公开(公告)号：US10020280B2

公开(公告)日：2018-07-10

申请号：US14791862

申请日：2015-07-06

Applicant: LG INNOTEK CO., LTD.

Inventor： Tae Ki Hong ,  Dong Guk Jo ,  Han Mo Koo ,  Jun Young Lim ,  Ki Tae Park ,  Sang Ki Cho ,  Dae Sung Yoo ,  Nak Ho Song ,  Joo Chul Kim ,  Jae Sung Jo

IPC: H05K1/11 ,  H01L23/00 ,  H01L23/498

CPC classification number: H01L24/50 ,  H01L23/49838 ,  H01L23/4985 ,  H01L24/86 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/37001 ,  H05K1/11 ,  Y10T29/49155 ,  H01L2924/00

Abstract: The present invention relates to a method of manufacturing a carrier tape, wherein a TAB tape including a base film having a central area and edge areas at both directions of the central area, a wiring pattern formed at the central area of the base film, a transfer area formed at the edge area of the base film and exposed by the base film, a plurality of sprocket holes arranged in a row on the transfer area and a metal pattern discretely formed from the wiring pattern, and formed at the edge areas of the base film, wherein the metal pattern is formed with a paired structure formed at both sides of the plurality of sprocket holes, such that the present invention has an advantageous effect in that no Cu layer or a metal layer exists at a portion of the sprocket holes from which friction is generated by a driving roller during assembly work between a drive IC and chips/drive IC and panel to dispense with generation of foreign objects such as Cu particles, thereby enhancing reliability of the product.

公开(公告)号：US20150311176A1

公开(公告)日：2015-10-29

申请号：US14791862

申请日：2015-07-06

Applicant: LG INNOTEK CO., LTD.

Inventor： Tae Ki Hong ,  Dong Guk Jo ,  Han Mo Koo ,  Jun Young Lim ,  Ki Tae Park ,  Sang Ki Cho ,  Dae Sung Yoo ,  Nak Ho Song ,  Joo Chul Kim ,  Jae Sung Jo

IPC: H01L23/00

CPC classification number: H01L24/50 ,  H01L23/49838 ,  H01L23/4985 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/37001 ,  H05K1/11 ,  Y10T29/49155 ,  H01L2924/00

Abstract: The present invention relates to a carrier tape for TAB-package and a manufacturing method thereof, wherein a TAB tape including a base film having a central area and edge areas at both directions of the central area, a wiring pattern formed at the central area of the base film, a transfer area formed at the edge area of the base film and exposed by the base film, a plurality of sprocket holes arranged in a row on the transfer area and a metal pattern discretely formed from the wiring pattern, and formed at the edge areas of the base film, wherein the metal pattern is formed with a paired structure formed at both sides of the plurality of sprocket holes, such that the present invention has an advantageous effect in that no Cu layer or a metal layer exists at a portion of the sprocket holes from which friction is generated by a driving roller during assembly work between a drive IC and chips/drive IC and panel to dispense with generation of foreign objects such as Cu particles, thereby enhancing reliability of the product.

Abstract translation: 本发明涉及一种TAB封装用载带及其制造方法，其特征在于，包括具有中心区域和中心区域的两个方向的边缘区域的基膜的TAB带，形成在中央区域的中央区域的布线图案 基膜，形成在基膜的边缘区域并被基膜曝光的转印区域，在转印区域上排列成一排的多个链轮孔和从布线图案离散地形成的金属图案，并形成在 基底膜的边缘区域，其中金属图案形成有形成在多个链轮孔的两侧的成对结构，使得本发明具有有利的效果，即在一个或多个链条中不存在Cu层或金属层 在驱动IC和芯片/驱动IC和面板之间的组装工作期间由驱动辊产生摩擦的部分链轮，以排除诸如Cu颗粒的异物的产生，从而 提高产品的可靠性。

公开(公告)号：US09648731B2

公开(公告)日：2017-05-09

申请号：US14175137

申请日：2014-02-07

Applicant: LG INNOTEK CO., LTD.

Inventor： Tae Ki Hong ,  Jun Young Lim ,  Ki Tae Park ,  Sang Ki Cho ,  Dae Sung Yoo ,  Han Mo Koo

IPC: H05K1/09 ,  H05K1/00 ,  H05K1/02 ,  H01L23/00 ,  H01L23/498

CPC classification number: H05K1/028 ,  H01L23/4985 ,  H01L24/50 ,  H01L2924/01029 ,  H01L2924/14

Abstract: The present invention relates to a method for manufacturing a TAB tap. The method includes forming a circuit pattern region having input/output terminal pattern on a base film, and forming an exposing region at a convey region having a sprocket hole for exposing the base film. Accordingly, the present invention provides a TAB tape that improves reliability of a product by fundamentally preventing the generation of metal particles by forming exposing regions that expose a base film through selectively etching and removing a metal layer of a convey region formed at both side of a TAB tape and having a sprocket hole, and that prevents short-circuit by partially removing a base film at a predetermined region not having a circuit pattern formed thereon through etching.

公开(公告)号：US09105631B2

公开(公告)日：2015-08-11

申请号：US14304526

申请日：2014-06-13

Applicant: LG INNOTEK CO., LTD.

Inventor： Tae Ki Hong ,  Dong Guk Jo ,  Han Mo Koo ,  Jun Young Lim ,  Ki Tae Park ,  Sang Ki Cho ,  Dae Sung Yoo ,  Nak Ho Song ,  Joo Chul Kim ,  Jae Sung Jo

IPC: H05K1/11 ,  H01L23/00 ,  H01L23/498

CPC classification number: H01L24/50 ,  H01L23/49838 ,  H01L23/4985 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/37001 ,  H05K1/11 ,  Y10T29/49155 ,  H01L2924/00

Abstract: The present invention relates to a carrier tape for TAB-package and a manufacturing method thereof, wherein a TAB tape including a base film having a central area and edge areas at both directions of the central area, a wiring pattern formed at the central area of the base film, a transfer area formed at the edge area of the base film and exposed by the base film, a plurality of sprocket holes arranged in a row on the transfer area and a metal pattern discretely formed from the wiring pattern, and formed at the edge areas of the base film, wherein the metal pattern is formed with a paired structure formed at both sides of the plurality of sprocket holes, such that the present invention has an advantageous effect in that no Cu layer or a metal layer exists at a portion of the sprocket holes from which friction is generated by a driving roller during assembly work between a drive IC and chips/drive IC and panel to dispense with generation of foreign objects such as Cu particles, thereby enhancing reliability of the product.

Abstract translation: 本发明涉及一种TAB封装用载带及其制造方法，其特征在于，包括具有中心区域和中心区域的两个方向的边缘区域的基膜的TAB带，形成在中央区域的中心区域的布线图案 基膜，形成在基膜的边缘区域并被基膜曝光的转印区域，在转印区域上排列成一排的多个链轮孔和从布线图案离散地形成的金属图案，并形成在 基底膜的边缘区域，其中金属图案形成有形成在多个链轮孔的两侧的成对结构，使得本发明具有有利的效果，即在一个或多个链条中不存在Cu层或金属层 在驱动IC和芯片/驱动IC和面板之间的组装工作期间由驱动辊产生摩擦的部分链轮，以排除诸如Cu颗粒的异物的产生，从而 提高产品的可靠性。

公开(公告)号：US20140291004A1

公开(公告)日：2014-10-02

申请号：US14304526

申请日：2014-06-13

Applicant: LG INNOTEK CO., LTD.

Inventor： Tae Ki Hong ,  Dong Guk Jo ,  Han Mo Koo ,  Jun Young Lim ,  Ki Tae Park ,  Sang Ki Cho ,  Dae Sung Yoo ,  Nak Ho Song ,  Joo Chul Kim ,  Jae Sung Jo

IPC: H01L23/00 ,  H05K1/11

CPC classification number: H01L24/50 ,  H01L23/49838 ,  H01L23/4985 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/37001 ,  H05K1/11 ,  Y10T29/49155 ,  H01L2924/00

Abstract: The present invention relates to a carrier tape for TAB-package and a manufacturing method thereof, wherein a TAB tape including a base film having a central area and edge areas at both directions of the central area, a wiring pattern formed at the central area of the base film, a transfer area formed at the edge area of the base film and exposed by the base film, a plurality of sprocket holes arranged in a row on the transfer area and a metal pattern discretely formed from the wiring pattern, and formed at the edge areas of the base film, wherein the metal pattern is formed with a paired structure formed at both sides of the plurality of sprocket holes, such that the present invention has an advantageous effect in that no Cu layer or a metal layer exists at a portion of the sprocket holes from which friction is generated by a driving roller during assembly work between a drive IC and chips/drive IC and panel to dispense with generation of foreign objects such as Cu particles, thereby enhancing reliability of the product.

Abstract translation: 本发明涉及一种TAB封装用载带及其制造方法，其特征在于，包括具有中心区域和中心区域的两个方向的边缘区域的基膜的TAB带，形成在中央区域的中心区域的布线图案 基膜，形成在基膜的边缘区域并被基膜曝光的转印区域，在转印区域上排列成一排的多个链轮孔和从布线图案离散地形成的金属图案，并形成在 基底膜的边缘区域，其中金属图案形成有形成在多个链轮孔的两侧的成对结构，使得本发明具有有利的效果，即在一个或多个链条中不存在Cu层或金属层 在驱动IC和芯片/驱动IC和面板之间的组装工作期间由驱动辊产生摩擦的部分链轮，以排除诸如Cu颗粒的异物的产生，从而 提高产品的可靠性。

公开(公告)号：US20140183592A1

公开(公告)日：2014-07-03

申请号：US14236016

申请日：2012-07-27

Applicant: LG INNOTEK CO., LTD.

Inventor： Jee Heum Paik ,  Sang Ki Cho

IPC: H01L33/62

CPC classification number: H01L33/62 ,  H01L33/486 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/92247 ,  H01L2933/005 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Provided are an optical device package and a method of manufacturing the same. The method of manufacturing the optical device package according to an exemplary embodiment of the present invention comprises: forming a metal layer on an insulating layer on which via holes are formed; forming a circuit pattern layer by etching the metal layer; forming a boundary part in a predetermined part of the metal layer; mounting an optical device on the circuit pattern layer; and forming a molding part by applying a transparent material to the optical device, wherein the predetermined part is a part corresponding to a boundary of the molding part.

Abstract translation: 提供一种光学器件封装及其制造方法。 根据本发明的示例性实施例的制造光学器件封装的方法包括：在形成有通孔的绝缘层上形成金属层; 通过蚀刻金属层形成电路图案层; 在所述金属层的预定部分中形成边界部分; 将光学装置安装在电路图案层上; 以及通过向所述光学装置施加透明材料来形成模制部件，其中所述预定部分是对应于所述模制部件的边界的部分。