Method for manufacturing semiconductor device
    1.
    发明授权
    Method for manufacturing semiconductor device 失效
    制造半导体器件的方法

    公开(公告)号:US07396751B2

    公开(公告)日:2008-07-08

    申请号:US11617692

    申请日:2006-12-28

    摘要: A method for manufacturing a semiconductor device includes forming a second storage node contact hole with a mask for storage node and securing an overlay margin between a storage node contact hole and a storage node with a hard mask layer that serves as a hard mask as well as an anti-reflection film to reduce contact resistance, prevent reduction of a line-width of a lower interlayer insulating film and eliminate processes for depositing the interlayer insulating film and a polysilicon layer and etching the polysilicon layer to reduce a production period and cost of products.

    摘要翻译: 一种制造半导体器件的方法包括:形成具有用于存储节点的掩模的第二存储节点接触孔,并且用作为硬掩模的硬掩模层在存储节点接触孔和存储节点之间固定覆盖边界,以及 防反射膜,以降低接触电阻,防止下层间绝缘膜的线宽减小,并消除沉积层间绝缘膜和多晶硅层的过程,并蚀刻多晶硅层以减少产品的生产周期和成本 。

    Method of manufacturing fine patterns of semiconductor device
    2.
    发明授权
    Method of manufacturing fine patterns of semiconductor device 有权
    制造半导体器件精细图案的方法

    公开(公告)号:US08389400B2

    公开(公告)日:2013-03-05

    申请号:US12650222

    申请日:2009-12-30

    IPC分类号: H01L21/4763

    CPC分类号: H01L21/0337

    摘要: A method of forming fine patterns of a semiconductor device comprises forming sacrificial film patterns of a line type in a cell region of a semiconductor substrate and, at the same time, forming pad patterns in a peripheral region of the semiconductor substrate, forming a spacer on sidewalls of each of the sacrificial film patterns and the pad patterns, forming a gap-fill layer on sidewalls of the spacers to thereby form line and space patterns, including the sacrificial film patterns and the gap-fill layers, in the cell region, and separating the line and space patterns of the cell region at regular intervals and, at the same time, etching the pad patterns of the peripheral region to thereby form specific patterns in the peripheral region.

    摘要翻译: 形成半导体器件的精细图案的方法包括在半导体衬底的单元区域中形成线型的牺牲膜图案,并且同时在半导体衬底的周边区域中形成衬垫图案,形成间隔物 每个牺牲膜图案和焊盘图案的侧壁,在间隔物的侧壁上形成间隙填充层,从而在单元区域中形成包括牺牲膜图案和间隙填充层的线和间隔图案,以及 以规则的间隔分离单元区域的线和空间图案,并且同时蚀刻周边区域的焊盘图案,从而在周边区域中形成特定图案。

    METHOD OF MANUFACTURING FINE PATTERNS OF SEMICONDUCTOR DEVICE
    3.
    发明申请
    METHOD OF MANUFACTURING FINE PATTERNS OF SEMICONDUCTOR DEVICE 有权
    制造半导体器件精细图案的方法

    公开(公告)号:US20110124198A1

    公开(公告)日:2011-05-26

    申请号:US12650222

    申请日:2009-12-30

    IPC分类号: H01L21/308 H01L21/306

    CPC分类号: H01L21/0337

    摘要: A method of forming fine patterns of a semiconductor device comprises forming sacrificial film patterns of a line type in a cell region of a semiconductor substrate and, at the same time, forming pad patterns in a peripheral region of the semiconductor substrate, forming a spacer on sidewalls of each of the sacrificial film patterns and the pad patterns, forming a gap-fill layer on sidewalls of the spacers to thereby form line and space patterns, including the sacrificial film patterns and the gap-fill layers, in the cell region, and separating the line and space patterns of the cell region at regular intervals and, at the same time, etching the pad patterns of the peripheral region to thereby form specific patterns in the peripheral region.

    摘要翻译: 形成半导体器件的精细图案的方法包括在半导体衬底的单元区域中形成线型的牺牲膜图案,并且同时在半导体衬底的周边区域中形成衬垫图案,形成间隔物 每个牺牲膜图案和焊盘图案的侧壁,在间隔物的侧壁上形成间隙填充层,从而在单元区域中形成包括牺牲膜图案和间隙填充层的线和间隔图案,以及 以规则的间隔分离单元区域的线和空间图案,并且同时蚀刻周边区域的焊盘图案,从而在周边区域中形成特定图案。

    METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
    4.
    发明申请
    METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 失效
    制造半导体器件的方法

    公开(公告)号:US20070161221A1

    公开(公告)日:2007-07-12

    申请号:US11617692

    申请日:2006-12-28

    IPC分类号: H01L21/44

    摘要: A method for manufacturing a semiconductor device includes forming a second storage node contact hole with a mask for storage node and securing an overlay margin between a storage node contact hole and a storage node with a hard mask layer that serves as a hard mask as well as an anti-reflection film to reduce contact resistance, prevent reduction of a line-width of a lower interlayer insulating film and eliminate processes for depositing the interlayer insulating film and a polysilicon layer and etching the polysilicon layer to reduce a production period and cost of products.

    摘要翻译: 一种制造半导体器件的方法包括:形成具有用于存储节点的掩模的第二存储节点接触孔,并且用作为硬掩模的硬掩模层在存储节点接触孔和存储节点之间固定覆盖边界,以及 防反射膜,以降低接触电阻,防止下层间绝缘膜的线宽减小,并消除沉积层间绝缘膜和多晶硅层的过程,并蚀刻多晶硅层以减少产品的生产周期和成本 。

    Method for Manufacturing a Semiconductor Device
    5.
    发明申请
    Method for Manufacturing a Semiconductor Device 失效
    半导体器件的制造方法

    公开(公告)号:US20080090420A1

    公开(公告)日:2008-04-17

    申请号:US11771416

    申请日:2007-06-29

    申请人: Sa Ro Han Park

    发明人: Sa Ro Han Park

    IPC分类号: H01L21/311 G03C5/00

    摘要: A method of manufacturing a semiconductor device according to the invention is an effective technique for ensuring a sufficient process margin and enabling the formation of a fine pattern in a peripheral circuit region. The method includes forming an anti-reflective layer with a varying thickness in a peripheral circuit region and a cell region, and then over-etching the anti-reflective layer in the peripheral circuit region. The method is capable of improving the data processing speed of a semiconductor device and therefore increases the device efficiency.

    摘要翻译: 根据本发明的制造半导体器件的方法是用于确保足够的处理余量并且能够在外围电路区域中形成精细图案的有效技术。 该方法包括在外围电路区域和单元区域中形成具有变化厚度的抗反射层,然后对外围电路区域中的抗反射层进行过蚀刻。 该方法能够提高半导体器件的数据处理速度,从而提高器件效率。

    Method for manufacturing a semiconductor device by selective etching
    6.
    发明授权
    Method for manufacturing a semiconductor device by selective etching 失效
    通过选择性蚀刻制造半导体器件的方法

    公开(公告)号:US07781344B2

    公开(公告)日:2010-08-24

    申请号:US11771416

    申请日:2007-06-29

    申请人: Sa Ro Han Park

    发明人: Sa Ro Han Park

    IPC分类号: H01L21/311

    摘要: A method of manufacturing a semiconductor device according to the invention is an effective technique for ensuring a sufficient process margin and enabling the formation of a fine pattern in a peripheral circuit region. The method includes forming an anti-reflective layer with a varying thickness in a peripheral circuit region and a cell region, and then over-etching the anti-reflective layer in the peripheral circuit region. The method is capable of improving the data processing speed of a semiconductor device and therefore increases the device efficiency.

    摘要翻译: 根据本发明的制造半导体器件的方法是用于确保足够的处理余量并且能够在外围电路区域中形成精细图案的有效技术。 该方法包括在外围电路区域和单元区域中形成具有变化厚度的抗反射层,然后对外围电路区域中的抗反射层进行过蚀刻。 该方法能够提高半导体器件的数据处理速度,从而提高器件效率。

    METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
    7.
    发明申请
    METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 审中-公开
    制造半导体器件的方法

    公开(公告)号:US20100099046A1

    公开(公告)日:2010-04-22

    申请号:US12489141

    申请日:2009-06-22

    IPC分类号: G03F7/20

    摘要: A method for manufacturing a semiconductor device comprises forming a protective film over a photoresist pattern to improve the residual ratio of the photoresist pattern. The method comprises forming a photoresist pattern over an underlying layer and forming a protective pattern on an upper portion and sidewalls of the photoresist pattern.

    摘要翻译: 一种制造半导体器件的方法包括在光致抗蚀剂图案上形成保护膜以提高光致抗蚀剂图案的残留率。 该方法包括在下层上形成光致抗蚀剂图案,并在光致抗蚀剂图案的上部和侧壁上形成保护图案。

    Template for Nano Imprint Lithography Process and Method of Manufacturing Semiconductor Device Using the Same
    8.
    发明申请
    Template for Nano Imprint Lithography Process and Method of Manufacturing Semiconductor Device Using the Same 审中-公开
    纳米压印光刻工艺的模板和使用其的半导体器件的制造方法

    公开(公告)号:US20080286449A1

    公开(公告)日:2008-11-20

    申请号:US11866223

    申请日:2007-10-02

    申请人: Sa Ro Han Park

    发明人: Sa Ro Han Park

    IPC分类号: B05D3/12 G03C5/00

    摘要: A method of manufacturing a template for nano imprint lithography process may include: forming a chrome layer, an intermediate film, and a photoresist film sequentially over a substrate. The method may further include forming a photoresist film pattern; forming an intermediate film pattern with the photoresist film pattern as an etching mask; and forming a spacer at a sidewall of the intermediate film pattern. The intermediate film pattern may be removed using an etching selectivity between the intermediate film pattern and the spacer. Finally, the chrome layer and the substrate may be etched using the spacer as an etching mask to form the template.

    摘要翻译: 制造用于纳米压印光刻工艺的模板的方法可以包括:在衬底上顺序地形成铬层,中间膜和光致抗蚀剂膜。 该方法还可以包括形成光致抗蚀剂膜图案; 形成具有光致抗蚀剂膜图案的中间膜图案作为蚀刻掩模; 以及在中间膜图案的侧壁处形成间隔物。 可以使用中间膜图案和间隔物之间​​的蚀刻选择性去除中间膜图案。 最后,可以使用间隔物作为蚀刻掩模来蚀刻铬层和衬底以形成模板。