摘要:
The present invention provides a novel compound and a composition including the compound that exhibit small polymerization shrinkage particularly during curing and are producible at low cost on the industrial scale. The compound of the present invention is represented by Formula (1):
摘要:
The present invention provides a novel compound and a composition including the compound that exhibit small polymerization shrinkage particularly during curing and are producible at low cost on the industrial scale. The compound of the present invention is represented by Formula (1):
摘要:
A pyrromethene-boron complex compound represented by the following formula (1); wherein Z1 and Z2 are independently a hydrogen atom, a substituted or unsubstituted aryl group, a substituted or unsubstituted alkoxy group or a substituted or unsubstituted aryloxy group, at least one of Z1 and Z2 is an alkoxy group substituted with a fluorine atom or an aryloxy group substituted with a fluorine atom or a fluoroalkyl group, and Z1 and Z2 may form a ring.
摘要:
Provided are a color-developing agent comprising a multivalent metal salt of a salicylic acid derivative and a sulfonated phenol and/or a metal salt thereof and having excellent initial and ultimate color-developing capacities and improved waterproofness; and a color-developing sheet making use of the color-developing agent.
摘要:
The heat-sensitive recording material disclosed comprises a colorless or pale colored dyestuff precursor, one or more salicylic acid derivative of the formula (1) or metal salt of the derivative and an aliphatic amide compound having 18.about.60 carbon atoms in molecular structure, and is excellent in thermal response and preservation stability of white portions and images. ##STR1## wherein X.sub.1 and X.sub.2 are a hydrogen atom, a halogen atom, an alkyl group, an alkoxy group, an aralkyl group or an aryl group, Y.sub.1 and Y.sub.2 are an oxygen atom or a sulfur atom, R.sub.1 is a hydrogen atom, an alkyl group, an aralkyl group or an aryl group, and R.sub.2 is an alkyl group, an alkenyl group, an aralkyl group or an aryl group.
摘要:
Disclosed herein is an aromatic amine resin formed of a mixture of aromatic amine compounds represented by the following general formula (a): ##STR1## wherein A means a phenylene, alkyl-substituted phenylene, diphenylene, diphenyl ether or naphthylenyl group, R.sup.1 denotes a halogen atom or a hydroxyl, C.sub.1-4 alkoxy or C.sub.1-5 alkyl group, l stands for 1 or 2, m is an integer of 0-3, when m is 2 or 3, R.sup.1 s may be the same or different and two of R.sup.1 s may join together into a 5- to 6-membered alicyclic moiety which may optionally contain one or more side chains, and n stands for an integer of 0-300.
摘要:
Heat-resistant epoxy resin composition obtained by incorporation of 2-(4-hydroxyphenyl)-2-(4-maleimidophenyl)propane in a resin composition consisting esssentially of epoxy resin and an epoxy hardener is disclosed.
摘要:
Disclosed herein are novel multivalent metal-modified salicyclic acid resins useful as color-developing agents for pressure-sensitive copying paper. They can each be produced by causing a salicyclic acid ester and a styrene derivative to undergo a Friedel-Crafts reaction in the presence of a strong acid catalyst, hydrolyzing the resulting salicylic acid ester resin, and then reacting the thus-obtained salicyclic acid resin with a multivalent metal salt.
摘要:
4-Fluorobenzophenone derivatives of 4,4'-difluorobenzophenone are produced by effecting a halogen-fluorine exchanging reaction between the corresponding 4-halogenobenzophenone derivatives or 4,4'-dihalogenobenzophenone and an alkali fluoride.The reaction is carried out by heating in an organic solvent. After distilling off the solvent from the reaction product mixture, the end product is isolated by extracting with a solvent. Alternatively the end product is isolated by distillation.
摘要:
Disclosed is an aromatic diamine compound represented by the formula (I) ##STR1## wherein R is H or CH.sub.3. Also disclosed is a bismaleimide compound represented by the formula (IV) ##STR2## wherein R is H or CH.sub.3, A resin forming composition comprising these compounds is also disclosed. The compounds are useful as raw materials for resins, and the resin forming composition and the resin can provide excellent heat resistance and impact resistance and low hygroscopicity.