-
公开(公告)号：US5312787A
公开(公告)日：1994-05-17
申请号：US67490
申请日：1993-05-25
IPC分类号： C03C14/00
CPC分类号： C03C14/002 , C03C2214/02 , C03C2214/06 , C03C2214/20
摘要： A ceramics composite material containing crystallized glass as the matrix and fibers or whiskers of ceramics as a reinforcement material, is obtained by melting original glass to form crystallized glass, compounding the same with fibers or whiskers of oxide ceramics and thereafter crystallizing the original glass. This ceramics composite material does not form any voids and can easily contain at least 50 volume percent of the reinforcement material, whereby a good mechanical strength and fracture toughness are achieved. In the compounding step, the content of the reinforcement can be further increased by forcing out any excess part of the original glass from the reinforcement material by applying pressure to a substance obtained by mixing the original glass with the reinforcement. Further, the ceramics composite material can be efficiently formed into a desired configuration by heating because the original glass flows viscously.
摘要翻译： 通过熔化原始玻璃以形成结晶玻璃，与氧化物陶瓷的纤维或晶须复合，然后使原始玻璃结晶，得到含有结晶化玻璃作为基体的陶瓷复合材料和陶瓷的纤维或晶须作为增强材料。 该陶瓷复合材料不会形成任何空隙，容易含有50体积％的增强材料，从而获得良好的机械强度和断裂韧性。 在配合工序中，通过对通过将原玻璃与增强材料进行混合而得到的物质施加压力，从加强材料中强制除去原始玻璃的多余部分，能够进一步提高加强物的含量。 此外，由于原始玻璃粘度流动，陶瓷复合材料可以通过加热有效地形成期望的构造。
-
公开(公告)号：US5190895A
公开(公告)日：1993-03-02
申请号：US879158
申请日：1992-04-30
IPC分类号： C03C14/00
CPC分类号： C03C14/002 , C03C2214/02 , C03C2214/06 , C03C2214/20
摘要： A ceramics composite material containing crystallized glass as the matrix and fibers or whiskers of ceramics as a reinforcement material, is obtained by melting original glass to form crystallized glass, compounding the same with fibers or whiskers of oxide ceramics and thereafter crystallizing the original glass. This ceramics composite material does not form any voids and can easily contain at least 50 volume percent of the reinforcement material, whereby a good mechanical strength and fracture toughness are achieved. In the compounding step, the content of the reinforcement can be further increased by forcing out any excess part of the original glass from the reinforcement material by applying pressure to a substance obtained by mixing the original glass with the reinforcement. Further, the ceramics composite material can be efficiently formed into a desired configuration by heating because the original glass flows viscously.
摘要翻译： PCT No.PCT / JP89 / 00735 Sec。 371日期1990年3月2日 102（e）1990年3月2日PCT PCT 1989年7月21日PCT公布。 出版物WO90 / 01020 日本1990年8月2日。含有结晶玻璃作为基体的陶瓷复合材料和作为增强材料的陶瓷的纤维或晶须是通过熔化原始玻璃以形成结晶玻璃而获得的，其与氧化物陶瓷的纤维或晶须复合， 然后使原始玻璃结晶。 该陶瓷复合材料不会形成任何空隙，容易含有50体积％的增强材料，从而获得良好的机械强度和断裂韧性。 在配合工序中，通过对通过将原玻璃与增强材料进行混合而得到的物质施加压力，从加强材料中强制除去原始玻璃的多余部分，能够进一步提高加强物的含量。 此外，由于原始玻璃粘度流动，陶瓷复合材料可以通过加热有效地形成期望的构造。
-
公开(公告)号：US07491432B2
公开(公告)日：2009-02-17
申请号：US10605764
申请日：2003-10-24
申请人： Yoshifumi Kachi , Akira Kuibira , Hirohiko Nakata
发明人： Yoshifumi Kachi , Akira Kuibira , Hirohiko Nakata
IPC分类号： B32B9/00
CPC分类号： H01L21/67103 , C23C16/4581 , C23C16/4586 , H01L21/68735 , H05B3/143 , Y10T428/131
摘要： For semiconductor manufacturing equipment, a ceramic susceptor that without occurrence of cracking in the course of heating wafers suppresses thermal radiation from the circumferential surface of a wafer placed on the ceramic susceptor, to heighten isothermal quality in the wafer face. A semiconductor-manufacturing-equipment ceramic susceptor (1) including a resistive heating element (3) in the face or interior of ceramic substrates (2a, 2b) has a wafer pocket (5) consisting of a recess that can accommodatingly carry a wafer. The angle that the perimetric inside surface and the bottom face of the wafer pocket (5) form is over 90° and 170° or less, and/or the curvature of the bottom-portion circumferential rim where the perimetric inside surface and the bottom face of the pocket join is 0.1 mm or more. A plasma electrode furthermore may be disposed in the face or interior of the ceramic substrates (2a, 2b) of the ceramic susceptor (1).
摘要翻译： 对于半导体制造设备，在加热晶片的过程中不发生开裂的陶瓷基座抑制来自放置在陶瓷基座上的晶片的圆周表面的热辐射，以提高晶片表面的等温质量。 在陶瓷基板（2a，2b）的表面或内部包括电阻加热元件（3）的半导体制造设备陶瓷基座（1）具有由可以容纳地携带晶片的凹部构成的晶片槽（5）。 晶片槽（5）的周边内表面和底面形成的角度超过90°和170°或更小，和/或底部周缘的曲率，其中周边内表面和底面 的口袋连接为0.1mm以上。 此外，等离子体电极可以设置在陶瓷基座（1）的陶瓷基板（2a，2b）的表面或内部。
-
公开(公告)号：US07361230B2
公开(公告)日：2008-04-22
申请号：US10119955
申请日：2002-04-09
CPC分类号： H01L21/67103 , C23C16/4581 , C23C16/4586 , H01L21/68714 , Y10T279/23
摘要： In the substrate processing apparatus, a ceramic module for mounting a substrate has a flat plate portion having an electric circuitry and a ceramic base body, and as at least a part of a surface of the flat plate portion other than the surface mounting the substrate is in contact with a chamber, it is supported by the chamber. Thus, a substrate processing apparatus can be provided which improves thermal uniformity, reduces cost, is suitable for size reduction of the apparatus and which can ease restrictions in mounting a power supply conductive member or the like.
摘要翻译： 在基板处理装置中，用于安装基板的陶瓷模块具有具有电路和陶瓷基体的平板部分，并且作为安装基板的表面以外的平板部分的至少一部分表面， 与腔室接触，它由腔室支撑。 因此，可以提供提高热均匀性，降低成本的衬底处理装置，适合于装置的尺寸减小，并且可以减轻安装电源导电构件等的限制。
-
公开(公告)号：US07268322B2
公开(公告)日：2007-09-11
申请号：US11099987
申请日：2005-04-05
申请人： Akira Kuibira , Hirohiko Nakata , Kenji Shinma
发明人： Akira Kuibira , Hirohiko Nakata , Kenji Shinma
CPC分类号： H01L21/67109 , H01L21/67103
摘要： A semiconductor heating apparatus, in which, when measuring the electrical properties of multiple chips formed on a large size wafer, only one or a several chips are heated uniformly, and the other chips are on standby at a low temperature. The semiconductor heating apparatus includes a heating part for mounting and heating the workpiece, a support part which supports the heating part, and a cooling module which contacts the support part. A plurality of heating parts and supporting parts are joined together. The workpiece mounting surfaces of the plurality of heating parts are preferably constructed in the same plane. In addition, there is preferably a thermal insulating material distributed underneath the support part. The heating part is preferably a ceramic heater.
摘要翻译： 一种半导体加热装置，其中，当测量形成在大尺寸晶片上的多个芯片的电特性时，只有一个或几个芯片被均匀地加热，而另一个芯片在低温待机。 半导体加热装置包括用于安装和加热工件的加热部件，支撑加热部件的支撑部件和与支撑部件接触的冷却模块。 多个加热部和支撑部接合在一起。 多个加热部的工件安装面优选构成为同一平面。 此外，优选地，分布在支撑部分下方的绝热材料。 加热部件优选为陶瓷加热器。
-
公开(公告)号：US07268321B2
公开(公告)日：2007-09-11
申请号：US10498460
申请日：2003-03-19
CPC分类号： H01L21/68757 , H01L21/67103 , H01L21/67248
摘要： A wafer holder is provided in which local heat radiation in supporting and heating wafers is kept under control and temperature uniformity of the wafer retaining surface is enhanced, and by making use of the wafer holder a semiconductor manufacturing apparatus suitable for processing larger-diameter wafers is made available. In a wafer holder (1) including within a ceramic substrate (2) a resistive heating element (3) or the like and being furnished with a lead (4) penetrating a reaction chamber (6), the lead (4) is housed in a tubular guide member (5), and an interval between the guide member (5) and the reaction chamber (6) as well as the interior of the guide member (5) are hermetically sealed. The guide member (5) and the ceramic substrate (2) are not joined together, and in the interior of the guide member (5) in which the inside is hermetically sealed, the atmosphere toward the ceramic substrate (2) is preferably substantially the same as the atmosphere in the reaction chamber (6).
摘要翻译： 提供了一种晶片保持器，其中支撑和加热晶片中的局部热辐射保持在控制之下，并且晶片保持表面的温度均匀性得到增强，并且通过利用晶片保持器，适于处理较大直径晶片的半导体制造装置为 提供。 在陶瓷基板（2）内具有电阻加热元件（3）等并配有穿过反应室（6）的引线（4）的晶片保持器（1）中，引线（4）容纳在 管状引导构件（5）以及引导构件（5）和反应室（6）之间的间隔以及引导构件（5）的内部被气密地密封。 引导构件（5）和陶瓷基板（2）不接合在一起，并且在内部被密封的引导构件（5）的内部，朝向陶瓷基板（2）的气氛优选为 与反应室（6）中的气氛相同。
-
公开(公告)号：US20070205787A1
公开(公告)日：2007-09-06
申请号：US11701416
申请日：2007-02-02
IPC分类号： G01R31/02
CPC分类号： G01R31/2865 , G01R1/18 , G01R31/2875
摘要： A wafer holder with which probing can be performed with little or virtually no noise due to the wafer being shielded from electromagnetic waves; and a wafer prober on which the wafer holder is mounted. The wafer holder of the present invention includes a chuck top for mounting a wafer, and a resistance heat generator for heating the chuck top. At least part of the resistance heat generator is covered by an insulating layer, and an electrically conductive layer is present on an opposite side of the resistance heat generator having the insulating layer. The electrically conductive layer blocks electromagnetic waves that adversely affect inspection. The insulating layer preferably covers the entire surface of the resistance heat generator, and the electrically conductive layer preferably covers the entire surface of the resistance heat generator comprising the insulating layer.
摘要翻译： 晶片保持器，由于晶片被电磁波屏蔽，可以进行很少或几乎没有噪声的探测; 以及安装晶片保持器的晶片探测器。 本发明的晶片保持器包括用于安装晶片的卡盘顶板和用于加热卡盘顶部的电阻发热器。 电阻发热体的至少一部分被绝缘层覆盖，导电层存在于具有绝缘层的电阻发热体的相反侧。 导电层阻止对检查产生不利影响的电磁波。 绝缘层优选覆盖电阻发热体的整个表面，并且导电层优选覆盖包括绝缘层的电阻发热体的整个表面。
-
8.发明授权Ceramic joined body, substrate holding structure and substrate processing apparatus 有权陶瓷接合体，基板保持结构和基板处理装置公开(公告)号：US07211153B2
公开(公告)日：2007-05-01
申请号：US10276394
申请日：2002-04-11
CPC分类号： H01L21/6833 , B32B18/00 , B32B2309/022 , B32B2315/02 , C04B35/44 , C04B35/581 , C04B37/005 , C04B2235/3217 , C04B2235/3224 , C04B2235/3225 , C04B2235/3865 , C04B2235/96 , C04B2237/064 , C04B2237/08 , Y10T279/23
摘要： A substrate holding structure having excellent corrosion resistance and airtightness, excellent dimensional accuracy and sufficient durability when mechanical or thermal stress is applied thereto is obtained. A holder (1) serving as the substrate holding structure includes a ceramic base (2) for holding a substrate, a protective cylinder (7) joined to the ceramic base (2) and a joining layer (8) positioned therebetween for joining the ceramic base (2) and the protective cylinder (7) to each other. The joining layer (8) contains at least 2 mass % and not more than 70 mass % of a rare earth oxide, at least 10 mass % and not more than 78 mass % of aluminum oxide, and at least 2 mass % and not more than 50 mass % of aluminum nitride. The rare earth oxide or the aluminum oxide has the largest proportional content among the aforementioned three types of components in the joining layer (8).
摘要翻译： 获得具有优异的耐腐蚀性和气密性的基板保持结构，在施加机械或热应力时具有优异的尺寸精度和足够的耐久性。 用作基板保持结构的保持器（1）包括用于保持基板的陶瓷基体（2），与陶瓷基体（2）接合的保护筒（7）和位于其间的接合层（8），用于将陶瓷 基座（2）和保护筒（7）彼此连接。 接合层（8）含有2质量％以上且70质量％以下的稀土类氧化物，至少10质量％以上且78质量％以下的氧化铝，至少2质量％以上 超过50质量％的氮化铝。 在接合层（8）中，上述三种成分中的稀土氧化物或氧化铝的比例含量最大。
-
9.发明申请公开(公告)号：US20070028834A1
公开(公告)日：2007-02-08
申请号：US11496022
申请日：2006-07-31
IPC分类号： C30B25/00
CPC分类号： G01R31/2886 , G01R31/2831
摘要： The present invention provides a wafer prober wafer holder that is highly rigid and increases the heat insulating effect, thereby improving positional accuracy, thermal uniformity, and chip temperature ramp-up and cooling rates, as well as a wafer prober device equipped therewith. A wafer holder of the present invention includes a chuck top that mounts a wafer, and a support member that supports the chuck top. A cavity is formed between the chuck top and the support member, and a vacuum space member is provided to the lowest part of a member that is attached to a surface of the chuck top on the side opposite the wafer mounting surface.
摘要翻译： 本发明提供了一种高刚性的晶片探针晶片保持器，并且增加了隔热效果，从而提高了位置精度，热均匀性和芯片温度升高和冷却速度，以及配备其的晶片探测器。 本发明的晶片保持器包括安装晶片的卡盘顶部和支撑卡盘顶部的支撑构件。 在卡盘顶部和支撑构件之间形成空腔，并且在与晶片安装表面相对的一侧附接到卡盘顶表面的构件的最下部设置真空空间构件。
-
公开(公告)号：US20050263516A1
公开(公告)日：2005-12-01
申请号：US11140668
申请日：2005-05-27
IPC分类号： H05B3/20 , F27B17/00 , F27D11/00 , F27D99/00 , H01L21/00 , H01L21/02 , H01L21/66 , H01L21/68 , H01L21/683 , H05B3/06 , H05B3/10 , H05B3/74
CPC分类号： F27D99/0006 , F27B17/0025 , F27D2099/0008 , H01L21/67103
摘要： The present invention provides a heating device which is rigid with little likelihood of warping. The workpiece mounting surface has a high thermal conductivity, and there is improved heat uniformity, and rapid cooling is possible. The heating device of the present invention comprises: a mounting part for mounting the workpiece; a heating part which has a resistance heating element and which heats the mounting part; and a support part which supports the mounting part and heating part. The Young's modulus for each of the mounting part and support part is 100 GPa or greater. By having a Young's modulus of 100 GPa or greater, even if the mounting part is thin, there is little deformation when pressed by a probe card.
摘要翻译： 本发明提供一种加热装置，该加热装置具有几乎不变形的刚性。 工件安装面具有高导热性，并且具有改善的热均匀性，并且可以进行快速冷却。 本发明的加热装置包括：用于安装工件的安装部件; 加热部，其具有电阻加热元件，并加热所述安装部; 以及支撑安装部和加热部的支撑部。 每个安装部分和支撑部分的杨氏模量为100GPa或更大。 通过具有100GPa以上的杨氏模量，即使安装部分较薄，当由探针卡按压时几乎没有变形。
-
-
-
-
-
-
-
-
-
搜索结果
137 条记录 (耗时 0.035 秒)
