公开(公告)号：US20110186107A1

公开(公告)日：2011-08-04

申请号：US13019256

申请日：2011-02-01

申请人： Kevin R. GIBSON ,  Abhay Maheshwari

发明人： Kevin R. GIBSON ,  Abhay Maheshwari

IPC分类号： H01L31/05 ,  H01L31/052 ,  H01L31/18

CPC分类号： H01L31/0201 ,  H01L31/022433 ,  Y02E10/50

摘要： A solar module includes a photovoltaic region having an elongated shape. At least one bus bar pad overlies portions of the photovoltaic region. The solar module includes an electrically conductive region configured along a periphery region of the photovoltaic region to expose an interior surface region of the photovoltaic strip. A finger structure configured to conduct electrical current generated in the photovoltaic regions overlies the electrically conductive region.

摘要翻译： 太阳能模块包括具有细长形状的光伏区域。 至少一个汇流条垫覆盖在该光伏区域的部分上。 太阳能模块包括沿着光伏区域的外围区域配置的导电区域，以暴露光伏条带的内表面区域。 构造成传导在光伏区域中产生的电流的手指结构覆盖在导电区域上。

公开(公告)号：US20100282316A1

公开(公告)日：2010-11-11

申请号：US12687862

申请日：2010-01-14

申请人： Kevin R. Gibson ,  Abhay Maheshwari

发明人： Kevin R. Gibson ,  Abhay Maheshwari

IPC分类号： H01L31/0232 ,  H01L31/18

CPC分类号： H01L31/0543 ,  F24S23/00 ,  F24S23/30 ,  G02B5/045 ,  H01L31/02327 ,  H01L31/048 ,  H01L31/0547 ,  Y02E10/52

摘要： A solar concentrator structure including a plurality of glass concentrator elements with a notch design. According to an embodiment, the present invention provides a solar cell concentrator structure. The structure includes an outside surface. The structure also includes an inside surface, the inside surface being substantially flat. The structure includes a first concentrator element integrally formed on the outside surface, the first concentrator element having a first curved surface, the curved surface being characterized by a radius of at least 1 mm, the curved surface having a first flat region of at least 0.25 mm, the flat region being at least 4 mm from the inside surface. The structure includes a second concentrator element integrally formed with the first concentrator element and the outside surface, the second concentrator element including a second curved surface and a second flat region.

摘要翻译： 一种太阳能集中器结构，包括具有凹口设计的多个玻璃浓缩器元件。 根据实施例，本发明提供一种太阳能电池集中器结构。 该结构包括外表面。 该结构还包括内表面，内表面基本上是平的。 所述结构包括一体地形成在所述外表面上的第一集中器元件，所述第一集中器元件具有第一弯曲表面，所述弯曲表面的特征在于至少1mm的半径，所述弯曲表面具有至少0.25的第一平坦区域 mm，平坦区域距离内表面至少4mm。 该结构包括与第一集中器元件和外表面一体形成的第二集中器元件，第二集中器元件包括第二弯曲表面和第二平坦区域。

公开(公告)号：US20090151770A1

公开(公告)日：2009-06-18

申请号：US12331429

申请日：2008-12-09

申请人： KEVIN R. GIBSON ,  Alelie Funcell ,  Abhay Maheshwari ,  Shirish Shah

发明人： KEVIN R. GIBSON ,  Alelie Funcell ,  Abhay Maheshwari ,  Shirish Shah

IPC分类号： H01L31/052 ,  B32B37/00 ,  H01L21/02 ,  H01L31/18

CPC分类号： B32B37/1207 ,  B32B37/1292 ,  B32B2457/12 ,  H01L31/0543 ,  H01L31/0547 ,  Y02E10/52

摘要： A method and system for manufacturing an integrated concentrator photovoltaic device is disclosed. In an embodiment, the invention includes a one step process using a sheet of coupling material provided in a pre-arranged pattern to couple an array of photovoltaic members to an array of respective optical concentrating members. In another embodiment, the invention includes an integrated concentrator photovoltaic device made by coupling a photovoltaic member and an optical concentrating member together through an encapsulant or coupling layer formed from a sheet member of coupling materials possessing a pre-arranged pattern

摘要翻译： 公开了一种用于制造集成光伏装置的方法和系统。 在一个实施例中，本发明包括使用以预先布置的图案提供的耦合材料片将一组光电元件耦合到相应的光学聚集构件的阵列的一步法。 在另一个实施例中，本发明包括通过将光伏部件与光学聚集部件连接在一起的集成光集成电路装置，其通过由具有预先设置的图案的耦合材料的片状部件形成的密封剂或耦合层

公开(公告)号：US20090266403A1

公开(公告)日：2009-10-29

申请号：US12429912

申请日：2009-04-24

申请人： Shirish Shah ,  Abhay Maheshwari ,  Kevin R. Gibson

发明人： Shirish Shah ,  Abhay Maheshwari ,  Kevin R. Gibson

IPC分类号： H01L31/052 ,  H01L31/042 ,  H01L21/50

CPC分类号： H01L31/022425 ,  H01L31/18 ,  Y02E10/50

摘要： A method of forming a solar device. The method includes providing one or more photovoltaic cells having a front surface region and a back surface region. The method includes providing a first conductor element having a first side operably coupled to a first region of the front surface region of the one or more photovoltaic cells and a second side. In a specific embodiment, the conductor element includes a first anisotropic conducting tape material or a first conducting tape material, the first conducting element having a first thickness, a first length, and a first width. The method performs a bonding process to cause the first conductor element to conduct electric current in a first selected direction.

摘要翻译： 一种形成太阳能装置的方法。 该方法包括提供具有前表面区域和后表面区域的一个或多个光伏电池。 该方法包括提供第一导体元件，其具有可操作地耦合到一个或多个光伏电池的前表面区域的第一区域和第二侧面的第一侧面。 在具体实施例中，导体元件包括第一各向异性导电带材料或第一导电带材料，第一导电元件具有第一厚度，第一长度和第一宽度。 该方法进行接合处理，以使第一导体元件沿第一选定方向导通电流。

公开(公告)号：US20100294338A1

公开(公告)日：2010-11-25

申请号：US12709438

申请日：2010-02-19

申请人： Kevin R. Gibson ,  Abhay Maheshwari

发明人： Kevin R. Gibson ,  Abhay Maheshwari

IPC分类号： H01L31/052 ,  H01L31/18

CPC分类号： H01L31/18 ,  H01L31/0543 ,  Y02E10/52

摘要： A solar module includes a substrate member, a plurality of photovoltaic strips arranged in an array configuration overlying the substrate member, and a concentrator structure comprising extruded glass material operably coupled to the plurality of photovoltaic strips. A plurality of elongated convex regions are configured within the concentrator structure. The plurality of elongated convex regions are respectively coupled to the plurality of photovoltaic strips. Each of the plurality of elongated convex regions includes a length and a convex surface region characterized by a radius of curvature, each of the elongated convex regions being configured to have a magnification ranging from about 1.5 to about 5. A coating material rendering the glass self-cleaning overlies the plurality of elongated convex regions.

摘要翻译： 太阳能模块包括衬底构件，以覆盖衬底构件的阵列构型布置的多个光伏条，以及包括可操作地耦合到多个光伏条的挤压玻璃材料的集中器结构。 在集中器结构内配置多个细长凸区域。 多个细长凸起区域分别耦合到多个光伏条。 多个细长凸起区域中的每一个包括具有由曲率半径表征的长度和凸表面区域，每个细长凸起区域被配置为具有约1.5至约5的放大倍率。使玻璃自身的涂层材料 - 清理覆盖多个细长凸区域。

公开(公告)号：US07910035B2

公开(公告)日：2011-03-22

申请号：US12332340

申请日：2008-12-11

申请人： Kevin R. Gibson ,  Abhay Maheshwari

发明人： Kevin R. Gibson ,  Abhay Maheshwari

IPC分类号： B29D11/00 ,  B29C45/14

CPC分类号： B29C45/14778 ,  F24S23/00 ,  H01L31/0543 ,  H01L31/0547 ,  Y02E10/44 ,  Y02E10/52

摘要： A method for manufacturing an integrated solar cell and concentrator. The method includes providing a first photovoltaic region and a second photovoltaic region disposed within a first mold member. A second mold member is coupled to the first mold member to form a cavity region. The cavity region forms a first concentrator region overlying a vicinity of the first photovoltaic region and a second concentrator region overlying a vicinity of the second photovoltaic region. The method includes transferring a molding compound in a fluidic state into the cavity region to fill the cavity region with the molding compound and initiating a curing process of the molding compound to form a first concentrator element and a second concentrator element overlying the respective photovoltaic regions.

摘要翻译： 一种集成太阳能电池和集中器的制造方法。 该方法包括提供设置在第一模具构件内的第一光伏区域和第二光伏区域。 第二模具构件联接到第一模具构件以形成腔区域。 空腔区域形成覆盖在第一光伏区域附近的第一集中器区域和覆盖在第二光伏区域附近的第二浓缩器区域。 该方法包括将流态的成型化合物转移到空腔区域中以用模塑料填充空腔区域，并引发模塑料的固化过程，以形成覆盖各个光伏区域的第一浓缩器元件和第二浓缩器元件。

公开(公告)号：US07098075B1

公开(公告)日：2006-08-29

申请号：US10769663

申请日：2004-01-29

申请人： Soon-Shin Chee ,  Alelie Funcell ,  Abhay Maheshwari

发明人： Soon-Shin Chee ,  Alelie Funcell ,  Abhay Maheshwari

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L21/4846 ,  H01L23/147 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/18161 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A method of producing a carrier wafer for an integrated circuit is disclosed. The method comprises the steps of providing a carrier wafer having a plurality of bump pads and a plurality of wire bond pads; providing a passivation layer on the carrier wafer; etching a passivation layer over at least a portion of the plurality of bump pads; applying solder bumps on the plurality of bump pads; and separately etching the passivation layer over at least a portion of the plurality of wire bond pads. An integrated circuit employing a flip chip is also disclosed.

摘要翻译： 公开了一种制造用于集成电路的载体晶片的方法。 该方法包括以下步骤：提供具有多个凸块焊盘和多个引线接合焊盘的载体晶片; 在载体晶片上提供钝化层; 在所述多个凸块焊盘的至少一部分上蚀刻钝化层; 在所述多个凸块焊盘上施加焊料凸块; 并且在所述多个引线接合焊盘的至少一部分上分别蚀刻所述钝化层。 还公开了采用倒装芯片的集成电路。

公开(公告)号：US06230399B1

公开(公告)日：2001-05-15

申请号：US09132957

申请日：1998-08-12

申请人： Abhay Maheshwari ,  Sunil Thomas

发明人： Abhay Maheshwari ,  Sunil Thomas

IPC分类号： H05K334

CPC分类号： H01L23/3121 ,  H01L23/3677 ,  H01L23/3737 ,  H01L23/4985 ,  H01L2924/0002 ,  H05K1/0206 ,  H05K2201/0209 ,  H05K2201/068 ,  H05K2201/10477 ,  H05K2201/10681 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49144 ,  H01L2924/00

摘要： A TAB device (10) is coupled to a circuit board (12). The TAB device (10) includes a semiconductor die (11) having leads (18) extending therefrom. A material layer (30), typically a polyimide layer, covers the inward portion of the leads (18) to maintain leading position during attachment of the TAB device (10) to the circuit board (12). Prior to attachment, a backside encapsulation region (40) is applied to the backside of the TAB device (10), sealing the backside of the leads (18). The backside encapsulation material is selected to have a coefficient of thermal expansion similar to the coefficient of thermal expansion of the first material layer (18). The backside encapsulation material is selected to have a coefficient of thermal expansion similar to the coefficient of thermal expansion of the first material layer (30), to prevent excessive warpage. During attachment, migration of the die attach layer (22) towards the leads will be stopped by the backside encapsulation region (40), preventing the die attach material from shorting the leads (18) of the device (10).

摘要翻译： TAB装置（10）耦合到电路板（12）。 TAB装置（10）包括具有从其延伸的引线（18）的半导体管芯（11）。 通常为聚酰亚胺层的材料层（30）覆盖引线（18）的向内部分，以在将TAB器件（10）附接到电路板（12）期间保持引导位置。 在附接之前，背面封装区域（40）被施加到TAB装置（10）的背面，密封引线（18）的背面。 选择背面封装材料以具有类似于第一材料层（18）的热膨胀系数的热膨胀系数。 选择背面封装材料具有类似于第一材料层（30）的热膨胀系数的热膨胀系数，以防止过度的翘曲。 在连接期间，芯片附着层（22）朝向引线的迁移将被背侧封装区域（40）停止，从而防止管芯附着材料使装置（10）的引线（18）短路。

公开(公告)号：US5834336A

公开(公告)日：1998-11-10

申请号：US614037

申请日：1996-03-12

申请人： Abhay Maheshwari ,  Sunil Thomas

发明人： Abhay Maheshwari ,  Sunil Thomas

IPC分类号： H01L23/31 ,  H01L23/367 ,  H01L23/373 ,  H01L23/498 ,  H05K1/02 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L23/3121 ,  H01L23/3677 ,  H01L23/3737 ,  H01L23/4985 ,  H05K1/0206 ,  H01L2924/0002 ,  H05K2201/0209 ,  H05K2201/068 ,  H05K2201/10477 ,  H05K2201/10681 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49144

摘要： A TAB device (10) is coupled to a circuit board (12). The TAB device (10) includes a semiconductor die (11) having leads (18) extending therefrom. A material layer (30), typically a polyimide layer, covers the inward portion of the leads (18) to maintain leading position during attachment of the TAB device (10) to the circuit board (12). Prior to attachment, a backside encapsulation region (40) is applied to the backside of the TAB device (10), sealing the backside of the leads (18). The backside encapsulation material is selected to have a coefficient of thermal expansion similar to the coefficient of thermal expansion of the first material layer (18). The backside encapsulation material is selected to have a coefficient of thermal expansion similar to the coefficient of thermal expansion of the first material layer (30), to prevent excessive warpage. During attachment, migration of the die attach layer (22) towards the leads will be stopped by the backside encapsulation region (40), preventing the die attach material from shorting the leads (18) of the device (10).

摘要翻译： TAB装置（10）耦合到电路板（12）。 TAB装置（10）包括具有从其延伸的引线（18）的半导体管芯（11）。 通常为聚酰亚胺层的材料层（30）覆盖引线（18）的向内部分，以在将TAB器件（10）附接到电路板（12）期间保持引导位置。 在附接之前，背面封装区域（40）被施加到TAB装置（10）的背面，密封引线（18）的背面。 选择背面封装材料以具有类似于第一材料层（18）的热膨胀系数的热膨胀系数。 选择背面封装材料具有类似于第一材料层（30）的热膨胀系数的热膨胀系数，以防止过度的翘曲。 在连接期间，芯片附着层（22）朝向引线的迁移将被背侧封装区域（40）停止，从而防止管芯附着材料使装置（10）的引线（18）短路。

公开(公告)号：US08766086B2

公开(公告)日：2014-07-01

申请号：US12888037

申请日：2010-09-22

申请人： Abhay Maheshwari ,  Raghunandan Chaware

发明人： Abhay Maheshwari ,  Raghunandan Chaware

IPC分类号： H01L31/0232

CPC分类号： H01L31/18 ,  B32B17/10018 ,  B32B17/10146 ,  B32B17/1055 ,  B32B17/10788 ,  B32B37/1009 ,  B32B37/1207 ,  B32B41/00 ,  B32B2038/1891 ,  B32B2309/02 ,  B32B2309/04 ,  B32B2309/12 ,  B32B2457/12 ,  H01L31/0543 ,  H02S40/22 ,  Y02E10/52 ,  Y10T156/1089

摘要： A method for forming a laminated photovoltaic structure includes providing a sheet of transparent material having light concentrating features, disposing adhesive material adjacent to the sheet of transparent material, disposing photovoltaic strips adjacent to the adhesive material, wherein the photovoltaic strips are positioned relative to the sheet of transparent material in response to exitant light characteristics of the light concentrating features, wherein photovoltaic strips are coupled via associated bus bars, wherein gap regions are located between bus bars of neighboring photovoltaic strips, disposing a rigid layer of material adjacent to the photovoltaic strips to form a composite photovoltaic structure; and thereafter laminating the composite photovoltaic structure to fill the gap regions with adhesive material and to form the laminated photovoltaic structure, wherein adhesive material adheres to the bus bars.

摘要翻译： 一种形成叠层光伏结构的方法包括提供具有光聚集特征的透明材料片，将粘合剂材料设置在透明材料片附近，将光伏条放置在邻近粘合剂材料的位置，其中光伏条相对于片材 透明材料响应于光聚集特征的出射光特性，其中光伏带通过相关联的母线耦合，其中间隙区域位于相邻光伏条带的汇流条之间，将邻近光伏条带的刚性材料层设置到 形成复合光伏结构; 然后层叠复合光伏结构以用粘合剂材料填充间隙区域并形成层叠的光伏结构，其中粘合材料粘附到母线上。