摘要:
A modified phenolic resin that is an alternate copolymer of at least one phenolic compound selected from phenol, naphthols, and their derivatives and a compound having a divalent connecting group, said modified phenolic resin having a side chain attached to an aromatic ring having a hydroxy group, said side chain being represented by defined formula (1-1). The modified phenolic resin can be used as a hardener for epoxy resins and a cured product thereof has excellent adhesion and flame retardancy without impairing properties of conventional phenolic resins such as gel time, glass transition temperature, moisture absorption, and mechanical properties. The epoxy resin composition can provide excellent adhesion and flame retardancy as hardeners for semiconductor sealing epoxy resins, insulating materials for electrical/electronic components, and laminates (printed circuit boards). A prepreg containing a glass substrate impregnated with the epoxy resin composition, a laminate, and an electronic circuit board are also provided.
摘要:
Disclosed is an aromatic diamine compound represented by the formula (I) ##STR1## wherein R is H or CH.sub.3. Also disclosed is a bismaleimide compound represented by the formula (IV) ##STR2## wherein R is H or CH.sub.3, A resin forming composition comprising these compounds is also disclosed. The compounds are useful as raw materials for resins, and the resin forming composition and the resin can provide excellent heat resistance and impact resistance and low hygroscopicity.
摘要:
The invention relates to an aromatic amine resin comprising a mixture of aromatic amine compounds represented by the following general formula (a): ##STR1## wherein A represents a phenylene, alkyl-substituted phenylene, diphenylene, diphenyl ether or naphthylenyl group, R.sup.1 represents a halogen atom or a hydroxyl C.sub.1-4 alkoxy or C.sub.1-5 alkyl group, l is 1 or 2, m is 0, 1, 2 or 3, n is an integer from 0 to 300 and when m is 2 or 3, the R.sup.1 group may be same or different and may join to form a 5- or 6-membered alicyclic moiety which may optionally contain one or more side chains, and also relates to processes for producing the same and a thermosetting composition containing the same.
摘要:
A polylactic acid resin composition containing 100 parts by weight of a polylactic acid compound (A) having a specific moiety represented by the formula (1): —X1—R1—X2— and having a weight average molecular weight (Mw) of 5,000 to 500,000, 5 to 2,000 parts by weight of a lactic acid resin (B) and 0.1 to 10 parts by weight of at least one kind of a transparent nucleating agent (C) selected from carboxylic acid amides, aliphatic alcohols and aliphatic carboxylic acid esters. In the formula (1), X1, X2 and R1 are defined. The resin composition can exhibit improved heat resistance (high crystallinity) and transparency without impairing the rigidity of the polylactic acid resin. A molded article composed of the resin composition is also provided.
摘要:
It is an object of the present invention to provide a resin composition having improved heat resistance (high crystallinity) and transparency without impairing rigidity intrinsic to a polylactic acid based resin, a molded body formed from the resin composition, and a new polylactic acid based resin used in the resin composition. A polylactic acid based resin (A) according to the present invention is characterized by having a specific structural moiety and a weight average molecular weight (Mw) of 5,000 to 1,000,000. A polylactic acid based resin composition according to the present invention is characterized by containing the above-described polylactic acid based resin (A).
摘要:
It is an object of the present invention to provide a resin composition having improved heat resistance (high crystallinity) and transparency without impairing rigidity intrinsic to a polylactic acid based resin, a molded body formed from the resin composition, and a new polylactic acid based resin used in the resin composition. A polylactic acid based resin (A) according to the present invention is characterized by having a specific structural moiety and a weight average molecular weight (Mw) of 5,000 to 1,000,000. A polylactic acid based resin composition according to the present invention is characterized by containing the above-described polylactic acid based resin (A).
摘要:
An object of the present invention is to provide a resin composition having improved heat resistance (high crystallinity) and transparency without impairing rigidity which a polylactic acid resin inherently has, and a molded article composed of the resin composition. A polylactic acid resin composition of the present invention contains 100 parts by weight of a polylactic acid compound (A) having a specific moiety represented by the formula (1): -X1—R1—X2- and having a weight average molecular weight (Mw) of 5,000 to 500,000, 5 to 2,000 parts by weight of a lactic acid resin (B) and 0.1 to 10 parts by weight of at least one kind of a transparent nucleating agent (C) selected from carboxylic acid amides, aliphatic alcohols and aliphatic carboxylic acid esters. In the formula (1), X1 and X2 each independently represent an oxygen atom, a sulfur atom or an NH group, R1 represents an aliphatic hydrocarbon group having a weight average molecular weight of 25 to 50,000 without containing a ring structure, and the hydrocarbon group may contain an oxygen atom, a nitrogen atom or a sulfur atom.
摘要:
The modified phenolic resin of the present invention has a specific structure in which a side chain of an aromatic ring having a hydroxyl group in a phenolic resin that is an alternate copolymer of a phenolic compound and a compound having a divalent connecting group, is substituted with a group represented by general formula (1-1). By using the modified phenolic resin as a hardener for epoxy resins, there are provided an epoxy resin, a composition thereof, and a cured product thereof having excellent adhesion and flame retardancy without impairing properties of conventional phenolic resins such as gel time, glass transition temperature, moisture absorption, and mechanical properties. (In the formula, R1 represents a C1-8 linear, branched, or cyclic hydrocarbon group.) The present invention provides an epoxy resin composition with excellent adhesion and flame retardancy in uses such as hardeners for semiconductor sealing epoxy resins, insulating materials for electrical/electronic components, and laminates (printed circuit boards). A prepreg containing a glass substrate impregnated with the epoxy resin composition, a laminate, and an electronic circuit board are also provided.
摘要:
An epoxy resin composition comprising an epoxy resin (A), a curing agent (B) and a curing accelerator (C), wherein the curing agent (B) is a phenol compound having two or more hydroxyl functional groups or a compound obtained by esterification of the phenol compound or a mixture of these compounds, and the curing accelerator (C) is a salt of a phosphazenium compound represented by a formula (I): (wherein R1s each represent a hydrogen atom, a linear, branched or cyclic alkyl group having 1 to 10 carbon atoms or an aryl or aralkyl group having 6 to 10 carbon atoms and may be all the same or different from one another; and Z− represents a halogen anion, hydroxy anion, alkoxy anion, aryloxy anion or carboxy anion).
摘要:
An epoxy-resin composition comprising (A) an at least bifunctional epoxy compound and/or an at least bifunctional epoxy resin, (B) an at least bifunctional ester-containing compound and/or an at least bifunctional ester-containing resin as a curing agent, 10 to 100% of whose hydroxy groups are esterified with aliphatic or aromatic acyl groups, and (C) an accelerating agent, the accelerating agent essentially containing a phosphine oxide represented by general formula (1): where R1 to R6 all of which may be the same or not are hydrogen, straight, branched or cyclic alkyl having 1 to 10 carbons or aryl or aralkyl having 6 to 10 carbons.