公开(公告)号：US20070161521A1

公开(公告)日：2007-07-12

申请号：US11330922

申请日：2006-01-12

申请人： Krishna Sachdev ,  Mark Chace ,  Normand Cote ,  David Gardell ,  Jeffrey Gelorme ,  Sushumna Iruvanti ,  G. Lawson ,  Tuknekah Noble ,  Harbans Sachdev

发明人： Krishna Sachdev ,  Mark Chace ,  Normand Cote ,  David Gardell ,  Jeffrey Gelorme ,  Sushumna Iruvanti ,  G. Lawson ,  Tuknekah Noble ,  Harbans Sachdev

IPC分类号： C10M129/10 ,  C10M137/02

CPC分类号： C10M129/10 ,  C09K5/10 ,  C10M137/02 ,  C10M2205/0285 ,  C10M2207/024 ,  C10M2207/026 ,  C10M2215/064 ,  C10M2223/049 ,  C10N2230/08 ,  C10N2230/10 ,  C10N2240/201

摘要： Liquid compositions containing a specific hindered phenol or a hindered phenol in combination with an aromatic phosphite are provided which are used as a thermal interface between a heatsink and a chip during a test procedure for electronic components which compositions enhance the thermal conductivity between the heatsink and the chip, are easily removed from the heatsink and the chip after the test procedure without any deleterious residue and which allow the use of high temperatures for extended periods during the test procedure without any significant degradation of the composition. A method for using the compositions in electronic component test procedures such as burn-in procedures is also provided.

摘要翻译： 提供了含有特定受阻酚或受阻酚与芳族亚磷酸酯组合的液体组合物，其用于在电子部件的测试过程期间用作散热器和芯片之间的热界面，该组合物增强了散热器和 芯片，在测试程序之后容易地从散热器和芯片上移除而没有任何有害的残留物，并且允许在测试过程中长时间使用高温而没有组合物的任何显着降解。 还提供了一种在诸如老化程序的电子部件测试程序中使用组合物的方法。

公开(公告)号：US20050087490A1

公开(公告)日：2005-04-28

申请号：US10695374

申请日：2003-10-28

申请人： Mark Chace ,  Jeffrey Hedrick ,  Habib Hichri ,  Keith Pope ,  Jia Lee ,  Kelly Malone ,  Kenneth McCullough ,  Wayne Moreau ,  Darryl Restaino ,  Shahab Siddiqui

发明人： Mark Chace ,  Jeffrey Hedrick ,  Habib Hichri ,  Keith Pope ,  Jia Lee ,  Kelly Malone ,  Kenneth McCullough ,  Wayne Moreau ,  Darryl Restaino ,  Shahab Siddiqui

IPC分类号： B01D11/04 ,  B01D11/00

CPC分类号： B01D11/0407

摘要： A process of removing impurities from a cured low dielectric constant organic polymeric film disposed on a semiconductor device. The process involves disposing a low dielectric constant curable organic polymeric film on an electrically conductive surface of a semiconductor device. The organic polymeric film is cured on the semiconductor device and thereupon contacted with supercritical carbon dioxide, optionally in the presence of at least one cosolvent.

摘要翻译： 从设置在半导体器件上的固化的低介电常数有机聚合物膜去除杂质的方法。 该方法包括将低介电常数可固化有机聚合物膜设置在半导体器件的导电表面上。 有机聚合物膜在半导体器件上固化，随后与超临界二氧化碳接触，任选地在至少一种助溶剂的存在下。