公开(公告)号：US20190006254A1

公开(公告)日：2019-01-03

申请号：US16021454

申请日：2018-06-28

申请人： Kyocera International, Inc.

发明人： Mark EBLEN ,  Franklin KIM ,  Paul GARLAND ,  Shinichi HIRA

IPC分类号： H01L23/29 ,  H01L23/367 ,  H01L23/373 ,  H01L23/40

摘要： A semiconductor packaging structure is disclosed. The semiconductor packaging structure includes a heat spreader, a set of at least two leads, and a ceramic insulator. The heat spreader has a thermal conductivity greater than 300 W/m*K. The ceramic insulator has a mean flexural strength that is greater than 500 MPa and so better able to withstand the thermal expansion mismatch between it and the heat spreader. The heat spreader, the set of at least two leads, and the ceramic insulator may also be part of a semiconductor package along with at least one semiconductor device, a wire bond, and a ceramic lid.

公开(公告)号：US20180374781A1

公开(公告)日：2018-12-27

申请号：US16015631

申请日：2018-06-22

申请人： Kyocera International, Inc.

发明人： Franklin KIM ,  Mark EBLEN ,  Shinichi HIRA

IPC分类号： H01L23/495 ,  H01L23/367 ,  H01L23/04 ,  H01L23/08 ,  H01L21/48

CPC分类号： H01L23/49541 ,  H01L21/4839 ,  H01L21/4871 ,  H01L23/041 ,  H01L23/08 ,  H01L23/36 ,  H01L23/367 ,  H01L23/5389 ,  H01L2223/6644 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/15 ,  H01L2924/00014

摘要： Package deflection and mechanical stress of microelectronic packaging is minimized in a two step manufacturing process. In a first step, a ceramic insulator is high-temperature bonded between a wraparound lead layer and a buffer layer of a same material as the lead layer to provide a symmetrically balanced three-layer structure. In a second step, the three-layer structure is high temperature bonded, using a lower melt point braze, to a heat spreader. This package configuration minimizes package deflection, and thereby improves thermal dissipation and reliability of the package.