摘要:
A printed circuit board (120) includes an insulating substrate (120a) on which conductive films (120b) are formed. Semiconductor devices (8) disposed external to the printed circuit board (120) have their leads (24a, 24b, 24c) connected to the conductive films. A flexible portion (30) is formed in the insulating substrate (120a) at a location near the location where the leads (24a, 24b, 24c) are connected to the conductive films (120b).
摘要:
A printed circuit board (120) includes an insulating substrate (120a) on which conductive films (120b) are formed. Semiconductor devices (8) disposed external to the printed circuit board (120) have their leads (24a, 24b, 24c) connected to the conductive films. A flexible portion (30) is formed in the insulating substrate (120a) at a location near the location where the leads (24a, 24b, 24c) are connected to the conductive films (120b).
摘要:
A printed circuit board (120) includes an insulating substrate (120a) on which conductive films (120b) are formed. Semiconductor devices (8) disposed external to the printed circuit board (120) have their leads (24a, 24b, 24c) connected to the conductive films. A flexible portion (30) is formed in the insulating substrate (120a) at a location near the location where the leads (24a, 24b, 24c) are connected to the conductive films (120b).
摘要:
A printed circuit board (120) includes an insulating substrate (120a) on which conductive films (120b) are formed. Semiconductor devices (8) disposed external to the printed circuit board (120) have their leads (24a, 24b, 24c) connected to the conductive films. A flexible portion (30) is formed in the insulating substrate (120a) at a location near the location where the leads (24a, 24b, 24c) are connected to the conductive films (120b).
摘要:
An attachment (10) for preventing a cover (4) from falling off from a housing (1) is provided. The cover (4) includes an elastic member (54) on each of the right and lefts ends thereof. The elastic members are made elastically deformable by forming slits (56) in the cover (4). The elastic members (54) each have a protrusion (52). In order to mount the cover (4) to the housing (1), the protrusions (52) are inserted into respective ones of holes (7) formed in the housing (1) by inwardly deforming and, then, restoring the elastic members (54). After mounting the cover (4) to the housing (1), the cover falling-off preventing attachment (10) is attached to the cover (4), with side walls 18 of the attachment (10) positioned to extend into the respective slits (56), whereby the deformation of the elastic members (54) is prevented.
摘要:
An attachment (10) for preventing a cover (4) from falling off from a housing (1) is provided. The cover (4) includes an elastic member (54) on each of the right and lefts ends thereof. The elastic members are made elastically deformable by forming slits (56) in the cover (4). The elastic members (54) each have a protrusion (52). In order to mount the cover (4) to the housing (1), the protrusions (52) are inserted into respective ones of holes (7) formed in the housing (1) by inwardly deforming and, then, restoring the elastic members (54). After mounting the cover (4) to the housing (1), the cover falling-off preventing attachment (10) is attached to the cover (4), with side walls 18 of the attachment (10) positioned to extend into the respective slits (56), whereby the deformation of the elastic members (54) is prevented.
摘要:
A plasma arc utilizing apparatus includes a power supply unit disposed in a housing. The power supply unit converts an AC voltage to a DC voltage, which is applied to load for generating an arc therein. A compressor is disposed in the same housing for supplying the load with compressed gas that is to be ionized by the arc. The compressor has a leg by which the compressor is secured to the housing. The leg is embedded in an elastic material secured in the housing.
摘要:
A fuser includes a fixing belt that is endless and includes a heat generating layer and circulates, an end restraining member that supports an end of the fixing belt, a heat generating source that is disposed around the fixing belt and heats the heat generating layer, an opposite part that contacts an outer peripheral surface of the fixing belt, a pressure part that is disposed inside the fixing belt and located at a position opposite to the opposite part, and presses the fixing belt to the opposite part side to form a nip between the fixing belt and the opposite part, and a rotation part that contacts an inner peripheral surface of the fixing belt at a position opposite to the heat generating source.
摘要:
A task of the present invention is to provide a method for preparing a dispersion liquid comprising liquid crystal-compatible particles and a paste thereof, which is commercially advantageous in that a dispersion liquid comprising liquid crystal-compatible particles and a uniform liquid crystal-compatible particle paste can be obtained using a method which can easily achieve mass-production.The task of the present invention is achieved by a method for preparing a dispersion liquid comprising liquid crystal-compatible particles wherein the method comprises mixing together at least one type of liquid crystal molecules, a secondary alcohol represented by the following general formula (1): wherein R1 and R2 are the same or different and independently represent a hydrocarbon group optionally having a substituent, or R1 and R2 may be bonded together to form a ring, and an organic solvent, and adding to the resultant mixture a solution containing at least one type of metal ions while heating the mixture under reflux to effect a reaction.
摘要:
A temperature equalizing roller includes a metal pipe, a heat pipe that is located inside the metal pipe and has a thermal expansion coefficient higher than that of the metal pipe, and a joining layer. The joining layer lies between an outer peripheral surface of the heat pipe and an inner peripheral surface of the metal pipe, joins the outer peripheral surface of the heat pipe and the inner peripheral surface of the metal pipe, and has a higher thermal conductivity than a thermal conductivity of air.