by the formula (IV) ##STR2## wherein R is H or CH.sub.3, A resin forming composition comprising these compounds is also disclosed. The compounds are useful as raw materials for resins, and the resin forming composition and the resin can provide excellent heat resistance and impact resistance and low hygroscopicity.

公开(公告)号：US5364967A

公开(公告)日：1994-11-15

申请号：US5276

申请日：1993-01-19

申请人： Keizaburo Yamaguchi ,  Tatsuhiro Urakami ,  Yoshimitsu Tanabe ,  Midori Yamazaki ,  Shoji Tamai ,  Norimasa Yamaya ,  Masahiro Ohta ,  Akihiro Yamaguchi

发明人： Keizaburo Yamaguchi ,  Tatsuhiro Urakami ,  Yoshimitsu Tanabe ,  Midori Yamazaki ,  Shoji Tamai ,  Norimasa Yamaya ,  Masahiro Ohta ,  Akihiro Yamaguchi

IPC分类号： C07C201/12 ,  C07C205/38 ,  C07C213/02 ,  C07C217/90 ,  C07D207/44 ,  C07D207/452 ,  C08G73/12 ,  C07C211/50

CPC分类号： C07D207/452 ,  C07C205/38 ,  C07C217/90 ,  C08G73/124

摘要： Disclosed is an aromatic diamine compound represented by the formula (I) ##STR1## wherein R is H or CH.sub.3. Also disclosed is a bismaleimide compound represented by the formula (IV) ##STR2## wherein R is H or CH.sub.3, A resin forming composition comprising these compounds is also disclosed. The compounds are useful as raw materials for resins, and the resin forming composition and the resin can provide excellent heat resistance and impact resistance and low hygroscopicity.

摘要翻译： 公开了由式（I）表示的芳族二胺化合物，其中R是H或CH 3。 还公开了由式（IV）表示的双马来酰亚胺化合物其中R是H或CH 3，其中R是H或CH 3，还公开了包含这些化合物的形成树脂的组合物。 这些化合物可用作树脂的原料，树脂形成组合物和树脂可以提供优异的耐热性和耐冲击性和低吸湿性。

公开(公告)号：US5106953A

公开(公告)日：1992-04-21

申请号：US511093

申请日：1990-04-19

申请人： Keizaburo Yamaguchi ,  Yoshimitsu Tanabe ,  Tatsuhiro Urakami ,  Akihiro Yamaguchi ,  Norimasa Yamaya ,  Masahiro Ohta

发明人： Keizaburo Yamaguchi ,  Yoshimitsu Tanabe ,  Tatsuhiro Urakami ,  Akihiro Yamaguchi ,  Norimasa Yamaya ,  Masahiro Ohta

IPC分类号： C07C211/50 ,  C08G73/12

CPC分类号： C08G73/121 ,  C07C211/50

摘要： The invention relates to an aromatic amine resin comprising a mixture of aromatic amine compounds represented by the following general formula (a): ##STR1## wherein A represents a phenylene, alkyl-substituted phenylene, diphenylene, diphenyl ether or naphthylenyl group, R.sup.1 represents a halogen atom or a hydroxyl C.sub.1-4 alkoxy or C.sub.1-5 alkyl group, l is 1 or 2, m is 0, 1, 2 or 3, n is an integer from 0 to 300 and when m is 2 or 3, the R.sup.1 group may be same or different and may join to form a 5- or 6-membered alicyclic moiety which may optionally contain one or more side chains, and also relates to processes for producing the same and a thermosetting composition containing the same.

公开(公告)号：US4937318A

公开(公告)日：1990-06-26

申请号：US254701

申请日：1988-10-07

申请人： Keizaburo Yamaguchi ,  Yoshimitsu Tanabe ,  Tatsuhiro Urakami ,  Akihiro Yamaguchi ,  Norimasa Yamaya ,  Masahiro Ohta

发明人： Keizaburo Yamaguchi ,  Yoshimitsu Tanabe ,  Tatsuhiro Urakami ,  Akihiro Yamaguchi ,  Norimasa Yamaya ,  Masahiro Ohta

IPC分类号： C07C211/50 ,  C08G73/12

CPC分类号： C08G73/121 ,  C07C211/50

摘要： The invention relates to an aromatic amine resin comprising a mixture of aromatic amine compounds represented by the following general formula (a): ##STR1## wherein A represents a phenylene, alkyl-substituted phenylene, diphenylene, diphenyl ether or napthylenyl group, R.sup.1 represents a halogen atom or a hydroxyl C.sub.1-4 alkoxy or C.sub.1 -5 alkyl group, l is 1 or 2, m is 0, 1, 2 or 3, n is an integer from 0 to 300 and when m is 2 or 3, the R.sup.1 group may be same or different and may join to form a 5- to 6-membered alicyclic moiety which may optionally contain one or more side chains, and also relates to processes for producing the same and a thermosetting composition containing the same.

公开(公告)号：US5145949A

公开(公告)日：1992-09-08

申请号：US823478

申请日：1992-01-22

申请人： Keizaburo Yamaguchi ,  Yoshimitsu Tanabe ,  Tatsuhiro Urakami ,  Akihiro Yamaguchi ,  Norimasa Yamaya ,  Masahiro Ohta

发明人： Keizaburo Yamaguchi ,  Yoshimitsu Tanabe ,  Tatsuhiro Urakami ,  Akihiro Yamaguchi ,  Norimasa Yamaya ,  Masahiro Ohta

IPC分类号： C07C211/50 ,  C08G73/12

CPC分类号： C08G73/121 ,  C07C211/50

摘要： Disclosed herein is an aromatic amine resin formed of a mixture of aromatic amine compounds represented by the following general formula (a): ##STR1## wherein A means a phenylene, alkyl-substituted phenylene, diphenylene, diphenyl ether or naphthylenyl group, R.sup.1 denotes a halogen atom or a hydroxyl, C.sub.1-4 alkoxy or C.sub.1-5 alkyl group, l stands for 1 or 2, m is an integer of 0-3, when m is 2 or 3, R.sup.1 s may be the same or different and two of R.sup.1 s may join together into a 5- to 6-membered alicyclic moiety which may optionally contain one or more side chains, and n stands for an integer of 0-300.

摘要翻译： 本文公开了由以下通式（a）表示的芳族胺化合物的混合物形成的芳香族胺树脂：其中A表示亚苯基，烷基取代的亚苯基，二亚苯基，二苯基醚或萘基， R1表示卤素原子或羟基，C1-4烷氧基或C1-5烷基，l表示1或2，m表示0-3的整数，当m为2或3时，R 1可以相同或不同 并且R 1中的两个可以连接在一起可以任选地含有一个或多个侧链的5-至6-元脂环部分，n表示0-300的整数。

公开(公告)号：US5028641A

公开(公告)日：1991-07-02

申请号：US388638

申请日：1989-08-02

申请人： Norimasa Yamaya ,  Masahiro Ohta ,  Akihiro Yamaguchi

发明人： Norimasa Yamaya ,  Masahiro Ohta ,  Akihiro Yamaguchi

IPC分类号： C08G73/12 ,  C08K3/14 ,  C08K3/22 ,  C08K3/36

CPC分类号： C08K3/22 ,  C08G73/124 ,  C08G73/125 ,  C08G73/127 ,  C08K3/14 ,  C08K3/36

摘要： A thermosetting resin composition formed of a polyaminobismaleimide resin, which is composed of a bismaleimide compound and a diamine compound, and a powdery inorganic filler. The composition has excellent heat resistance as well as superb mechanical properties at high temperature not to mention room temperature, and is expected to find wide-spread commercial utility in electric and electronic components such as sealing materials, sockets and connectors and other applications.

公开(公告)号：US5525704A

公开(公告)日：1996-06-11

申请号：US547517

申请日：1995-10-24

申请人： Shoji Tamai ,  Norimasa Yamaya ,  Masahiro Ohta ,  Akihiro Yamaguchi

发明人： Shoji Tamai ,  Norimasa Yamaya ,  Masahiro Ohta ,  Akihiro Yamaguchi

IPC分类号： C07C201/12 ,  C07C205/38 ,  C07C213/02 ,  C07C217/90 ,  C07D207/44 ,  C07D207/452 ,  C08G73/12 ,  C08G73/10

CPC分类号： C07D207/452 ,  C07C205/38 ,  C07C217/90 ,  C08G73/124

摘要： Disclosed is an aromatic diamine compound represented by the formula (I) ##STR1## wherein R is H or CH.sub.3. Also disclosed is a bismaleimide compound represented by the formula (IV) ##STR2## wherein R is H or CH.sub.3, A resin forming composition comprising these compounds is also disclosed. The compounds are useful as raw materials for resins, and the resin forming composition and the resin can provide excellent heat resistance and impact resistance and low hygroscopicity.

摘要翻译： 公开了由式（I）表示的芳族二胺化合物，其中R是H或CH 3。 还公开了由式（IV）表示的双马来酰亚胺化合物。其中R是H或CH 3，包含这些化合物的树脂形成组合物也被公开。 这些化合物可用作树脂的原料，树脂形成组合物和树脂可以提供优异的耐热性和耐冲击性和低吸湿性。

公开(公告)号：US5084507A

公开(公告)日：1992-01-28

申请号：US488480

申请日：1990-02-27

申请人： Norimasa Yamaya ,  Masahiro Ohta ,  Akihiro Yamaguchi

发明人： Norimasa Yamaya ,  Masahiro Ohta ,  Akihiro Yamaguchi

IPC分类号： C08G73/12 ,  C08K3/14 ,  C08K3/22 ,  C08K3/36

CPC分类号： C08K3/22 ,  C08G73/124 ,  C08G73/125 ,  C08G73/127 ,  C08K3/14 ,  C08K3/36

摘要： A thermosetting resin composition formed of a polyaminobismaleimide resin, which is composed of a bismaleimide compound and a diamine compound, and a powdery inorganic filler. The composition has excellent heat resistance as well as superb mechanical properties at high temperature not to mention room temperature, and is expected to find wide-spread commerical utility in electric and electronic components such as sealing materials, sockets and connectors and other applications.