公开(公告)号：US20080033117A1

公开(公告)日：2008-02-07

申请号：US11889900

申请日：2007-08-17

申请人： Kenji Ishii ,  Yasumasa Norisue ,  Kiyonari Hiramatsu ,  Makoto Miyamoto ,  Makoto Yamazaki ,  Daisuke Ohno

发明人： Kenji Ishii ,  Yasumasa Norisue ,  Kiyonari Hiramatsu ,  Makoto Miyamoto ,  Makoto Yamazaki ,  Daisuke Ohno

IPC分类号： C08G65/38 ,  C08F283/08

CPC分类号： C08L63/00 ,  C08F283/08 ,  C08G59/00 ,  C08G59/06 ,  C08G59/40 ,  C08G65/485 ,  C08G2650/34 ,  C08L71/12 ,  C08L71/126 ,  C08L79/04 ,  H05K1/0326 ,  H05K3/285 ,  H05K3/4676 ,  H05K2201/0209 ,  Y10T428/24994 ,  Y10T428/31511 ,  Y10T428/31529 ,  C08L2666/02 ,  C08L2666/22

摘要： The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. The resins and resin compositions of the present invention are used in electronics fields in which a low dielectric constant, a low dielectric loss tangent and high toughness are required and also used for various uses such as coating, bonding and molding.

公开(公告)号：US07560518B2

公开(公告)日：2009-07-14

申请号：US12155088

申请日：2008-05-29

申请人： Kenji Ishii ,  Yasumasa Norisue ,  Kiyonari Hiramatsu ,  Makoto Miyamoto ,  Makoto Yamazaki ,  Daisuke Ohno

发明人： Kenji Ishii ,  Yasumasa Norisue ,  Kiyonari Hiramatsu ,  Makoto Miyamoto ,  Makoto Yamazaki ,  Daisuke Ohno

IPC分类号： C08G65/44 ,  C08G65/48 ,  C08L71/12

CPC分类号： C08L63/00 ,  C08F283/08 ,  C08G59/00 ,  C08G59/06 ,  C08G59/40 ,  C08G65/485 ,  C08G2650/34 ,  C08L71/12 ,  C08L71/126 ,  C08L79/04 ,  H05K1/0326 ,  H05K3/285 ,  H05K3/4676 ,  H05K2201/0209 ,  Y10T428/24994 ,  Y10T428/31511 ,  Y10T428/31529 ,  C08L2666/02 ,  C08L2666/22

摘要： The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. The resins and resin compositions of the present invention are used in electronics fields in which a low dielectric constant, a low dielectric loss tangent and high toughness are required and also used for various uses such as coating, bonding and molding.

摘要翻译： 本发明提供了在每个末端具有热固性官能团的双官能亚苯基醚低聚物化合物，含有上述低聚物化合物的环氧树脂及其用途。 也就是说，提供了用于密封电气部件的密封型环氧树脂组合物，层压体用环氧树脂组合物，层压体，印刷线路板，固化性树脂组合物和感光性树脂组合物。 本发明的树脂和树脂组合物用于需要低介电常数，低介电损耗角正切和高韧性的电子领域中，并且还用于各种用途如涂布，粘合和模塑。

公开(公告)号：US20100048826A1

公开(公告)日：2010-02-25

申请号：US12588884

申请日：2009-10-30

申请人： Kenji Ishii ,  Yasumasa Norisue ,  Kiyonari Hiramatsu ,  Makoto Miyamoto ,  Makoto Yamazaki ,  Daisuke Ohno

发明人： Kenji Ishii ,  Yasumasa Norisue ,  Kiyonari Hiramatsu ,  Makoto Miyamoto ,  Makoto Yamazaki ,  Daisuke Ohno

IPC分类号： C08L71/10 ,  C08G65/38

CPC分类号： C08L63/00 ,  C08F283/08 ,  C08G59/00 ,  C08G59/06 ,  C08G59/40 ,  C08G65/485 ,  C08G2650/34 ,  C08L71/12 ,  C08L71/126 ,  C08L79/04 ,  H05K1/0326 ,  H05K3/285 ,  H05K3/4676 ,  H05K2201/0209 ,  Y10T428/24994 ,  Y10T428/31511 ,  Y10T428/31529 ,  C08L2666/02 ,  C08L2666/22

摘要： The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. The resins and resin compositions of the present invention are used in electronics fields in which a low dielectric constant, a low dielectric loss tangent and high toughness are required and also used for various uses such as coating, bonding and molding.

摘要翻译： 本发明提供了在每个末端具有热固性官能团的双官能亚苯基醚低聚物化合物，含有上述低聚物化合物的环氧树脂及其用途。 也就是说，提供了用于密封电气部件的密封型环氧树脂组合物，层压体用环氧树脂组合物，层压体，印刷线路板，固化性树脂组合物和感光性树脂组合物。 本发明的树脂和树脂组合物用于需要低介电常数，低介电损耗角正切和高韧性的电子领域中，并且还用于各种用途如涂布，粘合和模塑。

公开(公告)号：US07632912B2

公开(公告)日：2009-12-15

申请号：US12385837

申请日：2009-04-21

申请人： Kenji Ishii ,  Yasumasa Norisue ,  Kiyonari Hiramatsu ,  Makoto Miyamoto ,  Makoto Yamazaki ,  Daisuke Ohno

发明人： Kenji Ishii ,  Yasumasa Norisue ,  Kiyonari Hiramatsu ,  Makoto Miyamoto ,  Makoto Yamazaki ,  Daisuke Ohno

IPC分类号： G08G59/14 ,  G08G65/332 ,  G08G65/40 ,  C08L63/10 ,  C08L71/12

CPC分类号： C08L63/00 ,  C08F283/08 ,  C08G59/00 ,  C08G59/06 ,  C08G59/40 ,  C08G65/485 ,  C08G2650/34 ,  C08L71/12 ,  C08L71/126 ,  C08L79/04 ,  H05K1/0326 ,  H05K3/285 ,  H05K3/4676 ,  H05K2201/0209 ,  Y10T428/24994 ,  Y10T428/31511 ,  Y10T428/31529 ,  C08L2666/02 ,  C08L2666/22

摘要： The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. The resins and resin compositions of the present invention are used in electronics fields in which a low dielectric constant, a low dielectric loss tangent and high toughness are required and also used for various uses such as coating, bonding and molding.

摘要翻译： 本发明提供了在每个末端具有热固性官能团的双官能亚苯基醚低聚物化合物，含有上述低聚物化合物的环氧树脂及其用途。 也就是说，提供了用于密封电气部件的密封型环氧树脂组合物，层压体用环氧树脂组合物，层压体，印刷线路板，固化性树脂组合物和感光性树脂组合物。 本发明的树脂和树脂组合物用于需要低介电常数，低介电损耗角正切和高韧性的电子领域中，并且还用于各种用途如涂布，粘合和模塑。

公开(公告)号：US07276563B2

公开(公告)日：2007-10-02

申请号：US10980246

申请日：2004-11-04

申请人： Kenji Ishii ,  Yasumasa Norisue ,  Kiyonari Hiramatsu ,  Makoto Miyamoto ,  Makoto Yamazaki ,  Daisuke Ohno

发明人： Kenji Ishii ,  Yasumasa Norisue ,  Kiyonari Hiramatsu ,  Makoto Miyamoto ,  Makoto Yamazaki ,  Daisuke Ohno

IPC分类号： B32B27/04 ,  B32B27/38 ,  C08K3/36 ,  C08L63/00 ,  C08L71/12

CPC分类号： C08L63/00 ,  C08F283/08 ,  C08G59/00 ,  C08G59/06 ,  C08G59/40 ,  C08G65/485 ,  C08G2650/34 ,  C08L71/12 ,  C08L71/126 ,  C08L79/04 ,  H05K1/0326 ,  H05K3/285 ,  H05K3/4676 ,  H05K2201/0209 ,  Y10T428/24994 ,  Y10T428/31511 ,  Y10T428/31529 ,  C08L2666/02 ,  C08L2666/22

摘要： The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. The resins and resin compositions of the present invention are used in electronics fields in which a low dielectric constant, a low dielectric loss tangent and high toughness are required and also used for various uses such as coating, bonding and molding.

摘要翻译： 本发明提供了在每个末端具有热固性官能团的双官能亚苯基醚低聚物化合物，含有上述低聚物化合物的环氧树脂及其用途。 也就是说，提供了用于密封电气部件的密封型环氧树脂组合物，层压体用环氧树脂组合物，层压体，印刷线路板，固化性树脂组合物和感光性树脂组合物。 本发明的树脂和树脂组合物用于需要低介电常数，低介电损耗角正切和高韧性的电子领域中，并且还用于各种用途如涂布，粘合和模塑。

公开(公告)号：US06995195B2

公开(公告)日：2006-02-07

申请号：US10626569

申请日：2003-07-25

申请人： Kenji Ishii ,  Yasumasa Norisue ,  Daisuke Ohno ,  Makoto Miyamoto

发明人： Kenji Ishii ,  Yasumasa Norisue ,  Daisuke Ohno ,  Makoto Miyamoto

IPC分类号： C08F16/12 ,  C07C43/215

CPC分类号： C08K5/06 ,  C08F290/062 ,  C08F299/022 ,  C08G65/485 ,  C08L71/126

摘要： There are provided a vinyl compound which is excellent in heat resistance and electric characteristics and excellent in reactivity by introducing a vinyl group into a terminal of a bifunctional polyphenylene ether oligomer, and a cured product thereof which has a high glass transition temperature, has a low dielectric constant and a low dielectric loss tangent and has the excellent properties of polyphenylene ether.

摘要翻译： 提供一种乙烯基化合物，其具有优异的耐热性和电特性，并且通过将乙烯基引入双官能聚苯醚低聚物的末端和其玻璃化转变温度高的固化产物具有低的反应性 介电常数和低介电损耗角正切，具有优异的聚苯醚性能。

公开(公告)号：US20090205856A1

公开(公告)日：2009-08-20

申请号：US12385837

申请日：2009-04-21

申请人： Kenji Ishii ,  Yasumasa Norisue ,  Kiyonari Hiramatsu ,  Makoto Miyamoto ,  Makoto Yamazaki ,  Daisuke Ohno

发明人： Kenji Ishii ,  Yasumasa Norisue ,  Kiyonari Hiramatsu ,  Makoto Miyamoto ,  Makoto Yamazaki ,  Daisuke Ohno

IPC分类号： H05K1/00 ,  C07D303/20 ,  C08G73/00 ,  C08F283/04 ,  C08L63/00

CPC分类号： C08L63/00 ,  C08F283/08 ,  C08G59/00 ,  C08G59/06 ,  C08G59/40 ,  C08G65/485 ,  C08G2650/34 ,  C08L71/12 ,  C08L71/126 ,  C08L79/04 ,  H05K1/0326 ,  H05K3/285 ,  H05K3/4676 ,  H05K2201/0209 ,  Y10T428/24994 ,  Y10T428/31511 ,  Y10T428/31529 ,  C08L2666/02 ,  C08L2666/22

摘要： The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. The resins and resin compositions of the present invention are used in electronics fields in which a low dielectric constant, a low dielectric loss tangent and high toughness are required and also used for various uses such as coating, bonding and molding.

摘要翻译： 本发明提供了在每个末端具有热固性官能团的双官能亚苯基醚低聚物化合物，含有上述低聚物化合物的环氧树脂及其用途。 也就是说，提供了用于密封电气部件的密封型环氧树脂组合物，层压体用环氧树脂组合物，层压体，印刷线路板，固化性树脂组合物和感光性树脂组合物。 本发明的树脂和树脂组合物用于需要低介电常数，低介电损耗角正切和高韧性的电子领域中，并且还用于各种用途如涂布，粘合和模塑。

公开(公告)号：US20050090624A1

公开(公告)日：2005-04-28

申请号：US10963808

申请日：2004-10-14

申请人： Yasumasa Norisue ,  Makoto Miyamoto ,  Daisuke Ohno ,  Kenji Ishii ,  Michio Nawata

发明人： Yasumasa Norisue ,  Makoto Miyamoto ,  Daisuke Ohno ,  Kenji Ishii ,  Michio Nawata

IPC分类号： C07C37/64 ,  C07C41/16 ,  C07C43/20 ,  C07C43/215 ,  C08F290/06 ,  C08G65/48 ,  C08F283/08

CPC分类号： C08G65/48 ,  C07C41/16 ,  C08F290/062 ,  C08G65/485 ,  C07C43/215

摘要： A process for the production of a vinyl compound of the formula (1), which process comprises reacting a bifunctional phenylene ether oligomer of the formula (2) with a vinylbenzyl halide in an aprotic polar solvent in the presence of an alkali metal alkoxide and then adding the reaction solution to water or a water/alcohol mixed solution to precipitate a solid

摘要翻译： 一种制备式（1）的乙烯基化合物的方法，该方法包括在碱性金属醇盐的存在下，使非离子极性溶剂中的式（2）的双官能亚苯基醚低聚物与乙烯基苄基卤反应，然后 将反应溶液加入水或水/醇混合溶液中以沉淀固体

公开(公告)号：US06835785B2

公开(公告)日：2004-12-28

申请号：US10352232

申请日：2003-01-28

申请人： Kenji Ishii ,  Yasumasa Norisue ,  Kiyonari Hiramatsu ,  Makoto Miyamoto ,  Makoto Yamazaki ,  Daisuke Ohno

发明人： Kenji Ishii ,  Yasumasa Norisue ,  Kiyonari Hiramatsu ,  Makoto Miyamoto ,  Makoto Yamazaki ,  Daisuke Ohno

IPC分类号： C08F28308

CPC分类号： C08L63/00 ,  C08F283/08 ,  C08G59/00 ,  C08G59/06 ,  C08G59/40 ,  C08G65/485 ,  C08G2650/34 ,  C08L71/12 ,  C08L71/126 ,  C08L79/04 ,  H05K1/0326 ,  H05K3/285 ,  H05K3/4676 ,  H05K2201/0209 ,  Y10T428/24994 ,  Y10T428/31511 ,  Y10T428/31529 ,  C08L2666/02 ,  C08L2666/22

摘要： The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. The resins and resin compositions of the present invention are used in electronics fields in which a low dielectric constant, a low dielectric loss tangent and high toughness are required and also used for various uses such as coating, bonding and molding.

摘要翻译： 本发明提供了在每个末端具有热固性官能团的双官能亚苯基醚低聚物化合物，含有上述低聚物化合物的环氧树脂及其用途。 也就是说，提供了用于密封电气部件的密封型环氧树脂组合物，层压体用环氧树脂组合物，层压体，印刷线路板，固化性树脂组合物和感光性树脂组合物。 本发明的树脂和树脂组合物用于需要低介电常数，低介电损耗角正切和高韧性的电子领域中，并且还用于各种用途如涂布，粘合和模塑。

公开(公告)号：US20080269427A1

公开(公告)日：2008-10-30

申请号：US12155088

申请日：2008-05-29

申请人： Kenji Ishii ,  Yasumasa Norisue ,  Kiyonari Hiramatsu ,  Makoto Miyamoto ,  Makoto Yamazaki ,  Daisuke Ohno

发明人： Kenji Ishii ,  Yasumasa Norisue ,  Kiyonari Hiramatsu ,  Makoto Miyamoto ,  Makoto Yamazaki ,  Daisuke Ohno

IPC分类号： C08G65/38 ,  C08F283/08

CPC分类号： C08L63/00 ,  C08F283/08 ,  C08G59/00 ,  C08G59/06 ,  C08G59/40 ,  C08G65/485 ,  C08G2650/34 ,  C08L71/12 ,  C08L71/126 ,  C08L79/04 ,  H05K1/0326 ,  H05K3/285 ,  H05K3/4676 ,  H05K2201/0209 ,  Y10T428/24994 ,  Y10T428/31511 ,  Y10T428/31529 ,  C08L2666/02 ,  C08L2666/22

摘要： The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. The resins and resin compositions of the present invention are used in electronics fields in which a low dielectric constant, a low dielectric loss tangent and high toughness are required and also used for various uses such as coating, bonding and molding.

摘要翻译： 本发明提供了在每个末端具有热固性官能团的双官能亚苯基醚低聚物化合物，含有上述低聚物化合物的环氧树脂及其用途。 也就是说，提供了用于密封电气部件的密封型环氧树脂组合物，层压体用环氧树脂组合物，层压体，印刷线路板，固化性树脂组合物和感光性树脂组合物。 本发明的树脂和树脂组合物用于需要低介电常数，低介电损耗角正切和高韧性的电子领域中，并且还用于各种用途如涂布，粘合和模塑。