公开(公告)号：US09093626B2

公开(公告)日：2015-07-28

申请号：US14010592

申请日：2013-08-27

Applicant: LG INNOTEK CO., LTD.

Inventor： Sampei Tomohiro ,  Kato Takuma ,  Matsuda Shuhei

IPC: H01L33/00 ,  H01L33/56 ,  H01L25/075 ,  H01L33/64 ,  H01L27/15 ,  H01L33/62

CPC classification number: H01L33/56 ,  H01L25/0753 ,  H01L27/15 ,  H01L33/58 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A luminescence device used in a backlight unit for lighting or displaying may include: a substrate including at least two electrode patterns and LED chips which are provided over the substrate and include a phosphor provided thereon. A dam is provided over the substrate, and an encapsulation layer is provided over the substrate. The dam is spaced from the LED Chips, and the substrate comprises a direct copper bonding (DCB) substrate including a first copper layer, a second copper layer and a substrate body.

Abstract translation: 用于照明或显示的背光单元中的发光装置可以包括：基板，包括至少两个电极图案和设置在基板上的LED芯片，并且包括设置在其上的荧光体。 在衬底上设置有一个坝，并且在衬底上提供一个封装层。 大坝与LED芯片间隔开，并且基板包括包括第一铜层，第二铜层和基板本体的直接铜键合（DCB）基板。

公开(公告)号：US09093281B2

公开(公告)日：2015-07-28

申请号：US14014777

申请日：2013-08-30

Applicant: LG INNOTEK CO., LTD.

Inventor： Sampei Tomohiro

IPC: H01L23/00 ,  H01L33/62 ,  H01L33/38 ,  H01L33/50 ,  H01L33/64

CPC classification number: H01L24/04 ,  H01L23/3735 ,  H01L24/02 ,  H01L24/05 ,  H01L24/06 ,  H01L24/45 ,  H01L33/382 ,  H01L33/50 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/04042 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2924/00014 ,  H01L2924/181 ,  H05K1/0274 ,  H05K1/0306 ,  H05K1/09 ,  H05K3/284 ,  H05K2201/0335 ,  H05K2201/09909 ,  H05K2201/10106 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012 ,  H01L2224/05599

Abstract: A luminescence device used in a backlight unit for lighting or displaying may include a substrate having a first electrode and a second electrode, and an LED chip disposed on the first electrode. A dam is disposed on the substrate. The dam is disposed spaced from the LED chip, and the substrate comprises a direct copper bonding (DCB) substrate including a first copper layer and a second copper layer. The first electrode and the second electrode include respectively a metal film which fills a void of the surfaces thereof.

Abstract translation: 用于照明或显示的背光单元中的发光装置可以包括具有第一电极和第二电极的基板和设置在第一电极上的LED芯片。 坝体设置在基板上。 该坝与LED芯片间隔设置，并且该基板包括包括第一铜层和第二铜层的直接铜键合（DCB）基板。 第一电极和第二电极分别包括填充其表面的空隙的金属膜。

公开(公告)号：US10290789B2

公开(公告)日：2019-05-14

申请号：US15663038

申请日：2017-07-28

Applicant: LG INNOTEK CO., LTD.

Inventor： Sampei Tomohiro

IPC: H01L33/64 ,  H01L33/48 ,  H01L27/15 ,  H01L33/20 ,  H01L33/36 ,  H01L33/50 ,  H01L33/60

Abstract: A light emitting device includes: a first support member having an opening; a second support member disposed in the opening of the first support member; an adhesive member disposed between the first and second support members; a first lead electrode disposed on the second support member; a second lead electrode disposed on at least one of the first and second support members; a light emitting chip disposed on the first lead electrode, the light emitting chip being electrically connected to the second lead electrode; and a conductive layer disposed under the second support member, wherein the first support member includes a resin material, the second support member includes a ceramic material, and the first lead electrode is disposed between the light emitting chip and the second support member.

公开(公告)号：US09761776B2

公开(公告)日：2017-09-12

申请号：US15196589

申请日：2016-06-29

Applicant: LG INNOTEK CO., LTD.

Inventor： Sampei Tomohiro

IPC: H01L33/64 ,  H01L33/48 ,  H01L27/15 ,  H01L33/20 ,  H01L33/36 ,  H01L33/50 ,  H01L33/60

CPC classification number: H01L33/642 ,  H01L27/156 ,  H01L33/20 ,  H01L33/36 ,  H01L33/486 ,  H01L33/50 ,  H01L33/60 ,  H01L33/64 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A light emitting device includes: a first support member having an opening; a second support member disposed in the opening of the first support member; an adhesive member disposed between the first and second support members; a first lead electrode disposed on the second support member; a second lead electrode disposed on at least one of the first and second support members; a light emitting chip disposed on the first lead electrode, the light emitting chip being electrically connected to the second lead electrode; and a conductive layer disposed under the second support member, wherein the first support member includes a resin material, the second support member includes a ceramic material, and the first lead electrode is disposed between the light emitting chip and the second support member.