FIELD EFFECT TRANSISTOR USING OXIDE SEMICONDUCTOR AND METHOD FOR MANUFACTURING THE SAME
    1.
    发明申请
    FIELD EFFECT TRANSISTOR USING OXIDE SEMICONDUCTOR AND METHOD FOR MANUFACTURING THE SAME 有权
    使用氧化物半导体的场效应晶体管及其制造方法

    公开(公告)号:US20130146452A1

    公开(公告)日:2013-06-13

    申请号:US13761929

    申请日:2013-02-07

    IPC分类号: H01L29/24

    摘要: A field effect transistor which includes, on a substrate, at least a semiconductor layer, a passivation layer for the semiconductor layer, a source electrode, a drain electrode, a gate insulating film and a gate electrode, the source electrode and the drain electrode being connected through the semiconductor layer, the gate insulating film being present between the gate electrode and the semiconductor layer, the passivation layer being at least on one surface side of the semiconductor layer, and the semiconductor layer including a composite oxide which comprises In (indium), Zn (zinc) and Ga (gallium) in the following atomic ratios (1) to (3): In/(In+Zn)=0.2 to 0.8   (1) In/(In+Ga)=0.59 to 0.99   (2) Zn/(Ga+Zn)=0.29 to 0.99   (3).

    摘要翻译: 一种场效应晶体管,其在衬底上至少包含半导体层,所述半导体层的钝化层,源电极,漏电极,栅绝缘膜和栅电极,所述源电极和所述漏电极为 通过所述半导体层连接,所述栅极绝缘膜存在于所述栅电极和所述半导体层之间,所述钝化层至少在所述半导体层的一个表面侧,所述半导体层包括复合氧化物,所述复合氧化物包括In(铟) ,In(In + Zn)= 0.2〜0.8(1)In /(In + Ga)= 0.59〜0.99(2)的Zn(锌)和Ga(镓) )Zn /(Ga + Zn)= 0.29〜0.99(3)。