摘要:
Borderless contacts for word lines or via contacts for bit lines are formed using interconnect patterns, a part of which is removed. A semiconductor memory includes: a plurality of active regions AAi, AAi, . . . , AAn, which extend on a memory cell array along the column length; a plurality of word line patterns WL1, WL2, . . . , extend along the row length and are non-uniformly arranged; a plurality of select gate line patterns SG1, SG2, . . . , are arranged parallel to the plurality of word line patterns; borderless contacts are formed near the ends of the word line patterns on the memory cell array, and are in contact with part of an interconnect extended from the end of the memory cell array, but are not in contact with interconnects adjacent to that interconnect; and bit line contacts are formed within contact forming regions provided by removing part of the plurality of word line patterns and select gate line patterns through double exposure.
摘要:
A non-volatile memory device having memory elements with a channel length of, e.g., 45-55 nm or less, is fabricated using existing lithographic techniques. In one approach, patterns of first and second photomasks are transferred to the same photoresist layer. The first photomask can have openings with a given feature size F that are spaced apart by the feature size F, for instance. The second photomask has an opening which is sized to create a desired inter-select gate gap, such as 3 F or 5 F. A third photomask is used to provide protective portions in a second photoresist layer over the select gate structures. The final structure has memory elements of width F spaced apart by a distance F, and select gates of width 3 F spaced apart by 3 F or 5 F. In another approach, the patterns of three photomasks are transferred to respective photoresist layers to create an analogous final structure.
摘要:
Borderless contacts for word lines or via contacts for bit lines are formed using interconnect patterns, a part of which is removed. A semiconductor memory includes: a plurality of active regions AAi, AAi+1, . . . , AAn, which extend on a memory cell array along the column length; a plurality of word line patterns WL1, WL2, . . . , extend along the row length and are non-uniformly arranged; a plurality of select gate line patterns SG1, SG2, . . . , are arranged parallel to the plurality of word line patterns; borderless contacts are formed near the ends of the word line patterns on the memory cell array, and are in contact with part of an interconnect extended from the end of the memory cell array, but are not in contact with interconnects adjacent to that interconnect; and bit line contacts are formed within contact forming regions provided by removing part of the plurality of word line patterns and select gate line patterns through double exposure.
摘要:
A non-volatile memory device having memory elements with a channel length of, e.g., 45-55 nm or less, is fabricated using existing lithographic techniques. In one approach, patterns of first and second photomasks are transferred to the same photoresist layer. The first photomask can have openings with a given feature size F that are spaced apart by the feature size F, for instance. The second photomask has an opening which is sized to create a desired inter-select gate gap, such as 3 F or 5 F. A third photomask is used to provide protective portions in a second photoresist layer over the select gate structures. The final structure has memory elements of width F spaced apart by a distance F, and select gates of width 3 F spaced apart by 3 F or 5 F. In another approach, the patterns of three photomasks are transferred to respective photoresist layers to create an analogous final structure.
摘要:
Borderless contacts for word lines or via contacts for bit lines are formed using interconnect patterns, a part of which is removed. A semiconductor memory includes: a plurality of active regions AAi, AAi+1, . . . , AAn, which extend on a memory cell array along the column length; a plurality of word line patterns WL1, WL2, . . . , extend along the row length and are non-uniformly arranged; a plurality of select gate line patterns SG1, SG2, . . . , are arranged parallel to the plurality of word line patterns; borderless contacts are formed near the ends of the word line patterns on the memory cell array, and are in contact with part of an interconnect extended from the end of the memory cell array, but are not in contact with interconnects adjacent to that interconnect; and bit line contacts are formed within contact forming regions provided by removing part of the plurality of word line patterns and select gate line patterns through double exposure.
摘要:
Borderless contacts for word lines or via contacts for bit lines are formed using interconnect patterns, a part of which is removed. A semiconductor memory includes: a plurality of active regions AAi, AAi+1, . . . , AAn, which extend on a memory cell array along the column length; a plurality of word line patterns WL1, WL2, . . . , extend along the row length and are non-uniformly arranged; a plurality of select gate line patterns SG1, SG2, . . . , are arranged parallel to the plurality of word line patterns; borderless contacts are formed near the ends of the word line patterns on the memory cell array, and are in contact with part of an interconnect extended from the end of the memory cell array, but are not in contact with interconnects adjacent to that interconnect; and bit line contacts are formed within contact forming regions provided by removing part of the plurality of word line patterns and select gate line patterns through double exposure.
摘要:
A semiconductor memory includes: a plurality of active regions AAi, AAi−1, . . . , AAn, which extend on a memory cell array along the column length; a plurality of non-uniformly arranged word line patterns WL1, WL2, . . . , extending along the row length; a plurality of select gate line patterns SG1, SG2, . . . , arranged parallel to the plurality of word line patterns; borderless contacts formed near the ends of the word line patterns on the memory cell array, in contact with part of an interconnect extended from the end of the memory cell array, but not in contact with interconnects adjacent to that interconnect; and bit line contacts formed within contact forming regions provided by removing part of the plurality of word line patterns and select gate line patterns through double exposure.
摘要:
A semiconductor memory includes: a plurality of active regions AAi, AAi−1, . . . , AAn, which extend on a memory cell array along the column length; a plurality of non-uniformly arranged word line patterns WL1, WL2, . . . , extending along the row length; a plurality of select gate line patterns SG1, SG2, . . . , arranged parallel to the plurality of word line patterns; borderless contacts formed near the ends of the word line patterns on the memory cell array, in contact with part of an interconnect extended from the end of the memory cell array, but not in contact with interconnects adjacent to that interconnect; and bit line contacts formed within contact forming regions provided by removing part of the plurality of word line patterns and select gate line patterns through double exposure.
摘要:
Borderless contacts for word lines or via contacts for bit lines are formed using interconnect patterns, a part of which is removed. A semiconductor memory includes: a plurality of active regions AAi, AAi+1, . . . , AAn, which extend on a memory cell array along the column length; a plurality of word line patterns WL1, WL2, . . . , extend along the row length and are non-uniformly arranged; a plurality of select gate line patterns SG1, SG2, . . . , are arranged parallel to the plurality of word line patterns; borderless contacts are formed near the ends of the word line patterns on the memory cell array, and are in contact with part of an interconnect extended from the end of the memory cell array, but are not in contact with interconnects adjacent to that interconnect; and bit line contacts are formed within contact forming regions provided by removing part of the plurality of word line patterns and select gate line patterns through double exposure.
摘要:
A nonvolatile semiconductor memory which is configured to include a plurality of word lines disposed in a row direction; a plurality of bit lines disposed in a column direction perpendicular to the word lines; memory cell transistors having a charge storage layer, provided in the column direction and an electronic storage condition of the memory cell transistor configured to be controlled by one of the plurality of the word lines connected to the memory cell; a plurality of first select transistors, each including a gate electrode, selecting the memory cell transistors provided in the column direction, arranged in the column direction and adjacent to the memory cell transistors at a first end of the memory cell transistors; and a first select gate line connected to each of the gate electrodes of the first select transistors.