摘要:
In a method of forming a conductive pattern in a semiconductor device, a conductive layer including a metal is formed on a substrate. A mask including carbon is provided on the conductive layer, and the conductive pattern is formed on the substrate by etching the conductive layer using the mask as an etching mask. The mask is removed from the conductive pattern by an oxygen plasma ashing process. An oxidized portion of the conductive pattern is reduced. The conductive pattern may have a desired resistance by reducing the oxidized portion to improve electrical characteristics and reliability of the semiconductor device.
摘要:
In an embodiment, a method of forming a capacitor for a semiconductor device of which structural stability is improved is shown. Cylindrical storage electrodes are formed in a matrix pattern on a substrate that includes an insulation interlayer having contacts therein so that a mold layer surrounds the cylindrical storage electrodes. Sacrificial plugs are formed with a cap within these electrodes. A stabilizing layer is formed on the etched mold layer and the cylindrical storage electrode by partially etching the mold layer. The stabilizing layer is etched until the sacrificial plug is exposed, thereby forming a spacer. While the sacrificial plug and the mold layer are fully removed, the spacer is partially removed, thereby forming a stabilizing member for supporting neighboring storage electrodes adjacent to each other. Accordingly, a structural stability of the capacitor is improved.
摘要:
A semiconductor device includes a lower electrode, a supporting member enclosing at least an upper portion of the lower electrode, a dielectric layer on the lower electrode and the supporting member, and an upper electrode disposed on the dielectric layer. The supporting member may have a first portion that extends over an upper part of the sidewall of the lower electrode, and a second portion covering the upper surface of the lower electrode. The first portion of the supporting member protrudes above the lower electrode.
摘要:
In a method of forming a contact structure, first and second conductive structures may be formed on a lower structure to be spaced from each other. An insulating layer may be formed on the lower structure to cover the first and second conductive structures. A first hole exposing the first conductive structure may be formed through the insulating layer. A spacer may be formed on a sidewall of the first hole. A first contact electrically coupled to the first conductive structure may be formed in the first hole having the sidewall on which the spacer is formed. A portion of the insulating layer located between the spacers may be removed to form a second hole exposing the second conductive structure. A second contact electrically coupled to the second conductive structure may be formed in the second hole.
摘要:
A semiconductor device includes a lower electrode, a supporting member enclosing at least an upper portion of the lower electrode, a dielectric layer on the lower electrode and the supporting member, and an upper electrode disposed on the dielectric layer. The supporting member may have a first portion that extends over an upper part of the sidewall of the lower electrode, and a second portion covering the upper surface of the lower electrode. The first portion of the supporting member protrudes above the lower electrode.
摘要:
In a method of forming a contact structure, first and second conductive structures may be formed on a lower structure to be spaced from each other. An insulating layer may be formed on the lower structure to cover the first and second conductive structures. A first hole exposing the first conductive structure may be formed through the insulating layer. A spacer may be formed on a sidewall of the first hole. A first contact electrically coupled to the first conductive structure may be formed in the first hole having the sidewall on which the spacer is formed. A portion of the insulating layer located between the spacers may be removed to form a second hole exposing the second conductive structure. A second contact electrically coupled to the second conductive structure may be formed in the second hole.
摘要:
There are provided a semiconductor memory device including a cylindrical storage electrode and a method of manufacturing the same. The semiconductor memory device includes an interlevel dielectric layer with storage contact plugs formed on a semiconductor substrate. Cylindrical storage electrodes are formed above the interlevel dielectric layer and are electrically connected to the storage contact plugs. A spacer is coupled to a predetermined portion of the outer wall of the storage electrodes. A dielectric layer is formed on the storage electrode and on the spacer, and a plate electrode is formed above the dielectric layer. Accordingly, leaning and bit fail of the storage electrode are prevented.
摘要:
A method of manufacturing a cylindrical storage node in a semiconductor device, in which loss differences of the cylindrical storage node between the center and the edge of cell areas, caused by an etch-back process of storage node isolation, is minimized, thereby maintaining uniform electrical capacitances over the entire area of a semiconductor wafer.
摘要:
There are provided a semiconductor memory device including a cylindrical storage electrode and a method of manufacturing the same. The semiconductor memory device includes an interlevel dielectric layer with storage contact plugs formed on a semiconductor substrate. Cylindrical storage electrodes are formed above the interlevel dielectric layer and are electrically connected to the storage contact plugs. A spacer is coupled to a predetermined portion of the outer wall of the storage electrodes. A dielectric layer is formed on the storage electrode and on the spacer, and a plate electrode is formed above the dielectric layer. Accordingly, leaning and bit fail of the storage electrode are prevented.
摘要:
Semiconductor devices having a plurality of fuses and methods of forming the same are provided. The semiconductor device having a fuse including a substrate having a cell region and/or a fuse box region. A first insulation interlayer may be formed on the substrate. A first etch stop layer may be formed on the first insulation interlayer. A metal wiring including a barrier layer, a metal layer and/or a capping layer may be formed on the first etch stop layer of the cell region. Fuses, spaced apart from each other, may be formed on the first etch stop layer of the fuse box region. Each fuse may include the barrier layer and/or the metal layer. A second insulation interlayer having an opening exposing the fuse box region may be formed on the metal wiring and/or the first etch stop layer. The etch stop layer may allow the fuses to be formed more uniformly and decrease the probability of breaking the fuses.