公开(公告)号：US20230182443A1

公开(公告)日：2023-06-15

申请号：US18076544

申请日：2022-12-07

Applicant: LG INNOTEK CO., LTD.

Inventor： Koh Eun Lee ,  Han Sang Kim ,  Min Young Hwang

IPC: B32B15/09 ,  B32B15/20 ,  B32B27/20 ,  C08L67/00 ,  H05K1/03 ,  C08K7/14

CPC classification number: B32B15/09 ,  B32B15/20 ,  B32B27/20 ,  C08L67/00 ,  H05K1/0366 ,  C08K7/14 ,  B32B2262/101 ,  B32B2457/14 ,  C08L2205/12 ,  B32B2307/204 ,  B32B2305/55 ,  B32B2305/22 ,  B32B2307/308

Abstract: A resin composition for a semiconductor package according to an embodiment includes a resin composition comprising a resin and a filler provided in the resin, wherein the resin includes a soluble liquid crystal polymer resin, and wherein the filler has a negative coefficient of thermal expansion (negative CTE) and is provided in the soluble liquid crystal polymer resin.

公开(公告)号：US10886449B2

公开(公告)日：2021-01-05

申请号：US16426385

申请日：2019-05-30

Applicant: LG INNOTEK CO., LTD.

Inventor： Koh Eun Lee

IPC: H01L33/64 ,  H01L33/48 ,  H01L33/62

Abstract: Disclosed herein is a semiconductor device package including: a body including a cavity; a semiconductor device disposed in the cavity; a light transmitting member disposed on the cavity; and an adhesive layer which fixes the light transmitting member to the body, wherein the cavity includes a stepped portion on which the light transmitting member is disposed, the stepped portion includes a first bottom surface and a third bottom surface spaced apart from each other in a first direction, a second bottom surface and a fourth bottom surface spaced apart from each other in a second direction perpendicular to the first direction, a first connecting portion in which the first bottom surface and the second bottom surface are connected to each other, a second connecting portion in which the second bottom surface and the third bottom surface are connected to each other, a third connecting portion in which the third bottom surface and the fourth bottom surface are connected to each other, and a fourth connecting portion in which the fourth bottom surface and the first bottom surface are connected to each other, the adhesive layer includes a first edge portion, a second edge portion, a third edge portion, and a fourth edge portion respectively—disposed on the first to fourth connecting portions and a first extending portion disposed between the first edge portion and the second edge portion, and the first extending portion has a width which is decreased in a direction toward a center between the first edge portion and the second edge portion.

公开(公告)号：US10305006B2

公开(公告)日：2019-05-28

申请号：US15770862

申请日：2016-11-02

Applicant: LG INNOTEK CO., LTD.

Inventor： Koh Eun Lee ,  Yon Tae Moon ,  Ga Yeon Kim ,  Yun Soo Song ,  Hwan Hee Jeong

IPC: H01L25/16 ,  H01L33/40 ,  H01L33/46 ,  H01L33/48 ,  H01L33/50 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64

Abstract: According to an embodiment, a light-emitting device is disclosed. The disclosed light-emitting device comprises: a substrate having a body and first and second lead electrodes on the body; a light-emitting chip arranged on the second lead electrode and electrically connected to the first and second lead electrodes; a phosphor film arranged on the light-emitting chip; a reflective member arranged on the outer peripheries of the light-emitting chip and the phosphor film, respectively; and an optical lens, which is arranged on the phosphor film and on the reflective member, and which has a lens portion that has an aspherical shape.