Phased array feed reflector collar and paraconic ground plane

    公开(公告)号:US11881625B1

    公开(公告)日:2024-01-23

    申请号:US17495700

    申请日:2021-10-06

    CPC classification number: H01Q15/14 H01Q19/102 H01Q19/17

    Abstract: A reflector antenna includes a reflector having a curved reflecting surface that extends around a longitudinal center axis, wherein the curved reflecting surface is defined by rotating a concave curve around the longitudinal center axis and wherein one end of the concave curve defines an apex on the longitudinal center axis. The reflector antenna may further include a ground plane extension having a flat reflecting surface abutting an edge of the reflector and extending radially away from the longitudinal center axis. A phased array feed may be arranged spaced apart from and opposite to the reflecting surfaces of the reflector and the ground plane extension. A tapered collar may be arranged adjacent to the phased array feed, wherein the tapered collar tapers outward away from the phased array feed and towards the reflector, and wherein the tapered collar comprises an inner reflective surface facing the reflector.

    Omni antennas
    5.
    发明授权

    公开(公告)号:US10651558B1

    公开(公告)日:2020-05-12

    申请号:US15294474

    申请日:2016-10-14

    Abstract: An omni antenna assembly includes two antennas, a dipole antenna and a monocone antenna, to provide full spherical coverage. The dipole cavity for the dipole antenna forms one solid part with the monocone antenna. The monocone antenna also includes a monocone and a cylindrical shell connecting the dipole cavity to the monocone. A coaxial transition extends from the cylindrical shell to a matching network. The antenna assembly may be fabricated using additive manufacturing technology.

    Wideband distributed gain equalization circuit

    公开(公告)号:US11716064B1

    公开(公告)日:2023-08-01

    申请号:US17142098

    申请日:2021-01-05

    CPC classification number: H03G5/165 H01P3/08 H04B1/12 H05K1/025

    Abstract: Distributed gain equalization circuits for use with radio frequency (RF) devices are provided. The distributed gain equalization circuits include a substrate layer, multiple transverse electromagnetic (TEM) line circuits disposed on the substrate layer and multiple traces disposed on the substrate layer, each trace connected to one or more of the TEM line circuits. The traces and TEM line circuits are configured to provide resistances, inductances and capacitances to eliminate the need for lumped or packaged resistors, inductors and capacitors. The distributed gain equalization circuit operates at millimeter wave frequencies and provides a compensating gain slope to counteract a negative gain slope of the RF device. Methods of manufacturing distributed gain equalization circuits are also provided.

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