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    Packaging for an interferometric modulator
    2.
    发明申请
    Packaging for an interferometric modulator 有权
    用于干涉式调制器的包装

    公开(公告)号：US20050254115A1

    公开(公告)日：2005-11-17

    申请号：US10844819

    申请日：2004-05-12

    申请人： Lauren Palmateer ,  Brian Gally ,  William Cummings ,  Manish Kothari ,  Clarence Chui

    发明人： Lauren Palmateer ,  Brian Gally ,  William Cummings ,  Manish Kothari ,  Clarence Chui

    IPC分类号： G02B26/00 ,  G02F1/01 ,  G01B9/021

    CPC分类号： G02B26/001

    摘要： A package is made of a transparent substrate having an interferometric modulator and a back plate. A non-hermetic seal joins the back plate to the substrate to form a package, and a desiccant resides inside the package. A method of packaging an interferometric modulator includes providing a transparent substrate and manufacturing an interferometric modulator array on a backside of the substrate. A back plate is provided and a desiccant is applied to the back plate. The back plate is sealed to the backside of the substrate with a back seal in ambient conditions, thereby forming a package

    摘要翻译： 封装由具有干涉式调制器和背板的透明基板制成。 非气密密封件将背板连接到基板以形成包装，并且干燥剂驻留在包装内。 封装干涉式调制器的方法包括提供透明衬底并在衬底的背面制造干涉式调制器阵列。 设置背板，并将干燥剂施加到背板上。 背板在环境条件下用背密封件密封到基板的背面，由此形成封装

    Method and system for packaging MEMS devices with incorporated getter
    3.
    发明申请
    Method and system for packaging MEMS devices with incorporated getter 审中-公开
    封装带有吸气剂的MEMS器件的方法和系统

    公开(公告)号：US20060076634A1

    公开(公告)日：2006-04-13

    申请号：US11102554

    申请日：2005-04-08

    申请人： Lauren Palmateer ,  William Cummings ,  Brian Gally ,  Clarence Chui ,  Manish Kothari

    发明人： Lauren Palmateer ,  William Cummings ,  Brian Gally ,  Clarence Chui ,  Manish Kothari

    IPC分类号： H01L21/00 ,  H01L29/84

    CPC分类号： B81B7/0038 ,  B81C2203/019 ,  G02B26/001

    摘要： Methods and systems for packaging MEMS devices such as interferometric modulator arrays are disclosed. One embodiment of a MEMS device package structure includes a seal with a chemically reactant getter. Another embodiment of a MEMS device package comprises a primary seal with a getter, and a secondary seal proximate an outer periphery of the primary seal. Yet another embodiment of a MEMS device package comprises a getter positioned inside the MEMS device package and proximate an inner periphery of the package seal.

    摘要翻译： 公开了用于封装诸如干涉式调制器阵列之类的MEMS装置的方法和系统。 MEMS器件封装结构的一个实施例包括具有化学反应物吸气剂的密封。 MEMS器件封装的另一实施例包括具有吸气剂的主密封件和靠近主密封件的外周边的次级密封件。 MEMS器件封装的另一个实施例包括位于MEMS器件封装内部并且靠近封装密封件的内周边的吸气剂。

    Method and system for packaging a display
    5.
    发明申请
    Method and system for packaging a display 有权
    用于包装显示器的方法和系统

    公开(公告)号：US20060076637A1

    公开(公告)日：2006-04-13

    申请号：US11150496

    申请日：2005-06-10

    申请人： Brian Gally ,  William Cummings ,  Lauren Palmateer ,  Philip Floyd ,  Clarence Chui

    发明人： Brian Gally ,  William Cummings ,  Lauren Palmateer ,  Philip Floyd ,  Clarence Chui

    IPC分类号： H01L23/20 ,  H01L21/00

    CPC分类号： B81B7/0067 ,  B81B2201/045 ,  B81C2203/0109 ,  B81C2203/0145 ,  B81C2203/019 ,  G02B26/001

    摘要： A package structure and method of packaging for an interferometric modulator. A transparent substrate having an interferometric modulator formed thereon is provided. A backplane is joined to the transparent substrate with a seal where the interferometric modulator is exposed to the surrounding environment through an opening in either the backplane or the seal. The opening is sealed after the transparent substrate and backplane are joined and after any desired desiccant, release material, and/or self-aligning monolayer is introduced into the package structure.

    摘要翻译： 用于干涉式调制器的封装结构和封装方法。 提供了其上形成有干涉式调制器的透明基板。 背板通过密封件连接到透明基板上，其中干涉式调制器通过背板或密封件中的开口暴露于周围环境。 在透明基板和背板接合之后，并且在任何期望的干燥剂，剥离材料和/或自对准单层被引入到包装结构中之后，将开口密封。

    Packaging for an interferometric modulator
    6.
    发明申请
    Packaging for an interferometric modulator 有权
    用于干涉式调制器的包装

    公开(公告)号：US20070170568A1

    公开(公告)日：2007-07-26

    申请号：US11653088

    申请日：2007-01-12

    申请人： Lauren Palmateer ,  Brian Gally ,  William Cummings ,  Manish Kothari ,  Clarence Chui

    发明人： Lauren Palmateer ,  Brian Gally ,  William Cummings ,  Manish Kothari ,  Clarence Chui

    IPC分类号： H01L23/02

    CPC分类号： G02B26/001

    摘要： A package is made of a transparent substrate having an interferometric modulator and a back plate. A non-hermetic seal joins the back plate to the substrate to form a package, and a desiccant resides inside the package. A method of packaging an interferometric modulator includes providing a transparent substrate and manufacturing an interferometric modulator array on a backside of the substrate. A back plate is provided and a desiccant is applied to the back plate. The back plate is sealed to the backside of the substrate with a back seal in ambient conditions, thereby forming a package.

    摘要翻译： 封装由具有干涉式调制器和背板的透明基板制成。 非气密密封件将背板连接到基板以形成包装，并且干燥剂驻留在包装内。 封装干涉式调制器的方法包括提供透明衬底并在衬底的背面制造干涉式调制器阵列。 设置背板，并将干燥剂施加到背板上。 背板在环境条件下用背密封件密封到基板的背面，由此形成封装。

    METHOD AND SYSTEM FOR PACKAGING MEMS DEVICES WITH INCORPORATED GETTER
    7.
    发明申请
    METHOD AND SYSTEM FOR PACKAGING MEMS DEVICES WITH INCORPORATED GETTER 审中-公开
    用于包装具有并发卡特的MEMS器件的方法和系统

    公开(公告)号：US20110290552A1

    公开(公告)日：2011-12-01

    申请号：US13208218

    申请日：2011-08-11

    申请人： Lauren Palmateer ,  William J. Cummings ,  Brian Gally ,  Clarence Chui ,  Manish Kothari

    发明人： Lauren Palmateer ,  William J. Cummings ,  Brian Gally ,  Clarence Chui ,  Manish Kothari

    IPC分类号： H01L23/28 ,  B29C65/54

    CPC分类号： B81B7/0038 ,  B81C2203/019 ,  G02B26/001

    摘要： Methods and systems for packaging MEMS devices such as interferometric modulator arrays are disclosed. One embodiment of a MEMS device package structure includes a seal with a chemically reactant getter. Another embodiment of a MEMS device package comprises a primary seal with a getter, and a secondary seal proximate an outer periphery of the primary seal. Yet another embodiment of a MEMS device package comprises a getter positioned inside the MEMS device package and proximate an inner periphery of the package seal.

    摘要翻译： 公开了用于封装诸如干涉式调制器阵列之类的MEMS装置的方法和系统。 MEMS器件封装结构的一个实施例包括具有化学反应物吸气剂的密封。 MEMS器件封装的另一实施例包括具有吸气剂的主密封件和靠近主密封件的外周边的次级密封件。 MEMS器件封装的另一个实施例包括位于MEMS器件封装内部并且靠近封装密封件的内周边的吸气剂。

    METHOD AND SYSTEM FOR PACKAGING MEMS DEVICES WITH INCORPORATED GETTER
    8.
    发明申请
    METHOD AND SYSTEM FOR PACKAGING MEMS DEVICES WITH INCORPORATED GETTER 有权
    用于包装具有并发卡特的MEMS器件的方法和系统

    公开(公告)号：US20090189230A1

    公开(公告)日：2009-07-30

    申请号：US12415986

    申请日：2009-03-31

    申请人： Lauren Palmateer ,  William J. Cummings ,  Brian Gally ,  Clarence Chui ,  Manish Kothari

    发明人： Lauren Palmateer ,  William J. Cummings ,  Brian Gally ,  Clarence Chui ,  Manish Kothari

    IPC分类号： H01L23/31 ,  H01L29/84 ,  H01L21/56

    CPC分类号： B81B7/0038 ,  B81C2203/019 ,  G02B26/001

    摘要： Methods and systems for packaging MEMS devices such as interferometric modulator arrays are disclosed. One embodiment of a MEMS device package structure includes a seal with a chemically reactant getter. Another embodiment of a MEMS device package comprises a primary seal with a getter, and a secondary seal proximate an outer periphery of the primary seal. Yet another embodiment of a MEMS device package comprises a getter positioned inside the MEMS device package and proximate an inner periphery of the package seal.

    摘要翻译： 公开了用于封装诸如干涉式调制器阵列之类的MEMS装置的方法和系统。 MEMS器件封装结构的一个实施例包括具有化学反应物吸气剂的密封。 MEMS器件封装的另一实施例包括具有吸气剂的主密封件和靠近主密封件的外周边的次级密封件。 MEMS器件封装的另一个实施例包括位于MEMS器件封装内部并且靠近封装密封件的内周边的吸气剂。