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18 条记录 (耗时 0.028 秒)

    Reflow apparatus and method
    1.
    发明授权
    Reflow apparatus and method 失效
    回流装置及方法

    公开(公告)号：US5472135A

    公开(公告)日：1995-12-05

    申请号：US152143

    申请日：1993-11-16

    申请人： Masahiro Taniguchi ,  Youichi Nakamura ,  Kazumi Ishimoto ,  Kimihito Kuwabara ,  Toshinori Mimura ,  Kurayasu Hamasaki ,  Kenichi Nakano ,  Manabu Ando

    发明人： Masahiro Taniguchi ,  Youichi Nakamura ,  Kazumi Ishimoto ,  Kimihito Kuwabara ,  Toshinori Mimura ,  Kurayasu Hamasaki ,  Kenichi Nakano ,  Manabu Ando

    IPC分类号： B23K1/008 ,  B23K1/012 ,  H02K3/34 ,  B23K35/38 ,  B23K31/02

    CPC分类号： H02K3/34 ,  B23K1/008 ,  B23K1/012 ,  B23K2201/40 ,  B23K2201/42

    摘要： The present invention provides a reflow apparatus and method effective to make constant the internal gas flow direction in a heating section within a reflow furnace. A circulating gas path is formed in a heating unit which collects and causes the gas to flow from a sirocco fan, up the rear side of the heating unit and then down towards a circuit board moving along a transfer path at the front side of the heating unit. Moreover, a plurality of straightening plates are arranged above the transfer path of the heating unit so as to guide the hot gas, which is flowing forwardly downwardly toward the circuit board moving along the transfer path. A blow-down nozzle is provided and includes a plurality of plates aligned in rows in the transferring direction of the circuit boards. The plates have an inverse U-shaped cross section. The blow-down nozzle is arranged below the straightening plates to cause the vertical hot gas flows to flow uniformly over the whole surface of the circuit board.

    摘要翻译： 本发明提供一种有效地使回流炉内的加热部内部的气体流动方向恒定的回流装置和方法。 在加热单元中形成循环气体路径，该加热单元收集并使得气体从加热单元的后侧上的西洛克风扇流出，然后向下朝着在加热前侧沿着传送路径移动的电路板 单元。 此外，多个矫直板布置在加热单元的传送路径的上方，以引导沿着传送路径移动的电路板向下流动的热气体。 设置吹扫喷嘴，并且在电路板的传送方向上包括排成行的多个板。 板具有相反的U形横截面。 吹出喷嘴布置在矫直板的下方，使垂直热气流均匀地流过电路板的整个表面。

    Reflow apparatus
    4.
    发明授权
    Reflow apparatus 失效
    回流装置

    公开(公告)号：US5579981A

    公开(公告)日：1996-12-03

    申请号：US371776

    申请日：1995-01-12

    申请人： Nobuya Matsumura ,  Kazumi Ishimoto ,  Yoichi Nakamura ,  Kurayasu Hamasaki ,  Kimihito Kuwabara ,  Masahiro Taniguchi

    发明人： Nobuya Matsumura ,  Kazumi Ishimoto ,  Yoichi Nakamura ,  Kurayasu Hamasaki ,  Kimihito Kuwabara ,  Masahiro Taniguchi

    IPC分类号： H05K3/34 ,  B23K1/008 ,  B23K1/012

    CPC分类号： B23K1/008 ,  B23K2201/42

    摘要： A reflow apparatus includes a reflow furnace. A transfer device holds and transfers printed circuit boards with to-be-reflowed electronic components thereon from an inlet to an outlet of the furnace within the furnace. A plurality of adjusting/circulating sections separate an ambient gas for heating the printed circuit boards into predetermined temperature regions in the furnace in which the ambient gas is circulated in a heated state. A feed port is formed in the furnace to feed the ambient gas into the furnace under pressure. Residence parts each provided between adjacent adjusting/circulating sections regulate the amount of the ambient gas when the ambient gas, after having been sent to and heated in the adjusting/circulating section adjacent to the feed port, is circulated and sequentially moved to the adjusting/circulating sections at the inlet or the outlet and finally flows out through the inlet or outlet into atmosphere. Suction ports are open to the furnace to suck the ambient gas from the inside of the furnace. A flux removing unit is separate from the furnace and removes components of a flux from the ambient gas sucked through the suction ports from the inside of the furnace.

    摘要翻译： 回流装置包括回流炉。 转移装置在炉内从炉内的入口到出口保持并转移其上具有待回流电子部件的印刷电路板。 多个调节/循环部分将用于将印刷电路板加热的环境气体分离成炉中的环境气体在加热状态下循环的预定温度区域。 在炉中形成进料口，以在压力下将环境气体进料到炉中。 每个设置在相邻的调节/循环部分之间的居间部分调节环境气体的量，当环境气体在已经被送​​入并在与进料口邻近的调节/循环部分中被加热并循环并顺序地移动到调节/ 在入口或出口处循环切片，最后通过入口或出口流入大气。 吸入口向炉内开放以从炉内吸入环境气体。 助熔剂去除单元与炉分离，并从炉内部从吸入口吸入的环境气体中除去助熔剂的组分。

    Reflow method and reflow device
    8.
    发明授权
    Reflow method and reflow device 失效
    回流方式和回流装置

    公开(公告)号：US06402011B1

    公开(公告)日：2002-06-11

    申请号：US09633293

    申请日：2000-08-04

    申请人： Masahiro Taniguchi ,  Kazumi Ishimoto ,  Koichi Nagai ,  Osamu Yamazaki ,  Tatsuaki Kitagawa ,  Osamu Matsushima ,  Kazuhiro Uji ,  Seizo Nemoto

    发明人： Masahiro Taniguchi ,  Kazumi Ishimoto ,  Koichi Nagai ,  Osamu Yamazaki ,  Tatsuaki Kitagawa ,  Osamu Matsushima ,  Kazuhiro Uji ,  Seizo Nemoto

    IPC分类号： B23K3102

    CPC分类号： B23K3/085 ,  B23K1/008 ,  B23K2101/42 ,  H05K3/3415 ,  H05K3/3447 ,  H05K3/3494 ,  H05K2203/087 ,  H05K2203/304

    摘要： For reflow soldering, radiant heating is applied to one surface of a printed circuit board on which electronic components are placed and onto which cream solder is supplied and at the same time hot air is blown locally and roughly perpendicular to to-be-connected points on said one surface of the printed circuit board. This reflow method permits secure soldering even if the hot air is set at a temperature not exceeding the heat resistance of the electronic components, which is possilbe because of its combination with the radiant heat. Moreover, this reflow method can permit soldering in such a manner that only the to-be-connected points are heated selectively, because the hot air is blown locally and roughly perpendicular to the points to be connected. Thus, this reflow method prevents heat damage to other sections than the to-be-connected points and ensures that the solder at the to-be-connected points is melted.

    摘要翻译： 对于回流焊接，辐射加热被施加到印刷电路板的放置电子部件的一个表面上，并且在其上供应奶油焊膏，并且同时热空气局部地被吹送并大致垂直于待连接点 所述印刷电路板的一个表面。 这种回流方法即使热空气被设定在不超过电子部件的耐热性的温度下，由于与辐射热的组合，所以能够进行安全的焊接。 此外，这种回流方法可以以这样的方式允许焊接，即只有待连接点被选择性地加热，因为热空气局部地吹动并且大致垂直于要连接的点。 因此，这种回流方法可防止对待连接点的其他部分的热损伤，并确保待连接点处的焊料熔化。

    Method of applying a coating of viscous materials
    10.
    发明授权
    Method of applying a coating of viscous materials 失效
    施加粘性材料涂层的方法

    公开(公告)号：US5000988A

    公开(公告)日：1991-03-19

    申请号：US143027

    申请日：1988-01-12

    申请人： Takao Inoue ,  Tetsuo Fukushima ,  Kenji Fukumoto ,  Kazumi Ishimoto

    发明人： Takao Inoue ,  Tetsuo Fukushima ,  Kenji Fukumoto ,  Kazumi Ishimoto

    IPC分类号： G02F1/13 ,  B05C5/02 ,  B05D1/02 ,  B05D1/26 ,  H05K3/12

    CPC分类号： H05K3/1241 ,  B05C5/0216 ,  H05K2203/0126

    摘要： In the coating method of a viscous material according to the present invention, a nozzle body having outlets corresponding to many coating rows is employed. The nozzle body is moved, while the gap between the nozzle body and the surface to be coated is maintained constant, so that the viscous material composed of different kinds of materials is discharged out of each outlet, thereby to effect simultaneous coating of the viscous material composed of different kinds of materials in many rows. Therefore, the present invention has such advantages that the surface to be coated is less stained, and at the same time, the surface to be coated becomes more smooth.

    摘要翻译： 在根据本发明的粘性材料的涂布方法中，采用具有对应于许多涂布行的出口的喷嘴体。 喷嘴体移动，同时喷嘴体与待涂覆表面之间的间隙保持恒定，使得由各种材料组成的粘性材料从每个出口排出，从而同时涂覆粘性材料 由不同种类的材料组成的很多行。 因此，本发明具有这样的优点：被涂布表面污染较少，同时，被涂布表面更加光滑。