公开(公告)号：US10932362B2

公开(公告)日：2021-02-23

申请号：US16649913

申请日：2018-09-18

Applicant: LG INNOTEK CO., LTD.

Inventor： Jong Sik Lee ,  Jin A Gu ,  Soo Jung Yoon ,  Gyung Seok Lee ,  Hyun Gu Im

IPC: H05K1/03 ,  H05K1/09 ,  C08K3/38 ,  C08K9/06 ,  C09C1/00 ,  C09C3/12 ,  H01L33/64 ,  H05K1/02 ,  H05K3/46

Abstract: A circuit board according to an embodiment of the present invention comprises: a first metal layer; an insulating layer disposed on the first metal layer and comprising boron nitride agglomerate particles coated with a resin; and a second metal layer disposed on the insulating layer, wherein: one of both surfaces of the first metal layer, on which the insulating layer is disposed, is in at least partial contact with one surface of the insulating layer; one of both surfaces of the second metal layer, on which the insulating layer is disposed, is in at least partial contact with the other surface of the insulating layer; a plurality of grooves are formed on a surface which is one of both surfaces of at least one of the first metal layer and the second metal layer and which has the insulating layer disposed thereon; at least some of the particles are arranged in at least some of the plurality of grooves; the width (W) of at least one of the plurality of grooves is 1 to 1.8 times D50 of the particles; and a ratio (D/W) of the depth (D) to the width (W) of at least one of the plurality of grooves is 0.2 to 0.3.

公开(公告)号：US10392499B2

公开(公告)日：2019-08-27

申请号：US15320132

申请日：2015-06-19

Applicant: LG INNOTEK CO., LTD.

Inventor： Sung Jin Yun ,  Jae Man Park ,  Hyun Gu Im ,  Jin A Gu ,  Gun Young Gil ,  Se Woong Na ,  Sang A Ju

IPC: C08K9/02 ,  C08K3/22 ,  C08K3/34 ,  C08K3/38 ,  C08K9/04 ,  C08K3/04 ,  C08K5/55 ,  C08K9/06 ,  C08K9/10 ,  C08L63/00 ,  H05K1/03 ,  C01B21/064 ,  C08G59/02 ,  C09C1/00 ,  C09C3/10 ,  C09C3/12 ,  H01L23/373 ,  H01L33/52 ,  C01B21/082 ,  C01B21/072

Abstract: An inorganic filler included in an epoxy resin composition includes a coating layer formed on a surface thereof, and the surface of the coating layer includes at least two elements selected from the group consisting of C, N and O.