公开(公告)号：US06404110B1

公开(公告)日：2002-06-11

申请号：US09074824

申请日：1998-05-08

申请人： Koji Nakashima ,  Hideya Morishita ,  Hiromichi Yamada

发明人： Koji Nakashima ,  Hideya Morishita ,  Hiromichi Yamada

IPC分类号： H01L4108

CPC分类号： H03H9/059 ,  H03H9/145

摘要： A surface acoustic wave element includes a surface acoustic wave substrate, an interdigital transducer electrode provided on the surface acoustic wave substrate and a lead electrode provided on the surface acoustic wave substrate. The lead electrode is connected to the interdigital transducer electrode. The surface acoustic wave element further includes a bump electrode provided on a portion of the lead electrodes. The bump electrode includes a first electrode structure and a second electrode structure. The first electrode structure has a top surface and is arranged in contact with the lead electrode, and the second electrode structure covers a portion of the top surface of the first electrode structure such that the remaining portion of the top surface of the first electrode structure is exposed along an entire periphery of the top surface of the first electrode structure.

摘要翻译： 表面声波元件包括表面声波基板，设置在表面声波基板上的叉指式换能器电极和设置在弹性表面波基板上的引线电极。 引线电极连接到叉指式换能器电极。 表面声波元件还包括设置在引线电极的一部分上的突起电极。 突起电极包括第一电极结构和第二电极结构。 第一电极结构具有顶表面并且与引线电极接触地布置，并且第二电极结构覆盖第一电极结构的顶表面的一部分，使得第一电极结构的顶表面的剩余部分为 沿着第一电极结构的顶表面的整个周边露出。

公开(公告)号：US5712523A

公开(公告)日：1998-01-27

申请号：US495895

申请日：1995-06-28

申请人： Koji Nakashima ,  Hideya Morishita

发明人： Koji Nakashima ,  Hideya Morishita

IPC分类号： H03H3/10 ,  H03H9/02 ,  H03H9/08 ,  H03H9/25 ,  H01L41/08

CPC分类号： H03H9/02834 ,  H03H3/10 ,  H03H9/08

摘要： A SAW device (11) includes a SAW element (13) which is bonded onto a support substrate (12) in a face down mode through solder (19, 20), and a metal cap (21) enclosing the SAW element (13). Assuming that and .alpha..sub.1, .alpha..sub.2 and .alpha..sub.3 represent the thermal expansion coefficients of the SAW element (13), the support substrate (12) and the conductive cap (21) along the surface wave propagation direction respectively, .alpha..sub.3 .ltoreq..alpha..sub.1 when .alpha..sub.1 >.alpha..sub.2, and .alpha..sub.3 .ltoreq..alpha..sub.1 when .alpha..sub.1

摘要翻译： SAW器件（11）包括通过焊料（19,20）以面朝下模式结合到支撑衬底（12）上的SAW元件（13）和封闭SAW元件（13）的金属盖（21） 。 假设α1，α2和α3分别表示SAW元件（13），支撑基板（12）和导电盖（21）沿着表面波传播方向的热膨胀系数，α3 = 当α1>α2时为α1，当α1 <α2时α3为α1。

公开(公告)号：US6166476A

公开(公告)日：2000-12-26

申请号：US933217

申请日：1997-09-18

申请人： Koji Nakashima ,  Hideya Morishita

发明人： Koji Nakashima ,  Hideya Morishita

IPC分类号： H03H9/145 ,  H03H9/05 ,  H03H9/25 ,  H01L41/08

CPC分类号： H03H9/059

摘要： A 1-port type surface acoustic wave device can be produced by using the same tools as used for the production of a 2-port type surface acoustic wave device and achieves a substantial improvement in terms of impact resistance. A 1-port surface acoustic wave resonator includes a surface acoustic wave substrate, two dummy bump electrodes and two input/output bump electrodes disposed on the surface acoustic wave substrate adjacent to a plurality of input/output extraction electrodes.

摘要翻译： 可以通过使用与用于制造2端口型表面声波装置的工具相同的工具来制造1端口型弹性表面波装置，并且在耐冲击性方面实质上得到显着提高。 1端口声表面波谐振器包括表面声波衬底，两个虚拟凸起电极和布置在与多个输入/输出提取电极相邻的表面声波衬底上的两个输入/输出凸块电极。