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14 条记录 (耗时 0.052 秒)

    Card holding structure and portable terminal apparatus having the same
    3.
    发明授权
    Card holding structure and portable terminal apparatus having the same 失效
    卡片保持结构和便携式终端设备具有相同的功能

    公开(公告)号：US06947767B2

    公开(公告)日：2005-09-20

    申请号：US09980535

    申请日：2001-02-23

    申请人： Hideo Haga ,  Koji Kuchiishi ,  Toshihiro Higuchi ,  Yasunobu Ikeda

    发明人： Hideo Haga ,  Koji Kuchiishi ,  Toshihiro Higuchi ,  Yasunobu Ikeda

    IPC分类号： H01R13/639 ,  G06K7/00 ,  H04M1/02 ,  H04Q7/32 ,  H04M1/00

    CPC分类号： G06K7/0021 ,  G06K13/085 ,  H04B1/3816 ,  H04M1/0202 ,  H04M2250/14

    摘要： A card is slid and fitted to a card connector fixed in a card-fitting recessed portion provided inside a reverse surface-side housing of a portable terminal apparatus. A front portion of the card is held by card holding portions provided in a front portion, as viewed in a card sliding direction, of the card connector, and a rear portion of the card is held by an inner wall surface of a cover-cum-battery of the reverse surface-side housing. A housing-side stopper is provided on a bottom surface of the card-fitting recessed portion. The housing-side stopper is formed by a rectangular resilient piece having one end fixed to a bottom surface of the card-fitting recessed portion.

    摘要翻译： 将卡滑动并安装在固定在设置在便携式终端装置的背面侧壳体内的卡嵌入凹部中的卡连接器上。 卡的前部由卡连接器的卡片滑动方向的前部设置的卡保持部保持，卡的后部被盖的内壁面保持 反面侧壳体的电池。 在卡配合凹部的底面设置有壳体侧止动件。 壳体侧止动器由一端固定在卡嵌凹部的底面上的矩形弹性片形成。

    Printed circuit board holding structure
    4.
    发明授权
    Printed circuit board holding structure 有权
    印刷电路板保持结构

    公开(公告)号：US06809933B2

    公开(公告)日：2004-10-26

    申请号：US09980239

    申请日：2002-01-28

    申请人： Koji Kuchiishi ,  Toshihiro Higuchi ,  Hideo Haga ,  Yasunobu Ikeda

    发明人： Koji Kuchiishi ,  Toshihiro Higuchi ,  Hideo Haga ,  Yasunobu Ikeda

    IPC分类号： H05K500

    CPC分类号： H04M1/0277 ,  H05K7/1417

    摘要： First of all, a sub-PCB (6) is fixedly put on a surface of a chassis (5) as shown in an arrow I. At this time, a taper face (9a) of a guide rib (9) guides a fixed position of the sub-PCB (6) in a transverse direction. Next, the sub-PCB (6) is slid forward as shown in an arrow II. A front end of the sub-PCB (6) is led into a taper face (8b) of a fixed click (8) and is guided downward, and gets into the underside of the click and stops in a position of an abutting face (8c).

    摘要翻译： 首先，如箭头I所示，将副PCB（6）固定地放置在底盘（5）的表面上。此时，引导肋（9）的锥面（9a）引导固定 子PCB（6）在横向上的位置。 接下来，子PCB（6）如箭头II所示向前滑动。 子PCB（6）的前端被引导到固定点击（8）的锥形面（8b）中并被向下引导，并进入咔嗒声的下侧并且停止在邻接面的位置 8c）。

    Portable electronic equipment and battery mounting device of the equipment
    5.
    发明授权
    Portable electronic equipment and battery mounting device of the equipment 失效
    便携式电子设备和设备的电池安装装置

    公开(公告)号：US07043282B2

    公开(公告)日：2006-05-09

    申请号：US10466448

    申请日：2002-06-07

    申请人： Yoji Inomata ,  Yasunobu Ikeda ,  Toshihiro Higuchi

    发明人： Yoji Inomata ,  Yasunobu Ikeda ,  Toshihiro Higuchi

    IPC分类号： H04M1/00

    CPC分类号： H04M1/0262 ,  H01M2/1022 ,  H01M2/1066

    摘要： In order to enable both a back lid and a battery of a mobile electronic apparatus to be locked and unlocked with a single motion, the mobile electronic apparatus (10) in which the battery (11) is housed by opening the back lid (13) has such a structure that when a lock member (21) which is provided in a body of the mobile electronic apparatus so as to slide is slid to a locked position, the lock member (21) simultaneously locks both an engaging part (11a) provided in the battery (11) and an engaging part (13b) provided in the back lid (13), and when the lock member (21) is slid to an unlocked position, the lock member (21) simultaneously unlocks both the engaging parts (11a, 13b).

    摘要翻译： 为了使得后盖和移动电子设备的电池能够以单一动作被锁定和解锁，通过打开后盖（13）来容纳电池（11）的移动电子设备（10） 具有这样的结构：当设置在移动电子设备的主体中以便滑动的锁定构件（21）滑动到锁定位置时，锁定构件（21）同时锁定接合部分（11a） 设置在电池（11）中的接合部（13b）和设置在后盖（13）中的接合部（13b），并且当锁定构件（21）滑动到解锁位置时，锁定构件（21）同时解锁接合 部分（11a，13b）。

    Portable electronic apparatus and BGA package protective device
    6.
    发明授权
    Portable electronic apparatus and BGA package protective device 失效
    便携式电子仪器和BGA封装保护装置

    公开(公告)号：US07436676B2

    公开(公告)日：2008-10-14

    申请号：US10489498

    申请日：2002-06-07

    申请人： Toshihiro Higuchi ,  Shotaro Nagaike ,  Taku Yamada ,  Yoji Inomata

    发明人： Toshihiro Higuchi ,  Shotaro Nagaike ,  Taku Yamada ,  Yoji Inomata

    IPC分类号： H05K5/00

    CPC分类号： H05K9/0037 ,  H01H2239/01 ,  H04B1/3833 ,  H04M1/23 ,  H04M1/72544

    摘要： A portable electronic device in which microswitches (12) controlled by operation buttons (11) are mounted on one side of a printed circuit board (13), and circuit elements accommodated in BGA packages (14), (15) and (16) are soldered on the other side of the printed circuit board. In the portable electronic device, a shield wall (22) for surrounding the BGA packages (14), (15) and (16) is mounted on the printed circuit board (13), a first protrusion portion (18b) for holding down the shield wall (22) on the printed circuit board (13) is protruded from a case (18) of the portable electronic device (10), and second protrusion portion (18c) for holding down surfaces of the BGA packages (14); (15) and (16) on the printed circuit board (13) is protruded from the case (18) of the portable electronic device (10). With such a construction, the BGA packages are prevented from being peeled off from the printed circuit board (13). Further, even when the push buttons are frequently depressed in playing a game, the soldering parts of the BGA packages mounted on the back side of the operation button can be maintained in good conditions.

    摘要翻译： 一种便携式电子设备，其中由操作按钮（11）控制的微动开关（12）安装在印刷电路板（13）的一侧上，并且容纳在BGA封装（14），（15）和（16）中的电路元件是 焊接在印刷电路板的另一面。 在便携式电子设备中，用于围绕BGA封装（14），（15）和（16）的屏蔽壁（22）安装在印刷电路板（13）上，第一突起部分（18b）用于保持 印刷电路板（13）上的屏蔽壁（22）从便携式电子设备（10）的壳体（18）突出，并且用于保持BGA封装（14）的表面的第二突出部分（18c） ; 印刷电路板（13）上的（15）和（16）从便携式电子设备（10）的壳体（18）突出。 通过这样的结构，可以防止BGA封装从印刷电路板（13）剥离。 此外，即使在游戏中经常按下按钮时，安装在操作按钮背面的BGA封装的焊接部件也能够保持良好的状态。

    Solid state imaging device and fabrication method thereof, and camera incorporating the solid state imaging device
    7.
    发明申请
    Solid state imaging device and fabrication method thereof, and camera incorporating the solid state imaging device 有权
    固态成像装置及其制造方法以及并入固态成像装置的相机

    公开(公告)号：US20060158547A1

    公开(公告)日：2006-07-20

    申请号：US11333339

    申请日：2006-01-18

    申请人： Tomoko Komatsu ,  Toshihiro Higuchi

    发明人： Tomoko Komatsu ,  Toshihiro Higuchi

    IPC分类号： H04N5/225

    CPC分类号： H01L27/14621 ,  H01L27/14623 ,  H01L27/14627 ,  H01L27/14685

    摘要： A solid state imaging device of the present invention comprises: a semiconductor substrate; a plurality of light receiving elements arranged in a matrix configuration on the semiconductor substrate; a plurality of color filter segments provided above the light receiving elements; and a light collector provided above the color filter segments for collecting light on the light receiving elements. The color filter segments are mutually separated by interstices. The interstices contain a gas.

    摘要翻译： 本发明的固态成像装置包括：半导体衬底; 多个在所述半导体衬底上以矩阵构造布置的光接收元件; 设置在所述光接收元件上方的多个滤色器片段; 以及设置在滤色器片段上方的用于在光接收元件上收集光的集光器。 滤色片段通过间隙相互分离。 空隙含有气体。

    Solid state imaging device and fabrication method thereof, and camera incorporating the solid state imaging device
    8.
    发明授权
    Solid state imaging device and fabrication method thereof, and camera incorporating the solid state imaging device 有权
    固态成像装置及其制造方法以及并入固态成像装置的相机

    公开(公告)号：US08139131B2

    公开(公告)日：2012-03-20

    申请号：US11333339

    申请日：2006-01-18

    申请人： Tomoko Komatsu ,  Toshihiro Higuchi

    发明人： Tomoko Komatsu ,  Toshihiro Higuchi

    IPC分类号： H04N3/14 ,  H01L21/00 ,  H01L27/00 ,  H01L31/062

    CPC分类号： H01L27/14621 ,  H01L27/14623 ,  H01L27/14627 ,  H01L27/14685

    摘要： A solid state imaging device of the present invention comprises: a semiconductor substrate; a plurality of light receiving elements arranged in a matrix configuration on the semiconductor substrate; a plurality of color filter segments provided above the light receiving elements; and a light collector provided above the color filter segments for collecting light on the light receiving elements. The color filter segments are mutually separated by interstices. The interstices contain a gas.

    摘要翻译： 本发明的固态成像装置包括：半导体衬底; 多个在所述半导体衬底上以矩阵构造布置的光接收元件; 设置在所述光接收元件上方的多个滤色器片段; 以及设置在滤色器片段上方的用于在光接收元件上收集光的集光器。 滤色片段通过间隙相互分离。 空隙含有气体。

    SOLID-STATE IMAGING DEVICE AND METHOD FOR MANUFACTURING THE SAME
    10.
    发明申请
    SOLID-STATE IMAGING DEVICE AND METHOD FOR MANUFACTURING THE SAME 审中-公开
    固态成像装置及其制造方法

    公开(公告)号：US20090206430A1

    公开(公告)日：2009-08-20

    申请号：US11997959

    申请日：2006-04-25

    申请人： Toshihiro Higuchi ,  Masayuki Aoyama ,  Tomoko Komatsu

    发明人： Toshihiro Higuchi ,  Masayuki Aoyama ,  Tomoko Komatsu

    IPC分类号： H01L31/0232 ,  H01L21/302

    CPC分类号： G02B3/0018 ,  G02B3/0056 ,  G02B5/201 ,  G02B5/208 ,  H01L27/14627 ,  H01L27/14685 ,  H04N5/335

    摘要： A pattern (6B) is formed by performing selective exposure and development on a photosensitive resist (6A), and then the pattern (6B) is decolorized by irradiating the pattern with ultraviolet or visible light. Then, a microlens (6) is formed by deforming the shape of the pattern (6B) into a microlens shape by heating. An inequality of h/a≧1 is satisfied, where, (h) is the height of the microlens (6), and (2a) is the length of the bottom plane of the microlens (6) in a short side direction when viewed from the upper plane.

    摘要翻译： 通过对光敏抗蚀剂（6A）进行选择性曝光和显影来形成图案（6B），然后通过用紫外线或可见光照射图案来使图案（6B）脱色。 然后，通过加热将图案（6B）的形状变形为微透镜形状来形成微透镜（6）。 满足h / a> = 1的不等式，其中，（h）是微透镜（6）的高度，（2a）是微透镜（6）在短边方向上的底面的长度， 从上层飞机观察。