Methods and apparatus for transferring substrates during electronic device manufacturing
    10.
    发明授权
    Methods and apparatus for transferring substrates during electronic device manufacturing 有权
    在电子设备制造过程中传送基板的方法和装置

    公开(公告)号:US07927062B2

    公开(公告)日:2011-04-19

    申请号:US11554530

    申请日:2006-10-30

    IPC分类号: G06F15/00

    摘要: In one aspect, a first apparatus is provided that is adapted to transfer a substrate between a transfer chamber and a processing chamber. The first apparatus includes a robot having a first blade, a second blade spaced from the first blade, and a central hub coupled to the first blade by at least a first arm and coupled to the second blade by at least a second arm. The first blade and the second blade are spaced so as to allow (a) both blades to simultaneously extend through a slit valve that separates a transfer chamber from a processing chamber coupled to the transfer chamber when the robot is positioned within the transfer chamber; and (b) the first and second blades to transfer substrates to and remove substrates from the processing chamber without raising or lowering the first and second blades or the robot. Numerous other aspects are provided.

    摘要翻译: 在一个方面,提供了适于在传送室和处理室之间传送衬底的第一设备。 第一装置包括具有第一叶片的机器人,与第一叶片间隔开的第二叶片,以及通过至少第一臂联接到第一叶片并通过至少第二臂联接到第二叶片的中心轮毂。 第一叶片和第二叶片间隔开以便(a)当机器人位于传送室内时,两个叶片同时延伸通过狭缝阀,该狭缝阀将传送室与耦合到传送室的处理室分离; 以及(b)第一和第二刀片,用于将基板转移到处理室中并从基板移除基板,而不会升高或降低第一和第二刀片或机器人。 提供了许多其他方面。