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1.发明授权Methods and apparatus for transferring substrates during electronic device manufacturing 有权在电子设备制造过程中传送基板的方法和装置公开(公告)号：US07927062B2
公开(公告)日：2011-04-19
申请号：US11554530
申请日：2006-10-30
IPC分类号： G06F15/00
CPC分类号： H01L21/67748 , H01L21/67742 , H01L21/67745 , H01L21/68707
摘要： In one aspect, a first apparatus is provided that is adapted to transfer a substrate between a transfer chamber and a processing chamber. The first apparatus includes a robot having a first blade, a second blade spaced from the first blade, and a central hub coupled to the first blade by at least a first arm and coupled to the second blade by at least a second arm. The first blade and the second blade are spaced so as to allow (a) both blades to simultaneously extend through a slit valve that separates a transfer chamber from a processing chamber coupled to the transfer chamber when the robot is positioned within the transfer chamber; and (b) the first and second blades to transfer substrates to and remove substrates from the processing chamber without raising or lowering the first and second blades or the robot. Numerous other aspects are provided.
摘要翻译： 在一个方面，提供了适于在传送室和处理室之间传送衬底的第一设备。 第一装置包括具有第一叶片的机器人，与第一叶片间隔开的第二叶片，以及通过至少第一臂联接到第一叶片并通过至少第二臂联接到第二叶片的中心轮毂。 第一叶片和第二叶片间隔开以便（a）当机器人位于传送室内时，两个叶片同时延伸通过狭缝阀，该狭缝阀将传送室与耦合到传送室的处理室分离; 以及（b）第一和第二刀片，用于将基板转移到处理室中并从基板移除基板，而不会升高或降低第一和第二刀片或机器人。 提供了许多其他方面。
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2.发明申请METHODS AND APPARATUS FOR TRANSFERRING SUBSTRATES DURING ELECTRONIC DEVICE MANUFACTURING 有权在电子设备制造过程中传输基板的方法和装置公开(公告)号：US20070116549A1
公开(公告)日：2007-05-24
申请号：US11554530
申请日：2006-10-30
申请人： Michael Rice , Nicholas Cravalho , Jeffrey Brodine
发明人： Michael Rice , Nicholas Cravalho , Jeffrey Brodine
IPC分类号： B66C23/00
CPC分类号： H01L21/67748 , H01L21/67742 , H01L21/67745 , H01L21/68707
摘要： In one aspect, a first apparatus is provided that is adapted to transfer a substrate between a transfer chamber and a processing chamber. The first apparatus includes a robot having a first blade, a second blade spaced from the first blade, and a central hub coupled to the first blade by at least a first arm and coupled to the second blade by at least a second arm. The first blade and the second blade are spaced so as to allow (a) both blades to simultaneously extend through a slit valve that separates a transfer chamber from a processing chamber coupled to the transfer chamber when the robot is positioned within the transfer chamber; and (b) the first and second blades to transfer substrates to and remove substrates from the processing chamber without raising or lowering the first and second blades or the robot. Numerous other aspects are provided.
摘要翻译： 在一个方面，提供了适于在传送室和处理室之间传送衬底的第一设备。 第一装置包括具有第一叶片的机器人，与第一叶片间隔开的第二叶片，以及通过至少第一臂联接到第一叶片并通过至少第二臂联接到第二叶片的中心轮毂。 第一叶片和第二叶片间隔开以便（a）当机器人位于传送室内时，两个叶片同时延伸通过狭缝阀，该狭缝阀将传送室与耦合到传送室的处理室分离; 以及（b）第一和第二刀片，用于将基板转移到处理室中并从基板移除基板，而不会升高或降低第一和第二刀片或机器人。 提供了许多其他方面。
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公开(公告)号：US20090064929A1
公开(公告)日：2009-03-12
申请号：US12254784
申请日：2008-10-20
申请人： Tetsuya Ishikawa , Rick J. Roberts , Helen R. Armer , Leon Volfovski , Jay D. Pinson , Michael Rice , David H. Quach , Mohsen S. Salek , Robert Lowrance , John A. Backer , William Tyler Weaver , Charles Carlson , Chongyang Wang , Jeffrey Hudgens , Harald Herchen , Brian Lu
发明人： Tetsuya Ishikawa , Rick J. Roberts , Helen R. Armer , Leon Volfovski , Jay D. Pinson , Michael Rice , David H. Quach , Mohsen S. Salek , Robert Lowrance , John A. Backer , William Tyler Weaver , Charles Carlson , Chongyang Wang , Jeffrey Hudgens , Harald Herchen , Brian Lu
IPC分类号： B05C13/02
CPC分类号： H01L21/67225 , G03B27/32 , G03D13/006 , G03F7/40 , G05B19/41825 , G05B2219/40476 , G05B2219/45031 , G05B2219/49137 , H01L21/67109 , H01L21/6715 , H01L21/67161 , H01L21/67173 , H01L21/67178 , H01L21/67184 , H01L21/6719 , H01L21/67196 , H01L21/67742 , H01L21/67745 , H01L21/67748 , H01L21/67754 , H01L21/6831 , H01L21/6838 , H01L21/68707 , H01L22/26 , Y02P90/087 , Y10S414/135 , Y10S414/136 , Y10T29/53187 , Y10T29/5323
摘要： Embodiments generally provide an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that has an increased system throughput, increased system reliability, substrates processed in the cluster tool have a more repeatable wafer history, and also the cluster tool has a smaller system footprint. In one embodiment, the cluster tool is adapted to perform a track lithography process in which a substrate is coated with a photosensitive material, is then transferred to a stepper/scanner, which exposes the photosensitive material to some form of radiation to form a pattern in the photosensitive material, which is then removed in a developing process completed in the cluster tool. In track lithography type cluster tools, since the chamber processing times tend to be rather short, and the number of processing steps required to complete a typical track system process is large, a significant portion of the time it takes to process a substrate is taken up by the processes of transferring the substrates in a cluster tool between the various processing chambers. In one embodiment of the cluster tool, the cost of ownership is reduced by grouping substrates together and transferring and processing the substrates in groups of two or more to improve system throughput, and reduces the number of moves a robot has to make to transfer a batch of substrates between the processing chambers, thus reducing wear on the robot and increasing system reliability. In one aspect of the invention, the substrate processing sequence and cluster tool are designed so that the substrate transferring steps performed during the processing sequence are only made to chambers that will perform the next processing step in the processing sequence. Embodiments also provide for a method and apparatus that are used to improve the coater chamber, the developer chamber, the post exposure bake chamber, the chill chamber, and the bake chamber process results. Embodiments also provide for a method and apparatus that are used to increase the reliability of the substrate transfer process to reduce system down time.
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公开(公告)号：US20090064928A1
公开(公告)日：2009-03-12
申请号：US12254750
申请日：2008-10-20
申请人： Tetsuya Ishikawa , Rick J. Roberts , Helen R. Armer , Leon Volfovski , Jay D. Pinson , Michael Rice , David H. Quach , Mohsen S. Salek , Robert Lowrance , John A. Backer , William Tyler Weaver , Charles Carlson , Chongyang Wang , Jeffrey Hudgens , Harald Herchen , Brian Lue
发明人： Tetsuya Ishikawa , Rick J. Roberts , Helen R. Armer , Leon Volfovski , Jay D. Pinson , Michael Rice , David H. Quach , Mohsen S. Salek , Robert Lowrance , John A. Backer , William Tyler Weaver , Charles Carlson , Chongyang Wang , Jeffrey Hudgens , Harald Herchen , Brian Lue
IPC分类号： B05C13/02
CPC分类号： H01L21/67225 , G03B27/32 , G03D13/006 , G03F7/40 , G05B19/41825 , G05B2219/40476 , G05B2219/45031 , G05B2219/49137 , H01L21/67109 , H01L21/6715 , H01L21/67161 , H01L21/67173 , H01L21/67178 , H01L21/67184 , H01L21/6719 , H01L21/67196 , H01L21/67742 , H01L21/67745 , H01L21/67748 , H01L21/67754 , H01L21/6831 , H01L21/6838 , H01L21/68707 , H01L22/26 , Y02P90/087 , Y10S414/135 , Y10S414/136 , Y10T29/53187 , Y10T29/5323
摘要： Embodiments generally provide an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that has an increased system throughput, increased system reliability, substrates processed in the cluster tool have a more repeatable wafer history, and also the cluster tool has a smaller system footprint. In one embodiment, the cluster tool is adapted to perform a track lithography process in which a substrate is coated with a photosensitive material, is then transferred to a stepper/scanner, which exposes the photosensitive material to some form of radiation to form a pattern in the photosensitive material, which is then removed in a developing process completed in the cluster tool. In track lithography type cluster tools, since the chamber processing times tend to be rather short, and the number of processing steps required to complete a typical track system process is large, a significant portion of the time it takes to process a substrate is taken up by the processes of transferring the substrates in a cluster tool between the various processing chambers. In one embodiment of the cluster tool, the cost of ownership, is reduced by grouping substrates together and transferring and processing the substrates in groups of two or more to improve system throughput, and reduces the number of moves a robot has to make to transfer a batch of substrates between the processing chambers, thus reducing wear on the robot and increasing system reliability. In one aspect of the invention, the substrate processing sequence and cluster tool are designed so that the substrate transferring steps performed during the processing sequence are only made to chambers that will perform the next processing step in the processing sequence. Embodiments also provide for a method and apparatus that are used to improve the coater chamber, the developer chamber, the post exposure bake chamber, the chill chamber, and the bake chamber process results. Embodiments also provide for a method and apparatus that are used to increase the reliability of the substrate transfer process to reduce system down time.
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5.发明申请公开(公告)号：US20070274813A1
公开(公告)日：2007-11-29
申请号：US11838155
申请日：2007-08-13
IPC分类号： G06F19/00
CPC分类号： B65G37/02 , B65G47/61 , B65G2201/0297 , H01L21/67769 , H01L21/67775 , H01L21/67778
摘要： In a first aspect, a substrate loading station is served by a conveyor which continuously transports substrate carriers. A substrate carrier handler that is part of the substrate loading station operates to exchange substrate carriers with the conveyor while the conveyor is in motion. A carrier exchange procedure may include moving an end effector of the substrate carrier handler at a velocity that substantially matches a velocity of the conveyor. Numerous other aspects are provided.
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公开(公告)号：US20070108019A1
公开(公告)日：2007-05-17
申请号：US11619181
申请日：2007-01-02
CPC分类号： H01L21/68707 , H01L21/6773 , H01L21/67733
摘要： A break-away mounting system for a continuous-motion, high-speed position conveyor system is disclosed. A support cradle may be suspended from a conveyor belt such that the support cradle maintains a fixed position and orientation relative to at least one point on the conveyor belt without inducing appreciable stress on the conveyor belt, the support cradle, or the coupling between the conveyor belt and the support cradle. The mount may include a leading rotatable bearing attached to the support cradle which may releasably engage a first key attached to the conveyor belt, the rotatable bearing adapted to accommodate rotational forces applied to the support cradle by the conveyor belt. The mount may also include a slide bearing attached to the support cradle which may releasably engage a second key attached to the conveyor belt, the slide bearing adapted to accommodate longitudinal forces applied to the support cradle by the conveyor belt.
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7.发明申请公开(公告)号：US20070061042A1
公开(公告)日：2007-03-15
申请号：US11555240
申请日：2006-10-31
IPC分类号： G06F19/00
CPC分类号： B65G37/02 , B65G47/61 , B65G2201/0297 , H01L21/67769 , H01L21/67775 , H01L21/67778
摘要： In a first aspect, a substrate loading station is served by a conveyor which continuously transports substrate carriers. A substrate carrier handler that is part of the substrate loading station operates to exchange substrate carriers with the conveyor while the conveyor is in motion. A carrier exchange procedure may include moving an end effector of the substrate carrier handler at a velocity that substantially matches a velocity of the conveyor. Numerous other aspects are provided.
摘要翻译： 在第一方面中，基板装载站由连续输送基板载体的输送机供给。 作为基板装载站的一部分的基板载体处理器在输送机运动的同时与输送机交换基板载体。 载体交换过程可以包括以基本匹配输送机速度的速度移动基底载体处理器的端部执行器。 提供了许多其他方面。
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公开(公告)号：US20070060754A1
公开(公告)日：2007-03-15
申请号：US10595230
申请日：2004-10-01
申请人： Kyle Lindstrom , Bryon Merrill , Chad Haraldson , Michael Rice , Tushar Kshirsagar , Philip Heppner , Joshua Wurst , Shri Niwas , Sarah Johannessen
发明人： Kyle Lindstrom , Bryon Merrill , Chad Haraldson , Michael Rice , Tushar Kshirsagar , Philip Heppner , Joshua Wurst , Shri Niwas , Sarah Johannessen
IPC分类号： C07D471/00
CPC分类号： C07D471/04 , A61K31/4745 , C07D413/14 , C07D519/00 , Y02A50/409 , Y02A50/411 , Y02A50/463
摘要： Imidazoquinoline compounds with an alkoxy substituent at the 6, 7, 8, or 9-position, pharmaceutical compositions containing the compounds, intermediates, methods of making, and methods of use of these compounds as immunomodulators, for inducing or inhibiting cytokine biosynthesis in animals and in the treatment of diseases including viral, and neoplastic, are disclosed.
摘要翻译： 含有6,7,8或9位烷氧基取代基的咪唑并喹啉化合物含有化合物，中间体，制备方法，以及这些化合物作为免疫调节剂的用途，用于诱导或抑制动物中的细胞因子生物合成， 在包括病毒和肿瘤的疾病的治疗中。
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公开(公告)号：US20070059145A1
公开(公告)日：2007-03-15
申请号：US11554876
申请日：2006-10-31
IPC分类号： B65G47/90
CPC分类号： H01L21/67276 , H01L21/67769 , H01L21/67778
摘要： In a semiconductor fabrication facility, a conveyor transports substrate carriers. The substrate carriers are unloaded from the conveyor and loaded onto the conveyor without stopping the conveyor. A load and/or unload mechanism lifts the substrate carriers from the conveyor during unloading operations, while matching the horizontal speed of the conveyor. Similarly, during loading operations, the load/unload mechanism lowers a substrate carrier into engagement with the conveyor while matching the horizontal speed of the conveyor. Individual substrates, without carriers, may be similarly loaded and/or unloaded from a conveyor.
摘要翻译： 在半导体制造设备中，输送机输送基板载体。 基板载体从输送机卸载并装载到输送机上而不停止输送机。 在卸载操作期间，负载和/或卸载机构将基板载体从输送机提升，同时匹配输送机的水平速度。 类似地，在装载操作期间，装载/卸载机构降低了基板载体与输送机的接合，同时匹配输送机的水平速度。 没有载体的单个基底可以类似地从输送机装载和/或卸载。
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公开(公告)号：US20070056834A1
公开(公告)日：2007-03-15
申请号：US11554919
申请日：2006-10-31
IPC分类号： B65G17/02
CPC分类号： H01L21/67706 , B65G17/20 , B65G37/02 , B65G2201/0297 , H01L21/67727 , H01L21/6773 , H01L21/67769 , H01L21/67778 , Y10S414/135
摘要： According to a first aspect, a first conveyor system is provided that is adapted to deliver substrate carriers within a semiconductor device manufacturing facility. The first conveyor system includes a ribbon that forms a closed loop along at least a portion of the semiconductor device manufacturing facility. The ribbon is adapted to (1) be flexible in a horizontal plane and rigid in a vertical plane; and (2) transport a plurality of substrate carriers within at least a portion of the semiconductor device manufacturing facility. Numerous other aspects are provided, as are systems, methods and computer program products in accordance with these and other aspects.
摘要翻译： 根据第一方面，提供了一种适于在半导体器件制造设备内传送衬底载体的第一传送系统。 第一输送机系统包括沿半导体器件制造设备的至少一部分形成闭合回路的带状物。 该带适于（1）在水平面上具有柔性并且在垂直平面中是刚性的; 和（2）在所述半导体器件制造设备的至少一部分内传输多个衬底载体。 还提供了许多其他方面，以及根据这些和其它方面的系统，方法和计算机程序产品。
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