公开(公告)号：US11548588B2

公开(公告)日：2023-01-10

申请号：US17575229

申请日：2022-01-13

Applicant: Hsuan-Chih Lin ,  Chun-Cheng Lee

Inventor： Hsuan-Chih Lin ,  Chun-Cheng Lee

IPC: B62M1/36 ,  B62M3/00 ,  B62M11/02

Abstract: The present disclosure related to an effort-saving crank structure (1) of a bicycle (8), which includes: a crank mechanism (10) having a crank (11), a shaft end gear (12) and a treadle end gear (13) disposed on the crank (11); a transmission mechanism (20) disposed in the crank (11) and having a rotation shaft (21) and a first gear (22) and a second gear (23) connected to the rotation shaft (21), the first gear (22) and the shaft end gear (12) are engaged for transmission, and the second gear (23) and the treadle end gear (13) are engaged for transmission; a rotation arm unit (30) having a first rotation arm (31) and a second rotation arm (32), two ends of the second rotation arm (32) are respectively connected to the first rotation arm (31) and the treadle end gear (13).

公开(公告)号：US20170217128A1

公开(公告)日：2017-08-03

申请号：US15416099

申请日：2017-01-26

Applicant: Hsuan-Chih LIN ,  Chun-Cheng LEE

Inventor： Hsuan-Chih LIN ,  Chun-Cheng LEE

IPC: B32B7/08 ,  B32B37/10 ,  B32B3/30 ,  B32B7/04 ,  B32B3/26

CPC classification number: B32B7/08 ,  B32B3/266 ,  B32B3/30 ,  B32B7/05 ,  B32B15/082 ,  B32B15/085 ,  B32B15/09 ,  B32B15/18 ,  B32B15/20 ,  B32B27/08 ,  B32B27/302 ,  B32B27/32 ,  B32B27/365 ,  B32B37/10 ,  B32B38/06 ,  B32B2250/02 ,  B32B2250/03 ,  B32B2250/40 ,  B32B2307/30 ,  B32B2307/54 ,  B32B2307/558 ,  B32B2307/718

Abstract: A composite hollow board structure and a manufacturing method thereof are provided. The composite hollow board structure includes a first plate having a surface formed of a plurality of first conical rings and a plurality of first attachment rings thereon; and a second plate pressed onto the first plate and having a surface formed a plurality of second conical rings and a plurality of second attachment rings thereon; wherein each first conical ring and each second attachment ring are inserted onto each other, each second conical ring and each first attachment ring are inserted onto each other; a hollow cavity is respectively formed between each first conical ring and each second attachment ring as well as between each second conical ring and each first attachment ring. Accordingly, the known bonding or welding step can be omitted to increase deformation capacity with simplified process and reduced manufacturing time.

公开(公告)号：US20100315815A1

公开(公告)日：2010-12-16

申请号：US12785850

申请日：2010-05-24

Applicant: Hsuan-Chih LIN ,  Hong-Long Chen

Inventor： Hsuan-Chih LIN ,  Hong-Long Chen

IPC: F21S4/00

CPC classification number: F21V31/005 ,  F21K9/00 ,  F21S2/005 ,  F21V17/12 ,  F21V29/70 ,  F21V29/713 ,  F21Y2105/10 ,  F21Y2115/10

Abstract: A light-emitting unit adapter module includes a mounting base for mounting, a circuit board accommodated in the mounting base and having electrode pins connectable to an external power source, a light-emitting unit mountable in the mounting base, and a holding-down device fastenable to the mounting base to hold down the light-emitting unit, keeping the tubular electrodes of the light-emitting unit in positive contact with the electrode pins of the circuit board for power input and the heat sink of the light-emitting unit suspending outside the mounting base for quick dissipation of waste heat during operation of the light-emitting devices of the light-emitting unit.

Abstract translation: 一种发光单元适配器模块，包括用于安装的安装基座，容纳在安装基座中并具有可连接到外部电源的电极引脚的电路板，可安装在安装基座中的发光单元，以及压紧装置 可固定到安装基座上以按压发光单元，使发光单元的管状电极与用于电力输入的电路板的电极引脚正确接触，并将发光单元的散热片悬空 用于在发光单元的发光装置的操作期间快速消散废热的安装基座。

公开(公告)号：US20100311193A1

公开(公告)日：2010-12-09

申请号：US12779589

申请日：2010-05-13

Applicant: Hsuan-Chih LIN

Inventor： Hsuan-Chih LIN

IPC: H01L21/56

CPC classification number: H01L33/54 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2933/005 ,  H01L2924/00014

Abstract: A method of fabricating a LED module by: bonding one or multiple LED chips and multiple conducting terminals to a circuit substrate, and then molding a packing cup on the circuit substrate over by over molding for enabling the LED chip(s) and the conducting terminals to be exposed to the outside of the packing cup, and then molding a lens on the packing cup and the LED chip(s) by over-molding. By means of directly molding the lens on the packing cup and the LED chip(s), no any gap is left in the lens, avoiding deflection, total reflection or light attenuation and enhancing luminous brightness and assuring uniform distribution of output light.

Abstract translation: 一种通过以下方式制造LED模块：将一个或多个LED芯片和多个导电端子连接到电路基板上，然后通过过模塑将电路基板上的填料杯模制成可使LED芯片和导电端子 暴露于包装杯的外部，然后通过过度成型将透镜模制在包装杯和LED芯片上。 通过将透镜直接模制在包装杯和LED芯片上，透镜中没有留下任何间隙，避免了偏转，全反射或光衰减，并提高了发光亮度，并保证了输出光的均匀分布。

公开(公告)号：US20100270922A1

公开(公告)日：2010-10-28

申请号：US12761727

申请日：2010-04-16

Applicant: Hsuan-Chih LIN

Inventor： Hsuan-Chih LIN

IPC: H01K1/62 ,  H01J61/52 ,  H01K1/30 ,  F21V29/00

CPC classification number: F21V29/004 ,  F21K9/00 ,  F21V29/77 ,  F21V29/773 ,  F21V29/89 ,  F21V31/005 ,  F21Y2115/10

Abstract: A LED head sink module includes a LED module, which comprises a circuit substrate, a LED chip installed in the circuit substrate, a packing cup molded on the circuit substrate around the LED chip and a lens molded on the packing cup over the LED chip, a heat sink, which has a base and a flat mounting block located on the bottom side of the base for stopping against the circuit substrate of the LED module for absorbing waste heat, a bracket, which has a center opening that receives the circuit substrate of the LED module, first retaining members for fastening to a retaining portion at the periphery of the packing cup and second retaining members for fastening to the flat mounting block of the heat sink, and a water seal sandwiched between the LED module and the bracket to seal off outside moisture and dust.

Abstract translation: LED头模块包括LED模块，其包括电路基板，安装在电路基板中的LED芯片，模制在LED芯片周围的电路基板上的封装杯和模制在LED芯片上的封装杯上的透镜， 散热器，其具有位于基座的底侧上的基部和平坦的安装块，用于阻挡用于吸收废热的LED模块的电路基板，支架具有接收电路基板的中心开口 LED模块，用于紧固到包装杯周边的保持部分的第一保持构件和用于紧固到散热器的平坦安装块的第二保持构件以及夹在LED模块和支架之间的水封以密封 外面的水分和灰尘。

公开(公告)号：US20090313827A1

公开(公告)日：2009-12-24

申请号：US12187795

申请日：2008-08-07

Applicant: Kuo-Hsin CHEN ,  Hsuan-Chih Lin

Inventor： Kuo-Hsin CHEN ,  Hsuan-Chih Lin

IPC: B21D53/02 ,  B23P19/02

CPC classification number: F28D15/0266 ,  B23P15/26 ,  F28D15/0275 ,  F28F1/32 ,  H01L21/4882 ,  H01L23/3672 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  Y10T29/4935 ,  Y10T29/53122 ,  H01L2924/00

Abstract: A method and a tool for manufacturing heat radiators are used to assemble a plurality of radiating fins to a heat transferring base. The method includes the steps of putting the radiating fins on the heat transferring base, putting blades between the radiating fins from at least one side of the heat transferring base, and pressing the blades to deform the heat transferring base to make the heat transferring base tightly fitted with the radiating fins. The tool includes a group of cutters and a pressing part. The cutter has blades having edges and pressing portions opposite to the edges. When the radiating fins are connected to the heat transferring base, the cutter may move between the radiating fins in a direction parallel to the heat transferring base. The pressing part is used for pressing the pressing portion to make the edges deform the heat transferring base, which forces the heat transferring base to be tightly fitted with the radiating fins.

Abstract translation: 用于制造散热器的方法和工具用于将多个散热片组装到传热基座上。 该方法包括以下步骤：将散热片放置在传热基座上，从传热基座的至少一侧将散热片放置在散热片之间，并按压叶片使传热基座变形，使传热基座紧密 配有散热片。 该工具包括一组刀具和一个按压部件。 刀具具有边缘和与边缘相对的按压部分的刀片。 当散热片连接到传热基座时，切割器可以在平行于传热基座的方向上在散热片之间移动。 按压部分用于按压挤压部分，使得边缘使传热基座变形，这迫使传热基座与散热片紧密配合。

公开(公告)号：US20090038777A1

公开(公告)日：2009-02-12

申请号：US12187819

申请日：2008-08-07

Applicant: Kuo-Hsin Chen ,  Hsuan-Chih Lin

Inventor： Kuo-Hsin Chen ,  Hsuan-Chih Lin

IPC: F28F7/00

CPC classification number: F28D15/0266 ,  F28D15/0275 ,  F28F1/32 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  Y10T29/49353 ,  H01L2924/00

Abstract: In a heat sink and the manufacturing method thereof, the heat sink includes heat dissipation fins and heat pipes, and the heat dissipation fins have through holes for the heat pipes to pass through. The heat dissipating fins also have a notch formed at the peripheral of the through hole and communicating with the through hole, and openings formed at two sides of the notch, respectively. According to the manufacturing method, after the heat pipe is assembled with the heat dissipating fin, press strips pass through the openings and are pressed inwardly to reduce the notch to make the notch and the heat pipe plastically deformed. Finally the press strips are removed.

Abstract translation: 在散热片及其制造方法中，散热片包括散热翅片和热管，散热片具有通过热管的通孔。 散热片还具有形成在通孔的周边并与通孔连通的凹口，以及形成在凹口两侧的开口。 根据制造方法，在热管与散热片组装之后，压条穿过开口并被向内压入以减小切口以使切口和热管塑性变形。 最后删除压条。

公开(公告)号：US20080041567A1

公开(公告)日：2008-02-21

申请号：US11843934

申请日：2007-08-23

Applicant: Kuo-Hsin Chen ,  Hsuan-Chih Lin

Inventor： Kuo-Hsin Chen ,  Hsuan-Chih Lin

IPC: H05K7/20

CPC classification number: H01L23/3672 ,  F28D15/0233 ,  F28D15/0266 ,  F28D15/0275 ,  F28F1/32 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A heat dissipating module includes thermal conductive pipes and a thermal fin module. The thermal fin module made by pressing and stacking is mounted on the thermal conductive pipes. Next, a jig is set on a top surface of the thermal fin module, and a force compresses the thermal fin module, so as to reduce a distance between two fins of the thermal fin module. Then, a fixing plate is set above the thermal fin module on the thermal conductive pipes, and the jig is removed. Finally, the fixing plate is fixed on the thermal fin module, and the thermal fin module is securely fixed with the thermal conductive pipes. Therefore, the assembled heat dissipating module could not be loosed and deformed during delivery and the engaging contact between the fins and the thermal conductive pipes are enhanced, so to increase the heat dissipating effect of the heat dissipating module.

Abstract translation: 散热模块包括导热管和散热片模块。 通过压制和堆叠制成的散热片模块安装在导热管上。 接下来，在散热片模块的顶面上设置夹具，并且力压缩热散热片模块，以便减小散热片模块的两个散热片之间的距离。 然后，将固定板设置在导热管上的散热片模块上方，并移除夹具。 最后，固定板固定在散热片模块上，散热片模块与导热管牢固固定。 因此，组装的散热模块在输送期间不能松动和变形，并且翅片和导热管之间的接合接触增强，从而增加散热模块的散热效果。

公开(公告)号：US20070131389A1

公开(公告)日：2007-06-14

申请号：US11297402

申请日：2005-12-09

Applicant: Kuo-Hsin Chen ,  Hsuan-Chih Lin

Inventor： Kuo-Hsin Chen ,  Hsuan-Chih Lin

IPC: H05K7/20 ,  F28D15/00

CPC classification number: H01L23/467 ,  F28D15/0233 ,  F28D15/0266 ,  F28D15/0275 ,  F28F1/32 ,  H01L23/3672 ,  H01L23/427 ,  H01L2924/0002 ,  Y10T29/49368 ,  H01L2924/00

Abstract: A heat dissipating device includes thermal conductive pipes and a plurality of thermal fin modules. Each thermal fin module made by pressing and stacking is mounted on the thermal conductive pipes. A retainer is located between each two thermal fin modules to compress the thermal fin module, so that a distance between two fins of the thermal fin module is reduced. Finally, a fixing plate is set above the last thermal fin module on the thermal conductive pipes to fix the thermal fin modules securely engaged with the thermal conductive pipes. Therefore, the assembled heat dissipating module could not be loosed and deformed during delivery and the engaging contact between the fins and the thermal conductive pipes are enhanced, so to increase the heat dissipating effect of the heat dissipating module.

Abstract translation: 散热装置包括导热管和多个散热片模块。 通过压制和堆叠制成的每个散热片模块安装在导热管上。 保持器位于每个两个散热片模块之间，以压缩散热片模块，从而减小散热片模块的两个散热片之间的距离。 最后，将固定板设置在导热管上的最后一个散热片模块上方，以将散热片模块固定在导热管上。 因此，组装的散热模块在输送期间不能松动和变形，并且翅片和导热管之间的接合接触增强，从而增加散热模块的散热效果。

公开(公告)号：US20160066447A1

公开(公告)日：2016-03-03

申请号：US14469040

申请日：2014-08-26

Applicant: HSUAN-CHIH LIN ,  CHUN-CHENG LEE ,  GRT Tech Co., Ltd.

Inventor： HSUAN-CHIH LIN ,  CHUN-CHENG LEE

IPC: H05K5/02 ,  H05K5/06

CPC classification number: F21V23/007 ,  F21S8/086 ,  F21W2131/103

Abstract: An electronic device replacement structure (100) includes a housing body (102) and an electronic module (200, 200′). The housing body (102) includes a base (110) and at least one clasping member (120) connected with one side of the base (110). The base (110) is disposed inside the housing body (102), and a first plate (130) is protrudingly disposed on the base (110). The electronic module (200, 200′) is disposed on the base (110) and corresponding to the clasping member (120). The electronic module (200, 200′) includes a casing (210) and a fastening implement (300) connected to the casing (210). The fastening implement (300) has at least one elastic locking element (310) and a second plate (320). The elastic locking element (310) is engaged with the clasping member (120). The second plate (320) protrudes toward the first plate (130) and contacts against the first plate (130).

Abstract translation: 电子设备更换结构（100）包括壳体（102）和电子模块（200,200'）。 壳体（102）包括基部（110）和与基部（110）的一侧连接的至少一个紧固构件（120）。 基部（110）设置在壳体（102）的内部，并且突出地设置在基部（110）上的第一板（130）。 电子模块（200,200'）设置在基座（110）上并对应于扣紧构件（120）。 电子模块（200,200'）包括壳体（210）和连接到壳体（210）的紧固器具（300）。 紧固工具（300）具有至少一个弹性锁定元件（310）和第二板（320）。 弹性锁定元件（310）与夹紧构件（120）接合。 第二板（320）向第一板（130）突出并与第一板（130）接触。