公开(公告)号：US20070151711A1

公开(公告)日：2007-07-05

申请号：US11325543

申请日：2006-01-05

Applicant: Kuo-Hsin Chen ,  Hsuan-Chih Lin

Inventor： Kuo-Hsin Chen ,  Hsuan-Chih Lin

IPC: H05K7/20 ,  B23P6/00

CPC classification number: H01L23/427 ,  B23P2700/10 ,  F28D15/0275 ,  F28F1/32 ,  H01L23/4006 ,  H01L23/467 ,  H01L2924/0002 ,  Y10T29/49353 ,  H01L2924/00

Abstract: A heat sink and a method for manufacturing the same. The heat sink is used to contact on a heat-generating source of an electronic device. The heat sink comprises a heat-conducting member and at least one heat pipe. With the bottom edge of a heat-absorbing end of the heat pipe contacting with the surface of the heat-generating source, and with the tight connection between the heat pipe and the heat-conducting member, the heat-conducting rate and the heat-dissipating performance of the heat sink can be greatly increase.

Abstract translation: 散热器及其制造方法。 散热器用于在电子设备的发热源上接触。 散热器包括导热构件和至少一个热管。 随着热管的吸热端的底部边缘与发热源的表面接触，并且随着热管和导热构件之间的紧密连接，导热率和热传导率， 散热性能可以大大提高。

公开(公告)号：US20070131390A1

公开(公告)日：2007-06-14

申请号：US11297450

申请日：2005-12-09

Applicant: Kuo-Hsin Chen ,  Hsuan-Chih Lin

Inventor： Kuo-Hsin Chen ,  Hsuan-Chih Lin

IPC: H05K7/20 ,  F28D15/00

CPC classification number: H01L23/3672 ,  F28D15/0233 ,  F28D15/0266 ,  F28D15/0275 ,  F28F1/32 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A heat dissipating module includes thermal conductive pipes and a thermal fin module. The thermal fin module made by pressing and stacking is mounted on the thermal conductive pipes. Next, a jig is set on a top surface of the thermal fin module, and a force compresses the thermal fin module, so as to reduce a distance between two fins of the thermal fin module. Then, a fixing plate is set above the thermal fin module on the thermal conductive pipes, and the jig is removed. Finally, the fixing plate is fixed on the thermal fin module, and the thermal fin module is securely fixed with the thermal conductive pipes. Therefore, the assembled heat dissipating module could not be loosed and deformed during delivery and the engaging contact between the fins and the thermal conductive pipes are enhanced, so to increase the heat dissipating effect of the heat dissipating module.

Abstract translation: 散热模块包括导热管和散热片模块。 通过压制和堆叠制成的散热片模块安装在导热管上。 接下来，在散热片模块的顶面上设置夹具，并且力压缩热散热片模块，以便减小散热片模块的两个散热片之间的距离。 然后，将固定板设置在导热管上的散热片模块上方，并移除夹具。 最后，固定板固定在散热片模块上，散热片模块与导热管牢固固定。 因此，组装的散热模块在输送期间不能松动和变形，并且翅片和导热管之间的接合接触增强，从而增加散热模块的散热效果。

公开(公告)号：US20080028611A1

公开(公告)日：2008-02-07

申请号：US11843910

申请日：2007-08-23

Applicant: Kuo-Hsin Chen ,  Hsuan-Chih Lin

Inventor： Kuo-Hsin Chen ,  Hsuan-Chih Lin

IPC: B21D53/08

CPC classification number: H01L23/467 ,  F28D15/0233 ,  F28D15/0266 ,  F28D15/0275 ,  F28F1/32 ,  H01L23/3672 ,  H01L23/427 ,  H01L2924/0002 ,  Y10T29/49368 ,  H01L2924/00

Abstract: A heat dissipating device includes thermal conductive pipes and a plurality of thermal fin modules. Each thermal fin module made by pressing and stacking is mounted on the thermal conductive pipes. A retainer is located between each two thermal fin modules to compress the thermal fin module, so that a distance between two fins of the thermal fin module is reduced. Finally, a fixing plate is set above the last thermal fin module on the thermal conductive pipes to fix the thermal fin modules securely engaged with the thermal conductive pipes. Therefore, the assembled heat dissipating module could not be loosed and deformed during delivery and the engaging contact between the fins and the thermal conductive pipes are enhanced, so to increase the heat dissipating effect of the heat dissipating module.

Abstract translation: 散热装置包括导热管和多个散热片模块。 通过压制和堆叠制成的每个散热片模块安装在导热管上。 保持器位于每个两个散热片模块之间，以压缩散热片模块，从而减小散热片模块的两个散热片之间的距离。 最后，将固定板设置在导热管上的最后一个散热片模块上方，以将散热片模块固定在导热管上。 因此，组装的散热模块在输送期间不能松动和变形，并且翅片和导热管之间的接合接触增强，从而增加散热模块的散热效果。

公开(公告)号：US20090038777A1

公开(公告)日：2009-02-12

申请号：US12187819

申请日：2008-08-07

Applicant: Kuo-Hsin Chen ,  Hsuan-Chih Lin

Inventor： Kuo-Hsin Chen ,  Hsuan-Chih Lin

IPC: F28F7/00

CPC classification number: F28D15/0266 ,  F28D15/0275 ,  F28F1/32 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  Y10T29/49353 ,  H01L2924/00

Abstract: In a heat sink and the manufacturing method thereof, the heat sink includes heat dissipation fins and heat pipes, and the heat dissipation fins have through holes for the heat pipes to pass through. The heat dissipating fins also have a notch formed at the peripheral of the through hole and communicating with the through hole, and openings formed at two sides of the notch, respectively. According to the manufacturing method, after the heat pipe is assembled with the heat dissipating fin, press strips pass through the openings and are pressed inwardly to reduce the notch to make the notch and the heat pipe plastically deformed. Finally the press strips are removed.

Abstract translation: 在散热片及其制造方法中，散热片包括散热翅片和热管，散热片具有通过热管的通孔。 散热片还具有形成在通孔的周边并与通孔连通的凹口，以及形成在凹口两侧的开口。 根据制造方法，在热管与散热片组装之后，压条穿过开口并被向内压入以减小切口以使切口和热管塑性变形。 最后删除压条。

公开(公告)号：US20080041567A1

公开(公告)日：2008-02-21

申请号：US11843934

申请日：2007-08-23

Applicant: Kuo-Hsin Chen ,  Hsuan-Chih Lin

Inventor： Kuo-Hsin Chen ,  Hsuan-Chih Lin

IPC: H05K7/20

CPC classification number: H01L23/3672 ,  F28D15/0233 ,  F28D15/0266 ,  F28D15/0275 ,  F28F1/32 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A heat dissipating module includes thermal conductive pipes and a thermal fin module. The thermal fin module made by pressing and stacking is mounted on the thermal conductive pipes. Next, a jig is set on a top surface of the thermal fin module, and a force compresses the thermal fin module, so as to reduce a distance between two fins of the thermal fin module. Then, a fixing plate is set above the thermal fin module on the thermal conductive pipes, and the jig is removed. Finally, the fixing plate is fixed on the thermal fin module, and the thermal fin module is securely fixed with the thermal conductive pipes. Therefore, the assembled heat dissipating module could not be loosed and deformed during delivery and the engaging contact between the fins and the thermal conductive pipes are enhanced, so to increase the heat dissipating effect of the heat dissipating module.

Abstract translation: 散热模块包括导热管和散热片模块。 通过压制和堆叠制成的散热片模块安装在导热管上。 接下来，在散热片模块的顶面上设置夹具，并且力压缩热散热片模块，以便减小散热片模块的两个散热片之间的距离。 然后，将固定板设置在导热管上的散热片模块上方，并移除夹具。 最后，固定板固定在散热片模块上，散热片模块与导热管牢固固定。 因此，组装的散热模块在输送期间不能松动和变形，并且翅片和导热管之间的接合接触增强，从而增加散热模块的散热效果。

公开(公告)号：US20070131389A1

公开(公告)日：2007-06-14

申请号：US11297402

申请日：2005-12-09

Applicant: Kuo-Hsin Chen ,  Hsuan-Chih Lin

Inventor： Kuo-Hsin Chen ,  Hsuan-Chih Lin

IPC: H05K7/20 ,  F28D15/00

CPC classification number: H01L23/467 ,  F28D15/0233 ,  F28D15/0266 ,  F28D15/0275 ,  F28F1/32 ,  H01L23/3672 ,  H01L23/427 ,  H01L2924/0002 ,  Y10T29/49368 ,  H01L2924/00

Abstract: A heat dissipating device includes thermal conductive pipes and a plurality of thermal fin modules. Each thermal fin module made by pressing and stacking is mounted on the thermal conductive pipes. A retainer is located between each two thermal fin modules to compress the thermal fin module, so that a distance between two fins of the thermal fin module is reduced. Finally, a fixing plate is set above the last thermal fin module on the thermal conductive pipes to fix the thermal fin modules securely engaged with the thermal conductive pipes. Therefore, the assembled heat dissipating module could not be loosed and deformed during delivery and the engaging contact between the fins and the thermal conductive pipes are enhanced, so to increase the heat dissipating effect of the heat dissipating module.

Abstract translation: 散热装置包括导热管和多个散热片模块。 通过压制和堆叠制成的每个散热片模块安装在导热管上。 保持器位于每个两个散热片模块之间，以压缩散热片模块，从而减小散热片模块的两个散热片之间的距离。 最后，将固定板设置在导热管上的最后一个散热片模块上方，以将散热片模块固定在导热管上。 因此，组装的散热模块在输送期间不能松动和变形，并且翅片和导热管之间的接合接触增强，从而增加散热模块的散热效果。

公开(公告)号：US20090302937A1

公开(公告)日：2009-12-10

申请号：US12477119

申请日：2009-06-02

Applicant: Kuo-Hsin Chen

Inventor： Kuo-Hsin Chen

IPC: H03F3/38

CPC classification number: H03F3/217

Abstract: An amplifier includes a sigma-delta modulating circuit, a power stage circuit, two feedback components, an error suppressing circuit, and a selecting circuit. The sigma-delta modulating circuit generates two input voltages according to two input signals or one single-ended signal. The power stage circuit provides two output voltages according to the two input voltages or an error adjusting voltage. The two feedback components are respectively coupled to two output terminals of the power stage circuit and two input terminals of the sigma-delta modulating circuits. The error suppressing circuit is used for providing the error adjusting voltage according to the two input voltages. The selecting circuit selects outputs depending on whether the two input voltages corresponding to different logic levels or an identical logic level for adjusting the power stage circuit to suppress a mismatch error between the two feedback components.

Abstract translation: 放大器包括Σ-Δ调制电路，功率级电路，两个反馈分量，误差抑制电路和选择电路。 Σ-Δ调制电路根据两个输入信号或一个单端信号产生两个输入电压。 功率级电路根据两个输入电压或误差调整电压提供两个输出电压。 两个反馈分量分别耦合到功率级电路的两个输出端和Σ-Δ调制电路的两个输入端。 误差抑制电路用于根据两个输入电压提供误差调整电压。 选择电路根据对应于不同逻辑电平的两个输入电压或相同的逻辑电平来选择输出，以调整功率级电路以抑制两个反馈分量之间的失配误差。

公开(公告)号：US20090289824A1

公开(公告)日：2009-11-26

申请号：US12468049

申请日：2009-05-18

Applicant: Kuo-Hsin Chen

Inventor： Kuo-Hsin Chen

IPC: H03M3/02

CPC classification number: H03M3/498

Abstract: A sigma-delta modulator includes an adder, a filter, a quantizer, and a clock rate controller. The adder receives an input signal and an output signal to generate a summation signal. The filter is coupled to the adder and filters the summation signal to generate a filtered signal. The quantizer is coupled to the filter as well as the adder and quantizes the filtered signal to generate the output signal according to a first clock signal. The clock rate controller is coupled to the quantizer and generates the first clock signal, wherein a frequency of the first clock signal is variable.

Abstract translation: Σ-Δ调制器包括加法器，滤波器，量化器和时钟速率控制器。 加法器接收输入信号和输出信号以产生求和信号。 滤波器耦合到加法器并对求和信号进行滤波以产生滤波信号。 量化器耦合到滤波器以及加法器，并对滤波信号进行量化，以根据第一时钟信号产生输出信号。 时钟速率控制器耦合到量化器并产生第一时钟信号，其中第一时钟信号的频率是可变的。

公开(公告)号：US07916055B2

公开(公告)日：2011-03-29

申请号：US12468049

申请日：2009-05-18

Applicant: Kuo-Hsin Chen

Inventor： Kuo-Hsin Chen

IPC: H03M3/00

CPC classification number: H03M3/498

Abstract: A sigma-delta modulator includes an adder, a filter, a quantizer, and a clock rate controller. The adder receives an input signal and an output signal to generate a summation signal. The filter is coupled to the adder and filters the summation signal to generate a filtered signal. The quantizer is coupled to the filter as well as the adder and quantizes the filtered signal to generate the output signal according to a first clock signal. The clock rate controller is coupled to the quantizer and generates the first clock signal, wherein a frequency of the first clock signal is variable.

Abstract translation: Σ-Δ调制器包括加法器，滤波器，量化器和时钟速率控制器。 加法器接收输入信号和输出信号以产生求和信号。 滤波器耦合到加法器并对求和信号进行滤波以产生滤波信号。 量化器耦合到滤波器以及加法器，并对滤波信号进行量化，以根据第一时钟信号产生输出信号。 时钟速率控制器耦合到量化器并产生第一时钟信号，其中第一时钟信号的频率是可变的。

公开(公告)号：US07777564B2

公开(公告)日：2010-08-17

申请号：US12477119

申请日：2009-06-02

Applicant: Kuo-Hsin Chen

Inventor： Kuo-Hsin Chen

IPC: H03F3/38

CPC classification number: H03F3/217

Abstract: An amplifier includes a sigma-delta modulating circuit, a power stage circuit, two feedback components, an error suppressing circuit, and a selecting circuit. The sigma-delta modulating circuit generates two input voltages according to two input signals or one single-ended signal. The power stage circuit provides two output voltages according to the two input voltages or an error adjusting voltage. The two feedback components are respectively coupled to two output terminals of the power stage circuit and two input terminals of the sigma-delta modulating circuits. The error suppressing circuit is used for providing the error adjusting voltage according to the two input voltages. The selecting circuit selects outputs depending on whether the two input voltages corresponding to different logic levels or an identical logic level for adjusting the power stage circuit to suppress a mismatch error between the two feedback components.

Abstract translation: 放大器包括Σ-Δ调制电路，功率级电路，两个反馈分量，误差抑制电路和选择电路。 Σ-Δ调制电路根据两个输入信号或一个单端信号产生两个输入电压。 功率级电路根据两个输入电压或误差调整电压提供两个输出电压。 两个反馈分量分别耦合到功率级电路的两个输出端和Σ-Δ调制电路的两个输入端。 误差抑制电路用于根据两个输入电压提供误差调整电压。 选择电路根据对应于不同逻辑电平的两个输入电压或相同的逻辑电平来选择输出，以调整功率级电路以抑制两个反馈分量之间的失配误差。