摘要:
a CCP-type thin-film magnetic head and a manufacturing method thereof are provided. The CCP-type thin-film magnetic head includes a thin-film magnetic head element formed between the upper shield layer and the lower shield layer, and a side fill gap layer securing the insulating property, which is formed from both end faces of the thin-film magnetic head element, wherein a top surface of the lower shield layer is formed in a non-flat surface having a convex portion disposed at a center in a track width direction and a concave portion disposed at both sides in a track width direction of the convex portion, the thin-film magnetic head element is formed on the convex portion, and an buried gap layer contacting the side fill gap layer is formed in the concave portion.
摘要:
There is provided a magnetic detecting element and a method of manufacturing the same. An intermediate layer and a corrosion preventing layer are laminated on a free magnetic layer. The corrosion preventing layer prevents the free magnetic layer from corroding due to reactive ion etching. Therefore, a laminator can be correspondingly formed in a predetermined shape, and the free magnetic layer can be prevented from corroding. As a result, it is possible to manufacture a magnetic detecting element having excellent reproduction output.
摘要:
A magnetic sensing element including a laminate and a bias layer is provided. A first reactive-ion-etching (RIE) stop layer is disposed on a free magnetic layer. Second RIE stop layers are disposed on bias layers. The first and second RIE stop layers function as stop layers when layers on the first and second RIE stop layers are removed by reactive ion etching in a production process. Reactive ion etching is completed when the first RIE stop layer and the second RIE stop layers are exposed, the first and second RIE stop layers being disposed at almost the same height. Also provided is a process for producing the magnetic sensing element.
摘要:
A magnetic sensing element including a laminate and a bias layer is provided. A first reactive-ion-etching (RIE) stop layer is disposed on a free magnetic layer. Second RIE stop layers are disposed on bias layers. The first and second RIE stop layers function as stop layers when layers on the first and second RIE stop layers are removed by reactive ion etching in a production process. Reactive ion etching is completed when the first RIE stop layer and the second RIE stop layers are exposed, the first and second RIE stop layers being disposed at almost the same height. Also provided is a process for producing the magnetic sensing element.
摘要:
A CPP giant magnetoresistive head includes a lower shield layer; an upper shield layer; and a giant magnetoresistive element (GMR) between the lower shield layer and the upper shield layer. The GMR includes a nonmagnetic material layer; a pinned magnetic layer; and a free magnetic layer. The pinned layer and the free layer are laminated with the nonmagnetic layer provided therebetween. A current flows perpendicularly to a film plane of the GMR, the pinned magnetic layer extends in the height direction longer than in a track-width direction and includes a first portion in the GMR. The first portion is disposed above or below the nonmagnetic layer and the free layer. A second portion is behind the nonmagnetic layer and the free layer in the height direction. The first and second portions are in the same plane. The width of the pinned layer in the track-width direction in the first portion is greater than that in the second portion.
摘要:
A CPP giant magnetoresistive head includes a lower shield layer; an upper shield layer; and a giant magnetoresistive element (GMR) between the lower shield layer and the upper shield layer. The GMR includes a nonmagnetic material layer; a pinned magnetic layer; and a free magnetic layer. The pinned layer and the free layer are laminated with the nonmagnetic layer provided therebetween. A current flows perpendicularly to a film plane of the GMR, the pinned magnetic layer extends in the height direction longer than in a track-width direction and includes a first portion in the GMR. The first portion is disposed above or below the nonmagnetic layer and the free layer. A second portion is behind the nonmagnetic layer and the free layer in the height direction. The first and second portions are in the same plane. The width of the pinned layer in the track-width direction in the first portion is greater than that in the second portion.
摘要:
A lower shield layer has a substantially flat shape, and an upper shield layer has a front portion and a rear portion, where the front portion is disposed closer to the lower shield layer than the rear portion. A lower conductive electrode and an upper conductive electrode are disposed between the lower shield layer and the upper shield layer. The lower conductive electrode is electrically connected to the lower shield layer, and the upper conductive electrode is electrically connected to the upper shield layer. Since the lower and upper conductive electrodes are disposed between the upper and lower shield layers, each of the lower shield layer and the upper shield layer may be formed to have a small area and a simple shape.
摘要:
On a multilayer film formed on a lower electrode layer, a resist layer having cutaway parts at a lower portion is formed, and on parts of the upper surface of the multilayer film which are not overlapped with the resist layer except for areas inside the cutaway parts, first gap layers are formed. Accordingly, a predetermined gap T1 can be formed between the first gap layers in the track width direction. Next, in the following step, two end surfaces of the multilayer film and the first gap layers in the track width direction are milled. Hence, according to the present invention, compared to the case in the past, the predetermined gap T1 provided between the first gap layers can be formed into a minute size with superior accuracy, the current path-squeezing structure can be easily formed, and a magnetic sensor having superior change in resistance (ΔR) and reproduction output can be manufactured.
摘要:
A lower shield layer and an upper shield layer are formed to have a planar shape, and a detecting element is provided between the lower shield layer and the upper shield layer. End faces of the upper shield layer may extend farther in a depthwise direction from a surface facing a recording medium than end faces of the lower shield layer. A lower conductive electrode may be disposed directly adjacent to a facing inner surface of the lower shield layer. An upper conductive electrode may be disposed adjacent to a portion of the upper shield layer. Therefore, the lower shield layer and the upper conductive electrode may be insulated from each other.
摘要:
A lower shield layer and an upper shield layer are formed to have a planar shape, and a detecting element is provided between the lower shield layer and the upper shield layer. A lower conductive electrode is formed to adhere closely to a facing inner surface corresponding to a top surface of the lower shield layer, and an upper conductive electrode is formed to adhere closely to an outer surface located on the upper shield layer. Therefore, even though a facing interval between the lower shield layer and the upper shield layer is small, an electrical insulating property may be achieved.