摘要:
The present invention has for its object to provide a mechanism for preventing a liquid from splashing from a liquid tank, and a component mounting apparatus with this liquid splashing prevention mechanism. The liquid splash prevention mechanism has a first seal member with a circumferential outer face attached to a first driving lever in a lubricating oil tank, and a second seal member with an arc face set in the lubricating oil tank correspondingly to the first seal member so that a sealing gap for preventing lubricating oil from scattering is formed between the first seal member and the second seal member. Moreover, the lubricating oil is filled in the sealing gap. Scattering of the lubricating oil is more surely prevented by this arrangement. Quality degradation to be caused by adhesion of the lubricating oil to printed boards and the like can be prevented, and productivity can be improved.
摘要:
Each of a plurality of suction nozzle sections 20 provided about the outer circumference of an intermittently rotating head section 21 comprises a plurality of nozzle tip sections 10 for picking up electronic components 22 by suction, these nozzle tip sections 10 being connected to a rod section 4, which is driven to rotate by a motor 1. A cylindrical cam section 8having a cam surface 8a and being able to rotate relative to the rod section 4 is provided such as to encase the nozzle tip sections 10, and one ends of the nozzle tip sections 10 engage with the cam surface 8a of the cam section 8 via rollers 6, whereby the nozzle tip sections 10 are movable in a vertical direction. On the outer side of the cylindrical cam section 8, a stopper section 12 is provided for halting temporarily the rotation of only the cylindrical cam surface 8.
摘要:
The present invention has for its object to provide an apparatus and a method for transferring boards, and a component mounting apparatus whereby a production efficiency can be improved in accordance with types of boards to be produced. For accomplishing this object, there are arranged a shift device capable of moving a mounted board from a process-finished board transfer path to an unprocessed board transfer path, a controller for controlling this moving, and an identifying device. This arrangement enables switching of a method of transferring boards in accordance with types of boards to be produced, and controlling supply of boards to the component mounting apparatus, so that production efficiency is improved in accordance with types of boards.
摘要:
The present invention has for its object to provide an apparatus and a method for transferring boards, and a component mounting apparatus whereby a production efficiency can be improved in accordance with types of boards to be produced. For accomplishing this object, there are arranged a shift device capable of moving a mounted board from a process-finished board transfer path to an unprocessed board transfer path, a controller for controlling this moving, and an identifying device. This arrangement enables switching of a method of transferring boards in accordance with types of boards to be produced, and controlling supply of boards to the component mounting apparatus, so that production efficiency is improved in accordance with types of boards.
摘要:
The present invention has for its object to provide an apparatus and a method for transferring boards, and a component mounting apparatus whereby a production efficiency can be improved in accordance with types of boards to be produced. For accomplishing this object, there are arranged a shift device capable of moving a mounted board from a process-finished board transfer path to an unprocessed board transfer path, a controller for controlling this moving, and an identifying device. This arrangement enables switching of a method of transferring boards in accordance with types of boards to be produced, and controlling supply of boards to the component mounting apparatus, so that production efficiency is improved in accordance with types of boards.
摘要:
A component mounting apparatus for mounting a plurality of components on a board. The apparatus is provided with a board holding device for holding the board at a board holding position, a first mounting head for holding and taking out a component fed from a first component feeding position and mounting the component on the board held at the board holding position, a second mounting head for holding and taking out the component fed from a second component feeding position and mounting the component on the held board, and a component feeding device having a wafer holding table for holding a wafer on which the respective components are fed so that the wafer holding table can be moved reciprocationally between the first component feeding position and the second component feeding position.
摘要:
A component mounting apparatus for mounting a plurality of components on a board. The apparatus is provided with a board holding device for holding the board at a board holding position, a first mounting head for holding and taking out a component fed from a first component feeding position and mounting the component on the board held at the board holding position, a second mounting head for holding and taking out the component fed from a second component feeding position and mounting the component on the held board, and a component feeding device having a wafer holding table for holding a wafer on which the respective components are fed so that the wafer holding table can be moved reciprocationally between the first component feeding position and the second component feeding position.
摘要:
Apparatus for mounting components, even if the components have narrow inter-component distances, without producing any interference between already mounted components and suction nozzles or components being suction-held by the suction nozzles. The component mounting apparatus for picking up electronic components supplied from a component supply section by suction nozzles attached to a mounting head and mounting electronic components on a printed circuit board, includes a control section containing information relating to components to be mounted and controlling, based on this information, the positions of the suction nozzle, the mounting head and the printed circuit board so that components to be mounted are mounted in ascending order of height.
摘要:
Apparatus for mounting components, even if the components have narrow inter-component distances, without producing any interference between already mounted components and suction nozzles or components being suction-hold by the suction nozzles. The component mounting apparatus for picking up electronic components supplied from a component supply section by suction nozzles attached to a mounting head and mounting electronic components on a printed circuit board, includes a control section containing information relating to components to be mounted and controlling, based on this information, the positions of the suction nozzle, the mounting head and the printed circuit board so that components to be mounted are mounted in ascending order of height.
摘要:
The present invention provides a reflow apparatus and method effective to make constant the internal gas flow direction in a heating section within a reflow furnace. A circulating gas path is formed in a heating unit which collects and causes the gas to flow from a sirocco fan, up the rear side of the heating unit and then down towards a circuit board moving along a transfer path at the front side of the heating unit. Moreover, a plurality of straightening plates are arranged above the transfer path of the heating unit so as to guide the hot gas, which is flowing forwardly downwardly toward the circuit board moving along the transfer path. A blow-down nozzle is provided and includes a plurality of plates aligned in rows in the transferring direction of the circuit boards. The plates have an inverse U-shaped cross section. The blow-down nozzle is arranged below the straightening plates to cause the vertical hot gas flows to flow uniformly over the whole surface of the circuit board.