摘要:
Methods of ONO integration into MOS flow are provided. In one embodiment, the method comprises: (i) forming a pad dielectric layer above a MOS device region of a substrate; and (ii) forming a patterned dielectric stack above a non-volatile device region of the substrate, the patterned dielectric stack comprising a tunnel layer, a charge-trapping layer, and a sacrificial top layer, the charge-trapping layer comprising multiple layers including a first nitride layer formed on the tunnel layer and a second nitride layer, wherein the first nitride layer is oxygen rich relative to the second nitride layer. Other embodiments are also described.
摘要:
A method of ONO integration of a non-volatile memory device (e.g. EEPROM, floating gate FLASH and SONOS) into a baseline MOS device (e.g. MOSFET) is described. In an embodiment the bottom two ONO layers are formed prior to forming the channel implants into the MOS device, and the top ONO layer is formed simultaneously with the gate oxide of the MOS device.
摘要:
A method for forming a tunneling layer of a nonvolatile trapped-charge memory device and the article made thereby. The method includes multiple oxidation and nitridation operations to provide a dielectric constant higher than that of a pure silicon dioxide tunneling layer but with a fewer hydrogen and nitrogen traps than a tunneling layer having nitrogen at the substrate interface. The method provides for an improved memory window in a SONOS-type device. In one embodiment, the method includes an oxidation, a nitridation, a reoxidation and a renitridation. In one implementation, the first oxidation is performed with O2 and the reoxidation is performed with NO.
摘要:
A nonvolatile charge trap memory device is described. The device includes a substrate having a channel region and a pair of source/drain regions. A gate stack is above the substrate over the channel region and between the pair of source/drain regions. The gate stack includes a multi-layer charge-trapping region having a first deuterated layer. The multi-layer charge-trapping region may further include a deuterium-free charge-trapping layer.
摘要:
A semiconductor structure and method to form the same. The semiconductor structure includes a substrate having a non-volatile charge trap memory device disposed on a first region and a logic device disposed on a second region. A charge trap dielectric stack may be formed subsequent to forming wells and channels of the logic device. HF pre-cleans and SC1 cleans may be avoided to improve the quality of a blocking layer of the non-volatile charge trap memory device. The blocking layer may be thermally reoxidized or nitridized during a thermal oxidation or nitridation of a logic MOS gate insulator layer to densify the blocking layer. A multi-layered liner may be utilized to first offset a source and drain implant in a high voltage logic device and also block silicidation of the nonvolatile charge trap memory device.
摘要:
A nonvolatile charge trap memory device with deuterium passivation of charge traps and method of manufacture. Deuterated gate layer, deuterated gate cap layer and deuterated spacers are employed in various combinations to encapsulate the device with deuterium sources proximate to the interfaces within the gate stack and on the surface of the gate stack where traps may be present.
摘要:
A semiconductor structure and method to form the same. The semiconductor structure includes a substrate having a non-volatile charge trap memory device disposed on a first region and a logic device disposed on a second region. A charge trap dielectric stack may be formed subsequent to forming wells and channels of the logic device. HF pre-cleans and SC1 cleans may be avoided to improve the quality of a blocking layer of the non-volatile charge trap memory device. The blocking layer may be thermally reoxidized or nitridized during a thermal oxidation or nitridation of a logic MOS gate insulator layer to densify the blocking layer. A multi-layered liner may be utilized to first offset a source and drain implant in a high voltage logic device and also block silicidation of the nonvolatile charge trap memory device.
摘要:
A nonvolatile charge trap memory device with deuterium passivation of charge traps and method of manufacture. Deuterated gate layer, deuterated gate cap layer and deuterated spacers are employed in various combinations to encapsulate the device with deuterium sources proximate to the interfaces within the gate stack and on the surface of the gate stack where traps may be present.
摘要:
A nonvolatile charge trap memory device is described. The device includes a substrate having a channel region and a pair of source/drain regions. A gate stack is above the substrate over the channel region and between the pair of source/drain regions. The gate stack includes a multi-layer charge-trapping region having a first deuterated layer. The multi-layer charge-trapping region may further include a deuterium-free charge-trapping layer.
摘要:
A method for forming a tunneling layer of a nonvolatile trapped-charge memory device and the article made thereby. The method includes multiple oxidation and nitridation operations to provide a dielectric constant higher than that of a pure silicon dioxide tunneling layer but with a fewer hydrogen and nitrogen traps than a tunneling layer having nitrogen at the substrate interface. The method provides for an improved memory window in a SONOS-type device. In one embodiment, the method includes an oxidation, a nitridation, a reoxidation and a renitridation. In one implementation, the first oxidation is performed with O2 and the reoxidation is performed with NO.