公开(公告)号：US09093626B2

公开(公告)日：2015-07-28

申请号：US14010592

申请日：2013-08-27

Applicant: LG INNOTEK CO., LTD.

Inventor： Sampei Tomohiro ,  Kato Takuma ,  Matsuda Shuhei

IPC: H01L33/00 ,  H01L33/56 ,  H01L25/075 ,  H01L33/64 ,  H01L27/15 ,  H01L33/62

CPC classification number: H01L33/56 ,  H01L25/0753 ,  H01L27/15 ,  H01L33/58 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A luminescence device used in a backlight unit for lighting or displaying may include: a substrate including at least two electrode patterns and LED chips which are provided over the substrate and include a phosphor provided thereon. A dam is provided over the substrate, and an encapsulation layer is provided over the substrate. The dam is spaced from the LED Chips, and the substrate comprises a direct copper bonding (DCB) substrate including a first copper layer, a second copper layer and a substrate body.

Abstract translation: 用于照明或显示的背光单元中的发光装置可以包括：基板，包括至少两个电极图案和设置在基板上的LED芯片，并且包括设置在其上的荧光体。 在衬底上设置有一个坝，并且在衬底上提供一个封装层。 大坝与LED芯片间隔开，并且基板包括包括第一铜层，第二铜层和基板本体的直接铜键合（DCB）基板。