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公开(公告)号：US5049606A
公开(公告)日：1991-09-17
申请号：US488443
申请日：1990-02-27
CPC分类号： F16J9/28 , C08G73/1046 , C08G73/1057 , C08G73/1071 , C08K3/04 , C08K3/30 , C08K3/38 , F16C33/201
摘要： A thermosetting resin composition formed of a polyaminobismaleimide resin, which is composed of a bismaleimide compound and a diamine compound, and a solid lubricant. The composition has low coefficient of friction and excellent wear resistance, and can be utilized for self-lubricating parts.
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公开(公告)号：US5051494A
公开(公告)日：1991-09-24
申请号：US511235
申请日：1990-04-19
申请人： Keizaburo Yamaguchi , Yoshimitsu Tanabe , Tatshuiro Urakami , Akihiro Yamaguchi , Norimasa Yamaya , Masahiro Ohta
发明人： Keizaburo Yamaguchi , Yoshimitsu Tanabe , Tatshuiro Urakami , Akihiro Yamaguchi , Norimasa Yamaya , Masahiro Ohta
IPC分类号： C07C211/50 , C08G73/12
CPC分类号： C08G73/121 , C07C211/50
摘要： The invention relates to an aromatic amine resin comprising a mixture of aromatic amine compounds represented by the following general formula (a): ##STR1## wherein A represents a phenylene, alkyl-substituted phenylene, diphenylene, diphenyl ether or naphthylenyl group, R.sup.1 represents a halogen atom or a hydroxyl C.sub.1-4 alkoxy or C.sub.1-5 alkyl group, l is 1 or 2, m is 0, 1, 2 or 3, n is an integer from 0 to 300 and when m is 2 or 3, the R.sup.1 group may be the same or different and may join to form a 5- or 6-membered alicyclic moiety which may optionally contain one or more side chains, and also relates to processes for producing the same and a thermosetting composition containing the same.
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公开(公告)号：US4987207A
公开(公告)日：1991-01-22
申请号：US351470
申请日：1989-05-15
IPC分类号： C08K5/3415 , C08K5/375 , C08K5/41
CPC分类号： C08K5/375 , C08K5/3415 , C08K5/41
摘要： The present invention relates to a thermosetting resin composition comprising about 100 parts by weight of a polyimide and from 5 to about 100 parts by weight of a bismaleimide having a similar structure and processes for preparing the same.
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公开(公告)号：US4937318A
公开(公告)日：1990-06-26
申请号：US254701
申请日：1988-10-07
申请人： Keizaburo Yamaguchi , Yoshimitsu Tanabe , Tatsuhiro Urakami , Akihiro Yamaguchi , Norimasa Yamaya , Masahiro Ohta
发明人： Keizaburo Yamaguchi , Yoshimitsu Tanabe , Tatsuhiro Urakami , Akihiro Yamaguchi , Norimasa Yamaya , Masahiro Ohta
IPC分类号： C07C211/50 , C08G73/12
CPC分类号： C08G73/121 , C07C211/50
摘要： The invention relates to an aromatic amine resin comprising a mixture of aromatic amine compounds represented by the following general formula (a): ##STR1## wherein A represents a phenylene, alkyl-substituted phenylene, diphenylene, diphenyl ether or napthylenyl group, R.sup.1 represents a halogen atom or a hydroxyl C.sub.1-4 alkoxy or C.sub.1 -5 alkyl group, l is 1 or 2, m is 0, 1, 2 or 3, n is an integer from 0 to 300 and when m is 2 or 3, the R.sup.1 group may be same or different and may join to form a 5- to 6-membered alicyclic moiety which may optionally contain one or more side chains, and also relates to processes for producing the same and a thermosetting composition containing the same.
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5.发明授权Aromatic diamine compounds, bismalemide compounds, thermosetting resin forming compositions therefrom, resin therefrom, and methods for their preparation 失效芳族二胺化合物，双哩组胺化合物，由其形成的热固性树脂组合物，其树脂及其制备方法
公开(公告)号：US5364967A
公开(公告)日：1994-11-15
申请号：US5276
申请日：1993-01-19
申请人： Keizaburo Yamaguchi , Tatsuhiro Urakami , Yoshimitsu Tanabe , Midori Yamazaki , Shoji Tamai , Norimasa Yamaya , Masahiro Ohta , Akihiro Yamaguchi
发明人： Keizaburo Yamaguchi , Tatsuhiro Urakami , Yoshimitsu Tanabe , Midori Yamazaki , Shoji Tamai , Norimasa Yamaya , Masahiro Ohta , Akihiro Yamaguchi
IPC分类号： C07C201/12 , C07C205/38 , C07C213/02 , C07C217/90 , C07D207/44 , C07D207/452 , C08G73/12 , C07C211/50
CPC分类号： C07D207/452 , C07C205/38 , C07C217/90 , C08G73/124
摘要： Disclosed is an aromatic diamine compound represented by the formula (I) ##STR1## wherein R is H or CH.sub.3. Also disclosed is a bismaleimide compound represented by the formula (IV) ##STR2## wherein R is H or CH.sub.3, A resin forming composition comprising these compounds is also disclosed. The compounds are useful as raw materials for resins, and the resin forming composition and the resin can provide excellent heat resistance and impact resistance and low hygroscopicity.
摘要翻译： 公开了由式（I）表示的芳族二胺化合物，其中R是H或CH 3。 还公开了由式（IV）表示的双马来酰亚胺化合物其中R是H或CH 3，其中R是H或CH 3，还公开了包含这些化合物的形成树脂的组合物。 这些化合物可用作树脂的原料，树脂形成组合物和树脂可以提供优异的耐热性和耐冲击性和低吸湿性。
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6.发明授权Aromatic amine resins, processes for producing the same and a thermosetting resin composition containing the same 失效芳族胺树脂，其制造方法和含有该组合物的热固性树脂组合物
公开(公告)号：US5106953A
公开(公告)日：1992-04-21
申请号：US511093
申请日：1990-04-19
申请人： Keizaburo Yamaguchi , Yoshimitsu Tanabe , Tatsuhiro Urakami , Akihiro Yamaguchi , Norimasa Yamaya , Masahiro Ohta
发明人： Keizaburo Yamaguchi , Yoshimitsu Tanabe , Tatsuhiro Urakami , Akihiro Yamaguchi , Norimasa Yamaya , Masahiro Ohta
IPC分类号： C07C211/50 , C08G73/12
CPC分类号： C08G73/121 , C07C211/50
摘要： The invention relates to an aromatic amine resin comprising a mixture of aromatic amine compounds represented by the following general formula (a): ##STR1## wherein A represents a phenylene, alkyl-substituted phenylene, diphenylene, diphenyl ether or naphthylenyl group, R.sup.1 represents a halogen atom or a hydroxyl C.sub.1-4 alkoxy or C.sub.1-5 alkyl group, l is 1 or 2, m is 0, 1, 2 or 3, n is an integer from 0 to 300 and when m is 2 or 3, the R.sup.1 group may be same or different and may join to form a 5- or 6-membered alicyclic moiety which may optionally contain one or more side chains, and also relates to processes for producing the same and a thermosetting composition containing the same.
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公开(公告)号：US5028641A
公开(公告)日：1991-07-02
申请号：US388638
申请日：1989-08-02
CPC分类号： C08K3/22 , C08G73/124 , C08G73/125 , C08G73/127 , C08K3/14 , C08K3/36
摘要： A thermosetting resin composition formed of a polyaminobismaleimide resin, which is composed of a bismaleimide compound and a diamine compound, and a powdery inorganic filler. The composition has excellent heat resistance as well as superb mechanical properties at high temperature not to mention room temperature, and is expected to find wide-spread commercial utility in electric and electronic components such as sealing materials, sockets and connectors and other applications.
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公开(公告)号：US5525704A
公开(公告)日：1996-06-11
申请号：US547517
申请日：1995-10-24
申请人： Shoji Tamai , Norimasa Yamaya , Masahiro Ohta , Akihiro Yamaguchi
发明人： Shoji Tamai , Norimasa Yamaya , Masahiro Ohta , Akihiro Yamaguchi
IPC分类号： C07C201/12 , C07C205/38 , C07C213/02 , C07C217/90 , C07D207/44 , C07D207/452 , C08G73/12 , C08G73/10
CPC分类号： C07D207/452 , C07C205/38 , C07C217/90 , C08G73/124
摘要： Disclosed is an aromatic diamine compound represented by the formula (I) ##STR1## wherein R is H or CH.sub.3. Also disclosed is a bismaleimide compound represented by the formula (IV) ##STR2## wherein R is H or CH.sub.3, A resin forming composition comprising these compounds is also disclosed. The compounds are useful as raw materials for resins, and the resin forming composition and the resin can provide excellent heat resistance and impact resistance and low hygroscopicity.
摘要翻译： 公开了由式（I）表示的芳族二胺化合物，其中R是H或CH 3。 还公开了由式（IV）表示的双马来酰亚胺化合物。其中R是H或CH 3，包含这些化合物的树脂形成组合物也被公开。 这些化合物可用作树脂的原料，树脂形成组合物和树脂可以提供优异的耐热性和耐冲击性和低吸湿性。
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公开(公告)号：US5484948A
公开(公告)日：1996-01-16
申请号：US284103
申请日：1994-08-02
申请人： Keizaburo Yamaguchi , Tatsuhiro Urakami , Yoshimitsu Tanabe , Midori Yamazaki , Shoji Tamai , Norimasa Yamaya , Masahiro Ohta , Akihiro Yamaguchi
发明人： Keizaburo Yamaguchi , Tatsuhiro Urakami , Yoshimitsu Tanabe , Midori Yamazaki , Shoji Tamai , Norimasa Yamaya , Masahiro Ohta , Akihiro Yamaguchi
IPC分类号： C07C201/12 , C07C205/38 , C07C213/02 , C07C217/90 , C07D207/44 , C07D207/452 , C08G73/12 , C07D207/444
CPC分类号： C07D207/452 , C07C205/38 , C07C217/90 , C08G73/124
摘要： Disclosed is an aromatic diamine compound represented by the formula (I) ##STR1## wherein R is H or CH.sub.3. Also disclosed is a bismaleimide compound represented by the formula (IV) ##STR2## wherein R is H or CH.sub.3, A resin forming composition comprising these compounds is also disclosed. The compounds are useful as raw materials for resins, and the resin forming composition and the resin can provide excellent heat resistance and impact resistance and low hygroscopicity.
摘要翻译： 公开了由式（I）表示的芳族二胺化合物，其中R是H或CH 3。 还公开了由式（IV）表示的双马来酰亚胺化合物。其中R是H或CH 3，包含这些化合物的树脂形成组合物也被公开。 这些化合物可用作树脂的原料，树脂形成组合物和树脂可以提供优异的耐热性和耐冲击性和低吸湿性。
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10.发明授权Aromatic diamine compounds, bismaleimide compounds, thermosetting resin forming compositions therefrom, resins therefrom, and methods for their preparation 失效芳族二胺化合物，双马来酰亚胺化合物，形成其组合物的热固性树脂，其树脂及其制备方法
公开(公告)号：US5206438A
公开(公告)日：1993-04-27
申请号：US601424
申请日：1990-10-23
申请人： Keizaburo Yamaguchi , Tatsuhiro Urakami , Yoshimitsu Tanabe , Midori Yamazaki , Shoji Tamai , Norimasa Yamaya , Masahiro Ohta , Akihiro Yamaguchi
发明人： Keizaburo Yamaguchi , Tatsuhiro Urakami , Yoshimitsu Tanabe , Midori Yamazaki , Shoji Tamai , Norimasa Yamaya , Masahiro Ohta , Akihiro Yamaguchi
IPC分类号： C07C201/12 , C07C205/38 , C07C213/02 , C07C217/90 , C07D207/44 , C07D207/452 , C08G73/12
CPC分类号： C07D207/452 , C07C205/38 , C07C217/90 , C08G73/124
摘要： Disclosed is an aromatic diamine compound represented by the formula (I) ##STR1## wherein R is H or CH.sub.3. Also disclosed is a bismaleimide compound represented by the formula (IV) ##STR2## wherein R is H or CH.sub.3, A resin forming composition comprising these compounds is also disclosed. The compounds are useful as raw materials for resins, and the resin forming composition and the resin can provide excellent heat resistance and impact resistance and low hygroscopicity.
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