公开(公告)号：US20140077241A1

公开(公告)日：2014-03-20

申请号：US13759499

申请日：2013-02-05

Applicant: LEXTAR ELECTRONICS CORPORATION

Inventor： Fu-Shin Chen ,  Jia-Ming Sung

IPC: H01L33/50 ,  H01L33/60

CPC classification number: H01L33/50 ,  H01L33/58 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/8592 ,  H01L2924/00014

Abstract: A Light emitting diode (LED) includes a substrate, a LED chip, a wavelength conversion layer, a lens and a reflective layer. The LED chip is mounted on the substrate. The wavelength conversion layer covers the top surface of the LED chip and exposes the lateral surface of the LED chip. The lens is disposed on the substrate and encloses the LED chip and the wavelength conversion layer. The reflective layer is disposed on the lens for reflecting the light emitted from the lateral surface of the LED chip.

Abstract translation: 发光二极管（LED）包括基板，LED芯片，波长转换层，透镜和反射层。 LED芯片安装在基板上。 波长转换层覆盖LED芯片的顶表面并暴露LED芯片的侧表面。 透镜设置在基板上并包围LED芯片和波长转换层。 反射层设置在透镜上用于反射从LED芯片的侧表面发射的光。

公开(公告)号：US08674378B1

公开(公告)日：2014-03-18

申请号：US13759499

申请日：2013-02-05

Applicant: Lextar Electronics Corporation

Inventor： Fu-Shin Chen ,  Jia-Ming Sung

IPC: H01L21/33

CPC classification number: H01L33/50 ,  H01L33/58 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/8592 ,  H01L2924/00014

Abstract: A Light emitting diode (LED) includes a substrate, a LED chip, a wavelength conversion layer, a lens and a reflective layer. The LED chip is mounted on the substrate. The wavelength conversion layer covers the top surface of the LED chip and exposes the lateral surface of the LED chip. The lens is disposed on the substrate and encloses the LED chip and the wavelength conversion layer. The reflective layer is disposed on the lens for reflecting the light emitted from the lateral surface of the LED chip.

Abstract translation: 发光二极管（LED）包括基板，LED芯片，波长转换层，透镜和反射层。 LED芯片安装在基板上。 波长转换层覆盖LED芯片的顶表面并暴露LED芯片的侧表面。 透镜设置在基板上并包围LED芯片和波长转换层。 反射层设置在透镜上用于反射从LED芯片的侧表面发射的光。