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公开(公告)号：US20110149636A1
公开(公告)日：2011-06-23
申请号：US12803810
申请日：2010-07-06
CPC分类号： G11C13/0007 , G11C2213/31 , G11C2213/32 , H01L27/2409 , H01L27/2418 , H01L27/2472 , H01L27/2481 , H01L45/08 , H01L45/12 , H01L45/1233 , H01L45/146 , H01L45/147
摘要： An ion barrier layer made from a dielectric material in contact with an electronically insulating layer is operative to prevent mobile ions transported into the electronically insulating layer from passing through the ion barrier layer and into adjacent layers during data operations on a non-volatile memory cell. A conductive oxide layer in contact with the electronically insulating layer is the source of the mobile ions. A programming data operation is operative to transport a portion of the mobile ions into the electronically insulating layer and an erase data operation is operative to transport the mobile ions back into the conductive oxide layer. When the portion is positioned in the electronically insulating layer the memory cell stores data as a programmed conductivity profile and when a substantial majority of the mobile ions are positioned in the conductive oxide layer the memory cell stores data as an erased conductivity profile.
摘要翻译： 由与电绝缘层接触的介电材料制成的离子阻挡层可操作以防止在对非易失性存储单元的数据操作期间传输到电绝缘层中的移动离子通过离子阻挡层并进入相邻层。 与电绝缘层接触的导电氧化物层是可移动离子的源。 编程数据操作用于将一部分移动离子传输到电绝缘层中，并且擦除数据操作可操作以将移动离子传输回到导电氧化物层中。 当该部分位于电绝缘层中时，存储单元将数据存储为编程电导率分布，并且当大部分移动离子位于导电氧化物层中时，存储单元将数据存储为擦除的电导率分布。
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2.发明授权Conductive metal oxide structures in non volatile re writable memory devices 有权非易失性可重写存储器件中的导电金属氧化物结构公开(公告)号：US08565006B2
公开(公告)日：2013-10-22
申请号：US13719106
申请日：2012-12-18
IPC分类号： G11C13/00
CPC分类号： H01L45/085 , G11C11/5685 , G11C13/0007 , G11C13/003 , G11C2013/0073 , G11C2213/56 , G11C2213/71 , G11C2213/72 , G11C2213/74 , G11C2213/76
摘要： A memory cell including a memory element comprising an electrolytic insulator in contact with a conductive metal oxide (CMO) is disclosed. The CMO includes a crystalline structure and can comprise a pyrochlore oxide, a conductive binary oxide, a multiple B-site perovskite, and a Ruddlesden-Popper structure. The CMO includes mobile ions that can be transported to/from the electrolytic insulator in response to an electric field of appropriate magnitude and direction generated by a write voltage applied across the electrolytic insulator and CMO. The memory cell can include a non-ohmic device (NOD) that is electrically in series with the memory element. The memory cell can be positioned between a cross-point of conductive array lines in a two-terminal cross-point memory array in a single layer of memory or multiple vertically stacked layers of memory that are fabricated over a substrate that includes active circuitry for data operations on the array layer(s).
摘要翻译： 公开了包括与导电金属氧化物（CMO）接触的电解绝缘体的存储元件的存储单元。 CMO包括晶体结构并且可以包含烧绿石氧化物，导电二元氧化物，多个B位钙钛矿和Ruddlesden-Popper结构。 CMO包括可以响应于施加在电解绝缘体和CMO上施加的写入电压产生的适当幅度和方向的电场，可以将其输送到电解绝缘体/从电解绝缘体传输的移动离子。 存储器单元可以包括与存储元件电串联的非欧姆器件（NOD）。 存储器单元可以位于单层存储器中的两端交叉点存储器阵列中的导电阵列线的交叉点或多个垂直堆叠的存储器层之间，该衬底层在衬底上制造，该衬底包括用于数据的有源电路 对数组层进行操作。
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3.发明授权Conductive metal oxide structures in non volatile re writable memory devices 有权非易失性可重写存储器件中的导电金属氧化物结构公开(公告)号：US08320161B2
公开(公告)日：2012-11-27
申请号：US13252932
申请日：2011-10-04
IPC分类号： G11C11/21
CPC分类号： H01L45/085 , G11C11/5685 , G11C13/0007 , G11C13/003 , G11C2013/0073 , G11C2213/56 , G11C2213/71 , G11C2213/72 , G11C2213/74 , G11C2213/76
摘要： A memory cell including a memory element comprising an electrolytic insulator in contact with a conductive metal oxide (CMO) is disclosed. The CMO includes a crystalline structure and can comprise a pyrochlore oxide, a conductive binary oxide, a multiple B-site perovskite, and a Ruddlesden-Popper structure. The CMO includes mobile ions that can be transported to/from the electrolytic insulator in response to an electric field of appropriate magnitude and direction generated by a write voltage applied across the electrolytic insulator and CMO. The memory cell can include a non-ohmic device (NOD) that is electrically in series with the memory element. The memory cell can be positioned between a cross-point of conductive array lines in a two-terminal cross-point memory array in a single layer of memory or multiple vertically stacked layers of memory that are fabricated over a substrate that includes active circuitry for data operations on the array layer(s).
摘要翻译： 公开了包括与导电金属氧化物（CMO）接触的电解绝缘体的存储元件的存储单元。 CMO包括晶体结构并且可以包含烧绿石氧化物，导电二元氧化物，多个B位钙钛矿和Ruddlesden-Popper结构。 CMO包括可以响应于施加在电解绝缘体和CMO上施加的写入电压产生的适当幅度和方向的电场，可以将其输送到电解绝缘体/从电解绝缘体传输的移动离子。 存储器单元可以包括与存储元件电串联的非欧姆器件（NOD）。 存储器单元可以位于单层存储器中的两端交叉点存储器阵列中的导电阵列线的交叉点或多个垂直堆叠的存储器层之间，该衬底层在衬底上制造，该衬底包括用于数据的有源电路 对数组层进行操作。
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公开(公告)号：US08045364B2
公开(公告)日：2011-10-25
申请号：US12653838
申请日：2009-12-18
IPC分类号： G11C11/00
CPC分类号： G11C13/0007 , G11C2213/31 , G11C2213/32 , H01L27/2409 , H01L27/2418 , H01L27/2472 , H01L27/2481 , H01L45/08 , H01L45/12 , H01L45/1233 , H01L45/146 , H01L45/147
摘要： An ion barrier layer made from a dielectric material in contact with an electronically insulating layer is operative to prevent mobile ions transported into the electronically insulating layer from passing through the ion barrier layer and into adjacent layers during data operations on a non-volatile memory cell. A conductive oxide layer in contact with the electronically insulating layer is the source of the mobile ions. A programming data operation is operative to transport a portion of the mobile ions into the electronically insulating layer and an erase data operation is operative to transport the mobile ions back into the conductive oxide layer. When the portion is positioned in the electronically insulating layer the memory cell stores data as a programmed conductivity profile and when a substantial majority of the mobile ions are positioned in the conductive oxide layer the memory cell stores data as an erased conductivity profile.
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公开(公告)号：US08031510B2
公开(公告)日：2011-10-04
申请号：US12803810
申请日：2010-07-06
IPC分类号： G11C11/00
CPC分类号： G11C13/0007 , G11C2213/31 , G11C2213/32 , H01L27/2409 , H01L27/2418 , H01L27/2472 , H01L27/2481 , H01L45/08 , H01L45/12 , H01L45/1233 , H01L45/146 , H01L45/147
摘要： An ion barrier layer made from a dielectric material in contact with an electronically insulating layer is operative to prevent mobile ions transported into the electronically insulating layer from passing through the ion barrier layer and into adjacent layers during data operations on a non-volatile memory cell. A conductive oxide layer in contact with the electronically insulating layer is the source of the mobile ions. A programming data operation is operative to transport a portion of the mobile ions into the electronically insulating layer and an erase data operation is operative to transport the mobile ions back into the conductive oxide layer. When the portion is positioned in the electronically insulating layer the memory cell stores data as a programmed conductivity profile and when a substantial majority of the mobile ions are positioned in the conductive oxide layer the memory cell stores data as an erased conductivity profile.
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公开(公告)号：US20110149634A1
公开(公告)日：2011-06-23
申请号：US12653838
申请日：2009-12-18
CPC分类号： G11C13/0007 , G11C2213/31 , G11C2213/32 , H01L27/2409 , H01L27/2418 , H01L27/2472 , H01L27/2481 , H01L45/08 , H01L45/12 , H01L45/1233 , H01L45/146 , H01L45/147
摘要： An ion barrier layer made from a dielectric material in contact with an electronically insulating layer is operative to prevent mobile ions transported into the electronically insulating layer from passing through the ion barrier layer and into adjacent layers during data operations on a non-volatile memory cell. A conductive oxide layer in contact with the electronically insulating layer is the source of the mobile ions. A programming data operation is operative to transport a portion of the mobile ions into the electronically insulating layer and an erase data operation is operative to transport the mobile ions back into the conductive oxide layer. When the portion is positioned in the electronically insulating layer the memory cell stores data as a programmed conductivity profile and when a substantial majority of the mobile ions are positioned in the conductive oxide layer the memory cell stores data as an erased conductivity profile.
摘要翻译： 由与电绝缘层接触的介电材料制成的离子阻挡层可操作以防止在对非易失性存储单元的数据操作期间传输到电绝缘层中的移动离子通过离子阻挡层并进入相邻层。 与电绝缘层接触的导电氧化物层是可移动离子的源。 编程数据操作用于将一部分移动离子传输到电绝缘层中，并且擦除数据操作可操作以将移动离子传输回到导电氧化物层中。 当该部分位于电绝缘层中时，存储单元将数据存储为编程电导率分布，并且当大部分移动离子位于导电氧化物层中时，存储单元将数据存储为擦除的电导率分布。
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公开(公告)号：US20120300535A1
公开(公告)日：2012-11-29
申请号：US13570871
申请日：2012-08-09
CPC分类号： G11C13/0007 , G11C2213/31 , G11C2213/32 , H01L27/2409 , H01L27/2418 , H01L27/2472 , H01L27/2481 , H01L45/08 , H01L45/12 , H01L45/1233 , H01L45/146 , H01L45/147
摘要： An ion barrier layer made from a dielectric material in contact with an electronically insulating layer is operative to prevent mobile ions transported into the electronically insulating layer from passing through the ion barrier layer and into adjacent layers during data operations on a non-volatile memory cell. A conductive oxide layer in contact with the electronically insulating layer is the source of the mobile ions. A programming data operation is operative to transport a portion of the mobile ions into the electronically insulating layer and an erase data operation is operative to transport the mobile ions back into the conductive oxide layer. When the portion is positioned in the electronically insulating layer the memory cell stores data as a programmed conductivity profile and when a substantial majority of the mobile ions are positioned in the conductive oxide layer the memory cell stores data as an erased conductivity profile.
摘要翻译： 由与电绝缘层接触的介电材料制成的离子阻挡层可操作以防止在对非易失性存储单元的数据操作期间传输到电绝缘层中的移动离子通过离子阻挡层并进入相邻层。 与电绝缘层接触的导电氧化物层是可移动离子的源。 编程数据操作用于将一部分移动离子传输到电绝缘层中，并且擦除数据操作可操作以将移动离子传输回到导电氧化物层中。 当该部分位于电绝缘层中时，存储单元将数据存储为编程电导率分布，并且当大部分移动离子位于导电氧化物层中时，存储单元将数据存储为擦除的电导率分布。
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8.发明授权Conductive metal oxide structures in non-volatile re-writable memory devices 有权非易失性可重写存储器件中的导电金属氧化物结构公开(公告)号：US08031509B2
公开(公告)日：2011-10-04
申请号：US12653836
申请日：2009-12-18
IPC分类号： G11C11/00
CPC分类号： H01L45/085 , G11C11/5685 , G11C13/0007 , G11C13/003 , G11C2013/0073 , G11C2213/56 , G11C2213/71 , G11C2213/72 , G11C2213/74 , G11C2213/76
摘要： A memory cell including a memory element comprising an electrolytic insulator in contact with a conductive metal oxide (CMO) is disclosed. The CMO includes a crystalline structure and can comprise a pyrochlore oxide, a conductive binary oxide, a multiple B-site perovskite, and a Ruddlesden-Popper structure. The CMO includes mobile ions that can be transported to/from the electrolytic insulator in response to an electric field of appropriate magnitude and direction generated by a write voltage applied across the electrolytic insulator and CMO. The memory cell can include a non-ohmic device (NOD) that is electrically in series with the memory element. The memory cell can be positioned between a cross-point of conductive array lines in a two-terminal cross-point memory array in a single layer of memory or multiple vertically stacked layers of memory that are fabricated over a substrate that includes active circuitry for data operations on the array layer(s).
摘要翻译： 公开了包括与导电金属氧化物（CMO）接触的电解绝缘体的存储元件的存储单元。 CMO包括晶体结构并且可以包含烧绿石氧化物，导电二元氧化物，多个B位钙钛矿和Ruddlesden-Popper结构。 CMO包括可以响应于施加在电解绝缘体和CMO上施加的写入电压产生的适当幅度和方向的电场，可以将其输送到电解绝缘体/从电解绝缘体传输的移动离子。 存储器单元可以包括与存储元件电串联的非欧姆器件（NOD）。 存储器单元可以位于单层存储器中的两端交叉点存储器阵列中的导电阵列线的交叉点或多个垂直堆叠的存储器层之间，该衬底层在衬底上制造，该衬底包括用于数据的有源电路 对数组层进行操作。
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9.发明申请Conductive metal oxide structures in non-volatile re-writable memory devices 有权非易失性可重写存储器件中的导电金属氧化物结构公开(公告)号：US20100157658A1
公开(公告)日：2010-06-24
申请号：US12653836
申请日：2009-12-18
IPC分类号： G11C11/56
CPC分类号： H01L45/085 , G11C11/5685 , G11C13/0007 , G11C13/003 , G11C2013/0073 , G11C2213/56 , G11C2213/71 , G11C2213/72 , G11C2213/74 , G11C2213/76
摘要： A memory cell including a memory element comprising an electrolytic insulator in contact with a conductive metal oxide (CMO) is disclosed. The CMO includes a crystalline structure and can comprise a pyrochlore oxide, a conductive binary oxide, a multiple B-site perovskite, and a Ruddlesden-Popper structure. The CMO includes mobile ions that can be transported to/from the electrolytic insulator in response to an electric field of appropriate magnitude and direction generated by a write voltage applied across the electrolytic insulator and CMO. The memory cell can include a non-ohmic device (NOD) that is electrically in series with the memory element. The memory cell can be positioned between a cross-point of conductive array lines in a two-terminal cross-point memory array in a single layer of memory or multiple vertically stacked layers of memory that are fabricated over a substrate that includes active circuitry for data operations on the array layer(s).
摘要翻译： 公开了包括与导电金属氧化物（CMO）接触的电解绝缘体的存储元件的存储单元。 CMO包括晶体结构并且可以包含烧绿石氧化物，导电二元氧化物，多个B位钙钛矿和Ruddlesden-Popper结构。 CMO包括可以响应于施加在电解绝缘体和CMO上施加的写入电压产生的适当幅度和方向的电场，可以将其输送到电解绝缘体/从电解绝缘体传输的移动离子。 存储器单元可以包括与存储元件电串联的非欧姆器件（NOD）。 存储器单元可以位于单层存储器中的两端交叉点存储器阵列中的导电阵列线的交叉点或多个垂直堆叠的存储器层之间，该衬底层在衬底上制造，该衬底包括用于数据的有源电路 对数组层进行操作。
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10.发明申请CONDUCTIVE METAL OXIDE STRUCTURES IN NON VOLATILE RE WRITABLE MEMORY DEVICES 有权非易失性可写存储器件中的导电金属氧化物结构公开(公告)号：US20130214233A1
公开(公告)日：2013-08-22
申请号：US13719106
申请日：2012-12-18
IPC分类号： H01L45/00
CPC分类号： H01L45/085 , G11C11/5685 , G11C13/0007 , G11C13/003 , G11C2013/0073 , G11C2213/56 , G11C2213/71 , G11C2213/72 , G11C2213/74 , G11C2213/76
摘要： A memory cell including a memory element comprising an electrolytic insulator in contact with a conductive metal oxide (CMO) is disclosed. The CMO includes a crystalline structure and can comprise a pyrochlore oxide, a conductive binary oxide, a multiple B-site perovskite, and a Ruddlesden-Popper structure. The CMO includes mobile ions that can be transported to/from the electrolytic insulator in response to an electric field of appropriate magnitude and direction generated by a write voltage applied across the electrolytic insulator and CMO. The memory cell can include a non-ohmic device (NOD) that is electrically in series with the memory element. The memory cell can be positioned between a cross-point of conductive array lines in a two-terminal cross-point memory array in a single layer of memory or multiple vertically stacked layers of memory that are fabricated over a substrate that includes active circuitry for data operations on the array layer(s).
摘要翻译： 公开了包括与导电金属氧化物（CMO）接触的电解绝缘体的存储元件的存储单元。 CMO包括晶体结构并且可以包含烧绿石氧化物，导电二元氧化物，多个B位钙钛矿和Ruddlesden-Popper结构。 CMO包括可以响应于施加在电解绝缘体和CMO上施加的写入电压产生的适当幅度和方向的电场，可以将其输送到电解绝缘体/从电解绝缘体传输的移动离子。 存储器单元可以包括与存储元件电串联的非欧姆器件（NOD）。 存储器单元可以位于单层存储器中的两端交叉点存储器阵列中的导电阵列线的交叉点或多个垂直堆叠的存储器层之间，该衬底层在衬底上制造，该衬底包括用于数据的有源电路 对数组层进行操作。
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