公开(公告)号：US5261989A

公开(公告)日：1993-11-16

申请号：US823873

申请日：1992-01-22

申请人： Kenneth M. Ueltzen

发明人： Kenneth M. Ueltzen

IPC分类号： H01R43/02 ,  H01R43/20 ,  H05K1/11 ,  H05K3/34 ,  H05K3/42 ,  B32B31/00

CPC分类号： H01R43/205 ,  H01R43/0256 ,  H05K1/117 ,  H05K3/3405 ,  H05K2201/09481 ,  H05K2201/10189 ,  H05K2203/042 ,  H05K2203/0455 ,  H05K3/42 ,  Y10T156/1056 ,  Y10T29/49002 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49183

摘要： A method and apparatus for bonding electrical conducting means having a body, a first lead, and a second lead to a printed circuit board having a first side and a second side. A first surface mount pad is formed on the first side of the printed circuit board. A reservoir pad is formed on the first side of the printed circuit board. A second surface mount pad is formed on the second side of the printed circuit board. A via hole is formed in the printed circuit board. The via hole runs from the first side to the second side of the printed circuit board. The via hole abuts the reservoir pad and the second surface mount pad. Bonding means is deposited onto the first surface mount pad and the reservoir pad and into the via hole but not onto the second surface mount pad. The first lead of the electrical conducting means is placed against the bonding means deposited on the first surface mount pad and the second lead of the electrical conducting means is placed below the second surface mount pad. The bonding means is heated. The bonding means is cooled.

摘要翻译： 一种用于将具有本体，第一引线和第二引线的导电装置接合到具有第一侧和第二侧的印刷电路板的方法和装置。 第一表面安装焊盘形成在印刷电路板的第一侧上。 在印刷电路板的第一侧上形成储存器垫。 第二表面安装焊盘形成在印刷电路板的第二侧上。 在印刷电路板上形成通孔。 通孔从印刷电路板的第一侧延伸至第二侧。 通孔邻接储存器垫和第二表面安装垫。 接合装置沉积在第一表面安装垫和储存器垫上并进入通孔中，但不沉积到第二表面安装垫上。 导电装置的第一引线抵靠沉积在第一表面安装焊盘上的接合装置放置，并且导电装置的第二引线被放置在第二表面安装焊盘的下方。 接合装置被加热。 粘合装置被冷却。