公开(公告)号：US20080017223A1

公开(公告)日：2008-01-24

申请号：US11831030

申请日：2007-07-31

Applicant: Krishna Sachdev ,  Daniel Berger ,  Kelly Chioujones ,  Glenn Daves ,  Hilton Toy

Inventor： Krishna Sachdev ,  Daniel Berger ,  Kelly Chioujones ,  Glenn Daves ,  Hilton Toy

IPC: B08B3/00

CPC classification number: H01L24/32 ,  C08K3/08 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/433 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/3011 ,  H05K3/321 ,  Y10T428/31515 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014

Abstract: A method of removing cured conductive polymer adhesives, disclosed here as thermal interface materials, from electronic components for reclamation or recovery of usable parts of module assemblies, particularly high cost semiconductor devices, heat sinks and other module components.

Abstract translation: 从用于回收或回收模块组件的可用部件，特别是高成本的半导体器件，散热器和其它模块部件的电子部件中去除固化的导电聚合物粘合剂（这里公开为热界面材料）的方法。

公开(公告)号：US20070270536A1

公开(公告)日：2007-11-22

申请号：US11831039

申请日：2007-07-31

Applicant: Krishna Sachdev ,  Daniel Berger ,  Kelly Chioujones ,  Glenn Daves ,  Hilton Toy

Inventor： Krishna Sachdev ,  Daniel Berger ,  Kelly Chioujones ,  Glenn Daves ,  Hilton Toy

IPC: C08K3/08

CPC classification number: H01L24/32 ,  C08K3/08 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/433 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/3011 ,  H05K3/321 ,  Y10T428/31515 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014

Abstract: A reworkable conductive adhesive composition, comprising an epoxy based conductive adhesive containing conductive metal filler particles dispersed in a solvent-free hybrid epoxy polymer matrix.

Abstract translation: 一种可再加工的导电粘合剂组合物，其包含环氧基导电粘合剂，其包含分散在无溶剂的杂环氧聚合物基质中的导电金属填料颗粒。

公开(公告)号：US20070161521A1

公开(公告)日：2007-07-12

申请号：US11330922

申请日：2006-01-12

Applicant: Krishna Sachdev ,  Mark Chace ,  Normand Cote ,  David Gardell ,  Jeffrey Gelorme ,  Sushumna Iruvanti ,  G. Lawson ,  Tuknekah Noble ,  Harbans Sachdev

Inventor： Krishna Sachdev ,  Mark Chace ,  Normand Cote ,  David Gardell ,  Jeffrey Gelorme ,  Sushumna Iruvanti ,  G. Lawson ,  Tuknekah Noble ,  Harbans Sachdev

IPC: C10M129/10 ,  C10M137/02

CPC classification number: C10M129/10 ,  C09K5/10 ,  C10M137/02 ,  C10M2205/0285 ,  C10M2207/024 ,  C10M2207/026 ,  C10M2215/064 ,  C10M2223/049 ,  C10N2230/08 ,  C10N2230/10 ,  C10N2240/201

Abstract: Liquid compositions containing a specific hindered phenol or a hindered phenol in combination with an aromatic phosphite are provided which are used as a thermal interface between a heatsink and a chip during a test procedure for electronic components which compositions enhance the thermal conductivity between the heatsink and the chip, are easily removed from the heatsink and the chip after the test procedure without any deleterious residue and which allow the use of high temperatures for extended periods during the test procedure without any significant degradation of the composition. A method for using the compositions in electronic component test procedures such as burn-in procedures is also provided.

Abstract translation: 提供了含有特定受阻酚或受阻酚与芳族亚磷酸酯组合的液体组合物，其用于在电子部件的测试过程期间用作散热器和芯片之间的热界面，该组合物增强了散热器和 芯片，在测试程序之后容易地从散热器和芯片上移除而没有任何有害的残留物，并且允许在测试过程中长时间使用高温而没有组合物的任何显着降解。 还提供了一种在诸如老化程序的电子部件测试程序中使用组合物的方法。

公开(公告)号：US20060069177A1

公开(公告)日：2006-03-30

申请号：US10953752

申请日：2004-09-29

Applicant: Krishna Sachdev ,  Daniel Berger ,  Kelly Chioujones ,  Brian Quinlan

Inventor： Krishna Sachdev ,  Daniel Berger ,  Kelly Chioujones ,  Brian Quinlan

IPC: A61K9/16 ,  B29D11/00

CPC classification number: H05K3/287 ,  H01L21/50 ,  H01L23/10 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K3/0023 ,  H05K3/225 ,  H05K3/386 ,  H05K2201/0209 ,  H05K2201/0212 ,  H01L2924/00

Abstract: Solvent-free UV-curable polymer materials derived from miscible blends of reactive organic monomeric, oligomeric and low molecular polymeric systems and organic and inorganic fillers such as polytetrafluoroethylene and talc are provided to form polymer-filler composite compositions for use in the fabrication and repair of electronic components and microelectronic assembly processes. The composition contains a preformed thermoplastic or elastomeric polymer/oligomer with reactive end groups, a monofunctional and/or bifunctional acrylate monomer, a multifunctional (more than two reactive groups) acrylated/methacrylated monomer, a photoinitiator and a fluorocarbon polymer powder as an organic filler which is preferably PTFE and an inorganic filler such as talc. A nano-filler may also be used as the inorganic filler alone or in combination with another inorganic filler such as talc A method is also provided for repairing defects on ceramic substrates using the composition of the invention or other curable polymeric compositions.

Abstract translation: 提供衍生自反应性有机单体，低聚物和低分子聚合物体系的混溶混合物以及有机和无机填料如聚四氟乙烯和滑石的无溶剂紫外线固化聚合物材料，以形成用于制造和修复的聚合物 - 填料复合组合物 电子元件和微电子组装工艺。 该组合物含有具有反应性端基的预成型热塑性或弹性聚合物/低聚物，单官能和/或双官能丙烯酸酯单体，多官能（多于两个反应性基团）丙烯酸酯化/甲基丙烯酸酯化的单体，光引发剂和作为有机填料的氟碳聚合物粉末 其优选为PTFE和无机填料如滑石。 纳米填料也可以单独使用或与另一种无机填料如滑石一起使用。还提供了使用本发明组合物或其它可固化的聚合物组合物修复陶瓷衬底上的缺陷的方法。

公开(公告)号：US20060014309A1

公开(公告)日：2006-01-19

申请号：US10891542

申请日：2004-07-13

Applicant: Krishna Sachdev ,  Daniel Berger ,  Kelly Chioujones ,  Richard Indyk

Inventor： Krishna Sachdev ,  Daniel Berger ,  Kelly Chioujones ,  Richard Indyk

IPC: G01R31/26 ,  H01L21/66

CPC classification number: G01R1/0466 ,  G01R1/0483 ,  G01R31/2863 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2224/81801 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/10253 ,  H05K3/321 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A method for temporary chip attach to determine known good die using a reworkable conductive adhesive interconnection between the chip carrier and die. The die is easily separated from the chip carrier after test, without the use of potentially damaging shear forces, by subjecting the TCA assembly to a rework solution.

Abstract translation: 一种临时芯片连接的方法，用于使用芯片载体和芯片之间的可再加工的导电粘合剂互连来确定已知的良好的裸片。 通过使TCA组件经受返工解决方案，模具在测试后容易地与芯片载体分离，而不会使用潜在的有害的剪切力。

公开(公告)号：US20050256241A1

公开(公告)日：2005-11-17

申请号：US10709518

申请日：2004-05-11

Applicant: Krishna Sachdev ,  Daniel Berger ,  Kelly Chioujones ,  Glenn Daves ,  Hilton Toy

Inventor： Krishna Sachdev ,  Daniel Berger ,  Kelly Chioujones ,  Glenn Daves ,  Hilton Toy

IPC: C09D9/00 ,  C08K3/08 ,  C09J9/02 ,  C09J11/04 ,  C09J163/00 ,  C09J183/06 ,  H01B1/00 ,  H01B1/22 ,  H01B1/24 ,  H01L23/373 ,  H01L23/42 ,  H01L23/433 ,  H05K3/32

CPC classification number: H01L24/32 ,  C08K3/08 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/433 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/3011 ,  H05K3/321 ,  Y10T428/31515 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014

Abstract: A reworkable conductive adhesive composition, and method of making such, comprising an epoxy based conductive adhesive containing conductive metal filler particles dispersed in a solvent-free hybrid epoxy polymer matrix. In an additional embodiment an improved method of removing cured conductive polymer adhesives, disclosed here as thermal interface materials, from electronic components for reclamation or recovery of usable parts of module assemblies, particularly high cost semiconductor devices, heat sinks and other module components.

Abstract translation: 可再加工的导电粘合剂组合物及其制造方法包括含有分散在无溶剂的杂环氧聚合物基质中的导电金属填料颗粒的环氧基导电粘合剂。 在另外的实施方案中，从用于回收或回收模块组件的可用部件，特别是高成本半导体器件，散热器和其它模块部件的电子部件中去除固化的导电聚合物粘合剂（这里公开为热界面材料）的改进方法。

公开(公告)号：US20070154631A1

公开(公告)日：2007-07-05

申请号：US11684679

申请日：2007-03-12

Applicant: Krishna Sachdev ,  Michael Berger ,  Gregg Monjeau ,  Robert Rita ,  Kathleen Wiley

Inventor： Krishna Sachdev ,  Michael Berger ,  Gregg Monjeau ,  Robert Rita ,  Kathleen Wiley

IPC: B05D3/00 ,  B05D3/02

CPC classification number: H05K3/386 ,  C03C17/32 ,  C04B41/009 ,  C04B41/488 ,  C04B41/83 ,  C04B2111/00844 ,  C08G73/10 ,  C08G73/1014 ,  C08G73/1017 ,  C08G73/1039 ,  C08G73/1042 ,  C08G73/1067 ,  C08G73/1075 ,  H01L21/4807 ,  H05K1/0306 ,  H05K3/225 ,  H05K2201/0154 ,  C04B41/455 ,  C04B35/00

Abstract: A method to repair ceramic substrates is disclosed using a novel polyimide polymer which has high thermal stability, resistance to fluxes and flux residue cleaning solvents and processes, good mechanical properties, good adhesion to all contacting surfaces with low moisture uptake and good flow properties suitable for repairing chipped ceramic, filling deep trench or vias and writing passivation lines with automated process The polyimide polymer is made by reacting aromatic dianhydride and aromatic diamine monomers with a stoichiometric offset and end capping the resulting polymer when the reaction is completed. The preferred polyimide is made using a molar excess of diamine which is end-capped using an anhydride.

Abstract translation: 公开了一种修复陶瓷基板的方法，该方法具有高热稳定性，耐焊剂和焊剂残留物清洗溶剂和工艺的良好的机械性能，对所有接触表面的良好粘合性，具有低吸湿性和良好的流动性能，适用于 修复切屑陶瓷，填充深沟或通孔，并用自动化工艺写入钝化线聚酰亚胺聚合物是通过使化学计量偏移的芳族二酐和芳族二胺单体反应制得的，并在反应完成时封端所得聚合物。 使用摩尔过量的二胺制成优选的聚酰亚胺，其使用酸酐封端。

公开(公告)号：US06635118B2

公开(公告)日：2003-10-21

申请号：US09765015

申请日：2001-01-17

Applicant: Harbans S. Sachdev ,  Richard A. Cormack ,  Gerard V. Capogna ,  Felice J. Mancaruso ,  Krishna Sachdev

Inventor： Harbans S. Sachdev ,  Richard A. Cormack ,  Gerard V. Capogna ,  Felice J. Mancaruso ,  Krishna Sachdev

IPC: B08B702

CPC classification number: C11D3/044 ,  B08B3/02 ,  B08B3/12 ,  C11D1/662 ,  C11D1/72 ,  C11D1/722 ,  C11D1/94 ,  C11D3/2082 ,  C11D3/2086 ,  C11D3/30 ,  C11D11/0041 ,  Y10S134/902 ,  Y10S438/905

Abstract: This invention relates to water-based alkaline cleaning solutions and their use as an environmentally safer replacement of organic solvents to remove photoresist, polyimide residue and other interlevel dielectric polymer coating residue from polymer film apply equipment, specifically, spin coater bowl and assembly parts consisting of a teflon top shield, stainless steel plate, and a bottom teflon spin coating bowl used in semiconductor device fabrication processes.