摘要:
The positive-type radiation-sensitive resin composition for producing a metal-plating formed material relating to the present invention comprises (A) a polymer containing a structural unit having an acid-dissociative functional group, which is dissociated in the presence of an acid to generate an acidic functional group, and a crosslinking structure; (B) a radiation-sensitive acid generator; and (C) an organic solvent. The positive-type radiation-sensitive resin composition is excellent in sensitivity and resolution, exhibits excellent adhesion to a substrate, leaves no residue at an opening after development, and is capable of preventing occurrence of crack in the resin film after metal plating and push-in of plated metal into the resin film.
摘要:
The acid transfer composition of the invention comprises a radiation-sensitive acid generator, a polymer having a nitrogen-containing group and a ketone-based solvent. The composition may comprise further a sensitizer. The pattern forming method of the invention comprises a second resin film formation process in which the acid transfer composition is used to form a second resin film (acid transfer film) on a first resin film containing an acid-dissociable group-containing resin, but not containing a radiation-sensitive acid generator, an exposure process for exposing the second resin film to a light through a mask to generate an acid in the second resin film, an acid transfer process for transferring the acid generated in the second resin film to the first resin film, and a second resin film removing process.
摘要:
A compound synthesis method includes bonding a first compound to a substrate to form a first film. A second film is formed on the first film using an acid-transfer composition including (A) a polymer that includes a structural unit shown by a following formula (1) and a structural unit shown by a following formula (2), (B) a photoacid generator shown by a following formula (3), and (C) a sensitizer shown by a following formula (4). The second film is exposed to remove the protecting group from the first compound under an exposed are of the second film. An acid generated in the exposed area of the second film is transferred to the first film. The second film after being exposed is removed. A second compound is bonded to the first compound from which the protecting group has been removed.
摘要:
A first film-modifying method includes forming a second film on a first film that includes an acid-dissociable group. The second film is an acid transfer resin film that includes a photoacid generator. The second film is exposed via a mask so that the second film generates an acid. The acid generated by the second film is transferred to the first film. The second film is removed