公开(公告)号：US20140084317A1

公开(公告)日：2014-03-27

申请号：US13911853

申请日：2013-06-06

申请人： Kwang chil LEE ,  Joong Seo PARK ,  Tae Lim LEE ,  Woon Kyung CHOI ,  Kyoung Hoon KIM ,  Hae Jin PARK ,  Hwan Hui YUN

发明人： Kwang chil LEE ,  Joong Seo PARK ,  Tae Lim LEE ,  Woon Kyung CHOI ,  Kyoung Hoon KIM ,  Hae Jin PARK ,  Hwan Hui YUN

IPC分类号： H01L33/58

CPC分类号： H01L33/58 ,  H01L33/20 ,  H01L33/22 ,  H01L33/32 ,  H01L2224/13 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/00 ,  H01L2924/00011 ,  H01L2224/45099

摘要： Disclosed is a light emitting device including an active layer emitting light with a wavelength band of 200 nm to 405 nm, and a light-transmitting layer disposed on the active layer, the light-transmitting layer having a lower part facing the active layer, wherein at least one of side and upper parts of the light-transmitting layer has a surface-processed pattern portion.

摘要翻译： 公开了一种发光器件，其包括发射波长带为200nm至405nm的光的有源层和设置在有源层上的透光层，所述透光层具有面向有源层的下部，其中 透光层的侧部和上部中的至少一个具有表面处理图案部分。

公开(公告)号：US20150001573A1

公开(公告)日：2015-01-01

申请号：US14213562

申请日：2014-03-14

申请人： Hae Jin PARK

发明人： Hae Jin PARK

IPC分类号： H01L33/48 ,  H01L33/62

CPC分类号： H01L33/483 ,  H01L33/486 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/06102 ,  H01L2224/1703 ,  H01L2224/48091 ,  H01L2933/005 ,  H01L2924/00014

摘要： Disclosed is a light emitting device package including a package body having at least one cavity, at least one light emitting device mounted on the cavity, and a molding member disposed on the light emitting device to fill the cavity. The package body has at least one first recess formed at an upper portion than a bottom surface of the cavity, and the molding member is disposed to an inner edge of the at least one first recess.

摘要翻译： 公开了一种发光器件封装，其包括具有至少一个空腔的封装体，安装在腔体上的至少一个发光器件，以及设置在发光器件上以填充空腔的模制构件。 封装主体具有形成在空腔的下表面的上部的至少一个第一凹部，并且模制构件设置在至少一个第一凹部的内边缘。