公开(公告)号：US20180235115A1

公开(公告)日：2018-08-16

申请号：US15947080

申请日：2018-04-06

Applicant: Laird Technologies (SHENZHEN) Ltd.

Inventor： Richard TSAI ,  Dusan LEE ,  Larry Don CREASY, JR.

IPC: H05K9/00 ,  C23C18/16 ,  C23C18/38

CPC classification number: H05K9/0084 ,  C23C18/1605 ,  C23C18/1608 ,  C23C18/161 ,  C23C18/1614 ,  C23C18/163 ,  C23C18/1641 ,  C23C18/1646 ,  C23C18/1653 ,  C23C18/2066 ,  C23C18/30 ,  C23C18/38 ,  C23C18/405 ,  H05K3/381 ,  Y10T428/24802 ,  Y10T428/24826 ,  Y10T428/2962 ,  Y10T428/31786

Abstract: According to various aspects, exemplary embodiments are disclosed of selectively metal-plated rolls of materials, rolls of materials configured for selective metal plating, and methods for selectively plating rolls of materials. In an exemplary embodiment, a roll of material includes a substrate. An insulating ink is on the substrate. A catalyst coating is on the substrate whereat the insulating ink is not present. The catalyst coating may be configured to provide the substrate with one or more catalytic surfaces suitable for electroless deposition of metal. Accordingly, metal plating may be electrolessly deposited on the catalyst coating without over-plating the insulating ink.