公开(公告)号：US12239020B2

公开(公告)日：2025-02-25

申请号：US17913487

申请日：2021-03-18

Applicant: LINTEC CORPORATION

Inventor： Toshiya Yamasaki ,  Kunihisa Kato ,  Yuta Seki

IPC: H10N10/852 ,  H10N10/855 ,  H10N10/857

Abstract: Provided is a thermoelectric conversion module including a thermoelectric conversion material layer that has high thermoelectric performance, the thermoelectric conversion material layer containing a thermoelectric conversion material with its electrical resistivity reduced. The thermoelectric conversion module includes the thermoelectric conversion material layer including the thermoelectric conversion material containing at least thermoelectric semiconductor particles. The thermoelectric conversion material layer has voids, and when a proportion of the area occupied by the thermoelectric conversion material within the area of a longitudinal cross-section that includes the center portion of the thermoelectric conversion material layer is defined as a filling ratio, the filling ratio is greater than 0.900 and less than 1.000.

公开(公告)号：US11974504B2

公开(公告)日：2024-04-30

申请号：US17786269

申请日：2020-12-01

Applicant: LINTEC Corporation

Inventor： Yuta Seki ,  Kunihisa Kato ,  Tsuyoshi Muto

IPC: H10N10/857 ,  H10N10/01 ,  H10N10/17

CPC classification number: H10N10/857 ,  H10N10/01 ,  H10N10/17

Abstract: Provided are: a thermoelectric conversion body that has high electrical conductivity, achieving high thermoelectric conversion efficiency when used in a thermoelectric conversion module, and is less susceptible to warpage during manufacture; a method for manufacturing the same; and a thermoelectric conversion module using the same. A thermoelectric conversion body that is a fired product of a composition containing a thermoelectric semiconductor material and a heat resistant resin, wherein, with the heat resistant resin being subjected to temperature elevation and a weight of the heat resistant resin at 400° C. being defined as 100%, a temperature at which the heat resistant resin undergoes a further 5% reduction in weight is 480° C. or lower; a thermoelectric conversion module including the thermoelectric conversion body; and a method for manufacturing the thermoelectric conversion body.

公开(公告)号：US11882766B2

公开(公告)日：2024-01-23

申请号：US17913522

申请日：2021-03-18

Applicant: LINTEC CORPORATION

Inventor： Wataru Morita ,  Kunihisa Kato ,  Yuta Seki

IPC: H10N10/852 ,  H10N10/17 ,  H10N10/857

CPC classification number: H10N10/852 ,  H10N10/17 ,  H10N10/857

Abstract: A thermoelectric conversion module having a further improved thermoelectric performance is provided. The thermoelectric conversion module includes: a base material; and a thermoelectric element layer including a thermoelectric semiconductor composition, wherein the thermoelectric semiconductor composition includes a thermoelectric semiconductor material, a heat resistant resin A, and an ionic liquid and/or inorganic ionic compound, and wherein the base material has a thermal resistance of 0.35 K/W or less.

公开(公告)号：US12114568B2

公开(公告)日：2024-10-08

申请号：US18034430

申请日：2021-10-28

Applicant: LINTEC CORPORATION

Inventor： Yuta Seki ,  Kunihisa Kato ,  Wataru Morita ,  Mutsumi Masumoto

IPC: H10N10/01 ,  H10N10/17 ,  H10N10/857

CPC classification number: H10N10/01 ,  H10N10/17 ,  H10N10/857

Abstract: Provided is a method for manufacturing a thermoelectric conversion module that eliminates the need for supports and solder materials, allows collective and efficient production of a plurality of thin thermoelectric conversion modules, and includes the following steps (A) to (D): (A) disposing a chip of a P-type thermoelectric conversion material and a chip of an N-type thermoelectric conversion material on a support so as to be spaced apart from each other; (B) filling an insulator between the chip of the P-type thermoelectric conversion material and the chip of the N-type thermoelectric conversion material to obtain an integrated body including the chip of the P-type thermoelectric conversion material, the chip of the N-type thermoelectric conversion material, and the insulator; (C) peeling the integrated body obtained in step (B) from the support; and (D) connecting the chip of the P-type thermoelectric conversion material and the chip of the N-type thermoelectric conversion material via an electrode in the integrated body after step (C).

公开(公告)号：US11581471B2

公开(公告)日：2023-02-14

申请号：US17282047

申请日：2019-10-02

Applicant: LINTEC CORPORATION

Inventor： Tsuyoshi Muto ,  Kunihisa Kato ,  Taku Nemoto ,  Wataru Morita ,  Yuta Seki

IPC: H01L35/34 ,  H01L35/32

Abstract: A chip of thermoelectric conversion material may have a concave portion and may be capable of realizing high joining properties to an electrode. Such a chip of thermoelectric conversion material may have a concave on at least one surface of the chip of thermoelectric conversion material. The shape of such chips of may be rectangular parallelepiped, cubic, and/or columnar shape.