PCB panel, PCB, and manufacturing method

    公开(公告)号:US11058008B2

    公开(公告)日:2021-07-06

    申请号:US16574985

    申请日:2019-09-18

    IPC分类号: H05K1/18 H05K3/00 H05K3/34

    摘要: A manufacturing method, Printed Circuit Board (PCB) panel, and a PCB are disclosed. The method includes forming a cavity in a PCB that is in a PCB panel that includes a frame and stays, mounting an electronic component, heating the PCB panel, and cutting the stays. The PCB panel includes a frame body and a PCB coupled to the frame body via stays. The PCB includes a cavity. A first cavity stay is located near the cavity. Extended lines extend from the cavity, and the cavity stay extends at least between the extended lines. The PCB includes a cavity and a connection point from a cavity stay near the cavity.

    ELECTRONIC DEVICE
    2.
    发明申请

    公开(公告)号:US20220068761A1

    公开(公告)日:2022-03-03

    申请号:US17305951

    申请日:2021-07-19

    IPC分类号: H01L23/40 H05K1/18 G06F1/20

    摘要: An electronic device includes: a circuit board having a mounting face, on which an electronic component is mounted; a heat receiver including a heat receiving plate opposed to the electronic component; and a fastening mechanism that fixes the heat receiver to the circuit board. The fastening mechanism includes a receiver having a proximal end and a distal end, the receiver having a mounting hole penetrating from the proximal end to the distal end; and a fastener that is inserted into the mounting hole for fastening to the receiver to press the heat receiver. The receiver is surface-mounted on the mounting face by soldering with the proximal end facing the mounting face.

    Electronic device
    3.
    发明授权

    公开(公告)号:US12027444B2

    公开(公告)日:2024-07-02

    申请号:US17305951

    申请日:2021-07-19

    IPC分类号: H01L23/40 G06F1/20 H05K1/18

    摘要: An electronic device includes: a circuit board having a mounting face, on which an electronic component is mounted; a heat receiver including a heat receiving plate opposed to the electronic component; and a fastening mechanism that fixes the heat receiver to the circuit board. The fastening mechanism includes a receiver having a proximal end and a distal end, the receiver having a mounting hole penetrating from the proximal end to the distal end; and a fastener that is inserted into the mounting hole for fastening to the receiver to press the heat receiver. The receiver is surface-mounted on the mounting face by soldering with the proximal end facing the mounting face.