公开(公告)号：US11716064B1

公开(公告)日：2023-08-01

申请号：US17142098

申请日：2021-01-05

Applicant: LOCKHEED MARTIN CORPORATION

Inventor： Thomas Henry Hand ,  Joshua David Gustafson ,  Aaron Christopher Rothlisberger

IPC: H03G5/16 ,  H01P3/08 ,  H04B1/12 ,  H05K1/02

CPC classification number: H03G5/165 ,  H01P3/08 ,  H04B1/12 ,  H05K1/025

Abstract: Distributed gain equalization circuits for use with radio frequency (RF) devices are provided. The distributed gain equalization circuits include a substrate layer, multiple transverse electromagnetic (TEM) line circuits disposed on the substrate layer and multiple traces disposed on the substrate layer, each trace connected to one or more of the TEM line circuits. The traces and TEM line circuits are configured to provide resistances, inductances and capacitances to eliminate the need for lumped or packaged resistors, inductors and capacitors. The distributed gain equalization circuit operates at millimeter wave frequencies and provides a compensating gain slope to counteract a negative gain slope of the RF device. Methods of manufacturing distributed gain equalization circuits are also provided.

公开(公告)号：US12069798B1

公开(公告)日：2024-08-20

申请号：US17726672

申请日：2022-04-22

Applicant: Lockheed Martin Corporation

Inventor： Thomas Henry Hand ,  Joshua David Gustafson ,  Joseph M. Torres ,  Aaron Christopher Rothlisberger ,  Roger Douglas Hasse ,  Adam Blair Hess ,  Madison P. Gast ,  Braiden T. Olds ,  Colton Brent Martin

IPC: H05K1/02 ,  H01P5/18 ,  H05K1/14

CPC classification number: H05K1/024 ,  H01P5/187 ,  H05K1/145 ,  H05K2201/09227

Abstract: Enhanced components and assemblies for connector-less radio frequency (RF) interconnect systems are provided. One example includes two circuit boards each with a broadside coupling feature comprising a tapered circuit board trace having a terminal portion. The circuit boards are positioned in close proximity to establish a desired gap, and a dielectric material is positioned within the gap between circuit boards. The broadside coupling features of the circuit boards are then configured to convey RF signals over the gap without electrical contact.